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M24C08-FMB5TG

STMicroelectronics

M24C08-FMB5TG by STMicroelectronics

M24C08-FMB5TG from STMicroelectronics is a 1Kx8 EEPROM with I2C interface, ideal for low-power applications. It operates at 1.8-5V, supports up to 1M write/erase cycles, and features a compact SOIC package. Its max temp is 85 °C, making it suitable for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,447 parts In-Stock

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4,447

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Anansix

USA . 2,757 parts In-Stock

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2,757

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Digiode

USA . 2,054 parts In-Stock

1+ parts

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2,054

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 340 parts In-Stock

1+ parts

$2.421

100+ parts

-

1k+ parts

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340

$2.421

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IDEA Electronic Components Group

UK . 1,296 parts In-Stock

1+ parts

$4.314

100+ parts

-

1k+ parts

$3.882

10k+ parts

-

1,296

$4.314

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$3.882

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MKK Technologies

India . 119 parts In-Stock

1+ parts

$8.112

100+ parts

-

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119

$8.112

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DigiPath Technology Company

USA . 119 parts In-Stock

1+ parts

$8.112

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119

$8.112

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AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$19.950

100+ parts

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637

$19.950

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Component Stockers USA

USA . 572 parts In-Stock

1+ parts

$99.990

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572

$99.990

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 3,330 parts In-Stock

1+ parts

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3,330

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Parana Technologies

USA . 599 parts In-Stock

1+ parts

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100+ parts

$5.158

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599

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$5.158

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Overview

Unlock unparalleled reliability and performance with the M24C08-FMB5TG EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact device ensures robust data retention and fast access, making it ideal for automotive, industrial, and consumer applications. Enjoy seamless integration with its synchronous operation and enhanced durability. Choose the M24C08-FMB5TG to elevate your projects with quality you can trust and efficiency that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for compact integration into various circuit boards, saving space and improving design flexibility.

Package Shape: RECTANGULAR

The rectangular shape simplifies PCB layout and provides efficient space utilization.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speed and efficiency, making this EEPROM optimal for high-performance applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard in many applications, ensuring compatibility with common systems.

Power Supplies (V): 1.8/5

Support for dual voltage supplies (1.8V and 5V) offers versatility for various design requirements.

No. of Terminals: 8

With 8 terminals, this EEPROM efficiently connects to other circuit components without unnecessary complexity.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The compact style allows for dense circuit board layouts, ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in various environments, making it suitable for industrial applications.

Organization: 1KX8

The organization of 1Kx8 allows for efficient data storage and retrieval, optimizing memory usage.

Minimum Operating Temperature: -20 °C

This wide temperature range ensures functionality in low-temperature environments, broadening application possibilities.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Gold plating enhances conductivity and improves the longevity of connections, ensuring reliability over time.

I2C Control Byte: 1010DMMR

I2C control allows for easy and efficient communication with microcontrollers and simplifies design.

Terminal Position: DUAL

Dual terminal positions provide design flexibility and ease of integration into existing circuits.

Write Protection: HARDWARE

Hardware write protection enhances data integrity by preventing accidental modification during operation.

Maximum Seated Height: 0.6 mm

A low profile of 0.6 mm contributes to reduced space requirements in compact electronic designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

High clock frequency allows for faster data transfer rates, improving overall system performance.

Width: 2 mm

A width of 2 mm allows for integration into compact electronics without hindering design.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage enables operation in battery-operated devices, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30s ensures compatibility with standard soldering processes, facilitating manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for compatibility with modern soldering techniques, ensuring reliability.

Length: 3 mm

The compact length of 3 mm supports the creation of miniaturized electronic devices.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it an efficient choice for operations.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and reduces pin count, beneficial for complex circuit designs.

Terminal Form: NO LEAD

No lead terminal design minimizes the risk of damage and improves reliability.

Maximum Supply Current: 0.8 mA

Low maximum supply current enhances energy efficiency, making this EEPROM suitable for low-power applications.

No. of Words: 1024 words

With 1024 words of memory, this EEPROM provides ample storage for various applications.

Memory Width: 8

An 8-bit memory width enhances efficiency in data handling, optimizing performance in systems.

Minimum Data Retention Time: 40

With a minimum data retention time of 40 years, this EEPROM ensures long-term data integrity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for fine-pitch PCB designs, facilitating advanced circuitry.

No. of Words Code: 1K

1K words code indicates a solid memory capacity suitable for various applications, balancing size with functionality.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for higher power applications.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures that the EEPROM can sustain frequent write/erase cycles, ideal for data logging applications.

Serial Bus Type: I2C

I2C bus type simplifies communication with microcontrollers, enhancing ease of use in various electronic designs.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time allows for quick data updates, enhancing system responsiveness.

Memory Density: 8192 bit

An 8192-bit memory density provides a substantial amount of memory in a compact form factor.

Memory IC Type: EEPROM

EEPROM technology is ideal for applications requiring non-volatile memory retention, ensuring data is preserved without power.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current ensures minimal power consumption, extending battery life in portable devices.

Technical Specifications

EEPROM M24C08-FMB5TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C08-FMB5TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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