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M24C16-RDS6TG

STMicroelectronics

M24C16-RDS6TG by STMicroelectronics

M24C16-RDS6TG from STMicroelectronics is a 2Kx8 EEPROM with I2C interface, ideal for industrial applications. It operates at a supply voltage of 1.8-5.5V and features a max temp of 85 °C, ensuring reliability in harsh environments. With 1M write/erase cycles, it's perfect for data storage needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,464 parts In-Stock

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4,464

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Digiode

USA . 4,188 parts In-Stock

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4,188

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Anansix

USA . 942 parts In-Stock

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942

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Cyclops Electronics Ltd

UK . 638 parts In-Stock

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638

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Semi Source

USA . 124 parts In-Stock

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124

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,148 parts In-Stock

1+ parts

$3.355

100+ parts

-

1k+ parts

$3.020

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1,148

$3.355

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$3.020

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Microchip USA

USA . 333 parts In-Stock

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$5.184

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333

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MKK Technologies

India . 1,178 parts In-Stock

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$6.309

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1,178

$6.309

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DigiPath Technology Company

USA . 1,178 parts In-Stock

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$6.309

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1,178

$6.309

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AZTECH Wire

Italy . 272 parts In-Stock

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$18.730

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272

$18.730

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Corphita

USA . 1,725 parts In-Stock

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1,725

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Kepictronics

USA . 638 parts In-Stock

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638

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Parana Technologies

USA . 234 parts In-Stock

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$4.012

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234

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$4.012

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Overview

Unlock a world of reliability and performance with the M24C16-RDS6TG EEPROM from STMicroelectronics. Crafted with precision, this high-quality memory solution excels in diverse applications, from automotive to industrial control systems. Enjoy seamless integration thanks to its compact design and robust features, ensuring data integrity under extreme conditions. Choose STMicroelectronics for cutting-edge technology that empowers your innovations with unparalleled durability and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight packaging ensures the product can withstand various environmental conditions.

Surface Mount: YES

Facilitates easy integration onto printed circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square form factor allows for compact placement on PCBs, optimizing layout efficiency.

Operating Mode: SYNCHRONOUS

Supports faster data transfer and improved performance compared to asynchronous operation.

Nominal Supply Voltage / Vsup: 2.5 V

Low voltage operation enhances energy efficiency and makes it ideal for battery-powered devices.

Power Supplies (V): 2/5

Flexible supply voltage range allows versatility in diverse application environments.

No. of Terminals: 8

Allows for a compact design while maintaining sufficient I/O capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables high-density mounting, suitable for modern compact electronic devices.

Maximum Operating Temperature: 85 °C

Reliable performance in high-temperature environments, enhancing durability in industrial applications.

Organization: 2KX8

Provides structured memory organization, optimizing data management and access times.

Minimum Operating Temperature: -40 °C

Supports extreme environments, making it suitable for outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish ensures reliability and enhances solderability, ensuring long-term performance.

I2C Control Byte: 1010MMMR

Standard I2C control protocol simplifies communication with microcontrollers and other devices.

Terminal Position: DUAL

Optimizes space on the PCB while allowing for easier surface mounting installation.

Write Protection: HARDWARE

Provides an additional layer of data integrity protection against accidental writes.

Maximum Seated Height: 1.1 mm

Ultra-low profile design encourages placement in height-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

Supports moderate-speed applications, ensuring efficient operation without excessive power consumption.

Width: 3 mm

Compact width contributes to a small overall footprint, advantageous for space-limited designs.

Minimum Supply Voltage (Vsup): 1.8 V

Enables broader compatibility with various power sources, enhancing design flexibility.

Length: 3 mm

Small length assists in space optimization, critical for miniaturized electronic designs.

Temperature Grade: INDUSTRIAL

Designed for rigorous industrial applications, ensuring reliability in demanding environments.

Technology: CMOS

CMOS technology facilitates low power consumption and high-speed operation, suitable for modern applications.

Parallel or Serial: SERIAL

Serial interface reduces pin count and complexity, advantageous for modern integrated circuit designs.

Terminal Form: GULL WING

Gull-wing terminals improve soldering quality and reliability, making assembly easier.

Maximum Supply Current: 0.8 mA

Low supply current enhances energy efficiency, critical for battery-operated devices.

No. of Words: 2048 words

Provides ample memory capacity for a variety of data storage applications.

Memory Width: 8

8-bit wide memory enables efficient data handling, making it suitable for diverse applications.

Minimum Data Retention Time: 40 years

Long data retention ensures reliability for applications where stored information is crucial.

Terminal Pitch: 0.65 mm

Suitable pitch for modern electronic assemblies, enables efficient space utilization.

No. of Words Code: 2K

Provides a good balance of capacity and performance for memory-intensive applications.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in supply voltage accommodates a wide range of system designs.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating ensures durability and longevity of the memory, critical for frequent data updates.

Serial Bus Type: I2C

Standard I2C interface simplifies integration with various microcontrollers and other devices.

Maximum Write Cycle Time (tWC): 10 ms

Relatively fast write cycle time enhances the responsiveness of applications that require frequent updates.

Memory Density: 16384 bit

High memory density provides significant data storage capability in a compact form factor.

Memory IC Type: EEPROM

Electrically Erasable Programmable Read-Only Memory is ideal for applications requiring non-volatile data storage.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current enhances battery life for portable and remote applications.

Technical Specifications

EEPROM M24C16-RDS6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24C16-RDS6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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