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M24C04-FDW5TP

STMicroelectronics

M24C04-FDW5TP by STMicroelectronics

M24C04-FDW5TP from STMicroelectronics is a 4096-bit EEPROM with I2C interface, ideal for data storage in compact devices. It operates at a supply voltage of 1.8-5.5V and features a max clock frequency of 400 kHz. With robust endurance of 1M write/erase cycles, it's perfect for applications requiring reliable memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,097 parts In-Stock

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9,097

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Digiode

USA . 1,423 parts In-Stock

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1,423

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Anansix

USA . 1,241 parts In-Stock

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1,241

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 6,670 parts In-Stock

1+ parts

$1.967

100+ parts

-

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6,670

$1.967

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IDEA Electronic Components Group

UK . 375 parts In-Stock

1+ parts

$3.530

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-

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$3.177

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375

$3.530

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$3.177

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Component Stockers USA

USA . 30,010 parts In-Stock

1+ parts

$3.790

100+ parts

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30,010

$3.790

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MKK Technologies

India . 892 parts In-Stock

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$6.638

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892

$6.638

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DigiPath Technology Company

USA . 892 parts In-Stock

1+ parts

$6.638

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892

$6.638

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AZTECH Wire

Italy . 1,096 parts In-Stock

1+ parts

$16.410

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1,096

$16.410

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Parana Technologies

USA . 1,416 parts In-Stock

1+ parts

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$4.221

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1,416

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$4.221

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Corphita

USA . 383 parts In-Stock

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383

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Overview

Unlock the potential of your designs with the M24C04-FDW5TP EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, robust memory device ensures reliable data storage across diverse applications, from consumer electronics to industrial automation. With its impressive endurance and low power consumption, it delivers exceptional performance without compromising quality, giving you peace of mind as you enhance efficiency and elevate your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability and ease of integration in various applications.

Surface Mount: YES

Enables compact design and makes it suitable for high-density PCB layouts.

Package Shape: RECTANGULAR

Optimized for fitting in limited spaces, allowing for efficient use in various device designs.

Operating Mode: SYNCHRONOUS

Ensures efficient data transfer at high speeds, enhancing overall performance.

Nominal Supply Voltage / Vsup: 2.5 V

Ideal for low-power applications, contributing to energy efficiency.

Power Supplies (V): 1.8/5

Versatile power supply options make it adaptable for different electronic systems.

No. of Terminals: 8

Compact enough for small devices while providing sufficient connections for functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Saves space on the PCB while maintaining performance, ideal for modern electronics.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments, ensuring reliability in demanding conditions.

Organization: 512X8

Provides a good balance of capacity and efficiency, making it suitable for embedded applications.

Minimum Operating Temperature: -20 °C

Ensures functionality in colder environments, expanding its application range.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and resistance to corrosion, enhancing long-term reliability.

I2C Control Byte: 1010DDMR

Standardized control byte makes it easy to integrate with other I2C devices.

Terminal Position: DUAL

Facilitates easier mounting and soldering on PCBs, simplifying assembly.

Write Protection: HARDWARE

Ensures data integrity by preventing accidental writes, making it a secure choice.

Maximum Seated Height: 1.2 mm

Low profile design contributes to overall space-saving in the device enclosures.

Maximum Clock Frequency (fCLK): 0.4 MHz

Provides sufficient speed for many applications while maintaining low power consumption.

Width: 3 mm

Compact width allows for placement in narrow spaces on PCBs.

Minimum Supply Voltage (Vsup): 1.7 V

Allows operation in low-voltage applications, enhancing flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

Robust enough to withstand standard soldering processes without damaging the component.

Peak Reflow Temperature °C: 260

Ensures compatibility with standard surface mount soldering techniques.

Length: 4.4 mm

Compact length supports space-efficient designs in small electronic devices.

Technology: CMOS

Offers low power consumption and high speed, making it ideal for portable devices.

Parallel or Serial: SERIAL

Simplifies wiring and reduces PCB complexity compared to parallel interfaces.

Terminal Form: GULL WING

Facilitates reliable soldering and secure mechanical connection.

Maximum Supply Current: 0.8 mA

Low current consumption is ideal for battery-powered applications, extending device life.

No. of Words: 512 words

Provides adequate storage capacity for many applications, including configuration data.

Memory Width: 8

Allows for easy integration and utilization of the EEPROM's data throughout various systems.

Minimum Data Retention Time: 40 years

Long-term data integrity ensures reliability for critical applications over an extended period.

Terminal Pitch: 0.65 mm

Facilitates more compact layouts for modern electronic designs.

No. of Words Code: 512

Standardized configuration allows for easy programming and software integration.

Maximum Supply Voltage (Vsup): 5.5 V

Provides flexibility in power supply options without sacrificing performance.

Endurance: 1,000,000 Write/Erase Cycles

High endurance makes it suitable for applications requiring frequent updates, such as data logging.

Serial Bus Type: I2C

Widely used and well-supported protocol makes integration with controllers straightforward.

Maximum Write Cycle Time (tWC): 5 ms

Fast write times enhance overall system performance and responsiveness.

Memory Density: 4096 bit

Provides sufficient memory density for a variety of applications, optimizing space usage.

Memory IC Type: EEPROM

The EEPROM type is ideal for applications needing non-volatile storage of data.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current ensures minimal power drain in idle states, perfect for battery-based devices.

Technical Specifications

EEPROM M24C04-FDW5TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-FDW5TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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