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M24C02-RDS6G

STMicroelectronics

M24C02-RDS6G by STMicroelectronics

M24C02-RDS6G from STMicroelectronics is a 2048-bit EEPROM with I2C interface, ideal for industrial applications. It operates at a supply voltage of 1.8V to 5.5V and features a max clock frequency of 400 kHz. With a temperature range of -40 °C to 85 °C, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 8,503 parts In-Stock

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Anansix

USA . 2,846 parts In-Stock

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2,846

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Digiode

USA . 2,160 parts In-Stock

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IDEA Electronic Components Group

UK . 559 parts In-Stock

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$2.588

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$2.329

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559

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MKK Technologies

India . 200 parts In-Stock

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$4.866

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200

$4.866

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DigiPath Technology Company

USA . 200 parts In-Stock

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$4.866

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200

$4.866

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Microchip USA

USA . 118 parts In-Stock

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$6.480

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$6.480

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AZTECH Wire

Italy . 621 parts In-Stock

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$12.080

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621

$12.080

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QUARKTWIN TECHNOLOGY LTD

USA . 10,057 parts In-Stock

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Corphita

USA . 2,996 parts In-Stock

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Parana Technologies

USA . 1,309 parts In-Stock

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$3.094

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Overview

Unlock unparalleled performance with the M24C02-RDS6G EEPROM from STMicroelectronics, a leader in innovative technologies. This compact and robust memory solution ensures reliable data retention in extreme temperatures, making it perfect for industrial applications. Experience the advantages of a trusted manufacturer that prioritizes quality, offering exceptional endurance and write protection features that enhance your designs' efficiency and longevity. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, contributing to the longevity of the EEPROM.

Surface Mount: YES

Surface mount capability allows for more compact designs, making the EEPROM suitable for space-sensitive applications.

Package Shape: SQUARE

The square package shape facilitates efficient layout on PCBs, aiding in space optimization and improved manufacturability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V indicates lower power consumption, making it an energy-efficient component.

Power Supplies (V): 2/5

Dual supply voltage options provide flexibility in design and application, accommodating a wide range of devices.

No. of Terminals: 8

Eight terminals provide ample connectivity while maintaining a compact form factor for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline optimize PCB real estate, crucial for modern electronics' miniaturization.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C allows this EEPROM to function reliably in various industrial applications.

Organization: 256X8

The memory organization promotes effective data storage and retrieval capabilities, serving diverse application needs.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM suitable for harsh environments and extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances corrosion resistance and promotes superior electrical connectivity for reliable performance.

I2C Control Byte: 1010DDDR

The I2C control byte specification simplifies communication protocols, ensuring compatibility with various microcontroller systems.

Terminal Position: DUAL

Dual terminal positions enhance the flexibility of the layout on the PCB, accommodating a wider range of design possibilities.

Write Protection: HARDWARE

Hardware write protection offers an additional layer of security, preventing accidental data loss, critical in sensitive applications.

Maximum Seated Height: 1.1 mm

The low seated height allows for further miniaturization in device designs, beneficial for compact electronics.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz enables adequate data throughput for various applications, ensuring performance needs are met.

Width: 3 mm

A width of 3 mm is compatible with a range of devices, promoting ease of integration into existing designs.

Minimum Supply Voltage (Vsup): 1.8 V

Operating at a minimum of 1.8 V allows for flexibility in power supply considerations, accommodating lower voltage systems.

Length: 3 mm

The compact length supports space-efficient designs, making it ideal for modern small electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in rigorous conditions, enhancing durability for critical applications.

Technology: CMOS

CMOS technology provides low power consumption, contributing to the energy efficiency of embedded systems.

Parallel or Serial: SERIAL

Serial communication simplifies connections and minimizes pin count, making it easier to design and implement in various systems.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly processes, ensuring reliability in manufacturing.

Maximum Supply Current: 0.8 mA

A low maximum supply current of 0.8 mA supports energy-efficient applications, extending battery life in portable devices.

No. of Words: 256 words

With a capacity of 256 words, it offers sufficient storage for many applications while remaining cost-effective.

Memory Width: 8

An 8-bit memory width enables efficient data handling compatible with numerous microcontrollers.

Minimum Data Retention Time: 40 years

A data retention time of 40 years ensures long-term reliability and data integrity, essential for critical applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is standard for many devices, enhancing compatibility with existing layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V indicates robustness and compatibility with higher voltage applications.

Endurance: 1,000,000 Write/Erase Cycles

An endurance rating of 1,000,000 cycles ensures the EEPROM can handle extensive use, suitable for applications requiring frequent updates.

Serial Bus Type: I2C

I2C bus compatibility simplifies integration with various microcontrollers and enhances communication efficiency.

Maximum Write Cycle Time (tWC): 10 ms

A 10 ms write cycle time supports quick data updating, beneficial for applications where speed is critical.

Memory Density: 2048 bit

A memory density of 2048 bits offers a balance of storage capacity and space efficiency, ideal for diverse applications.

Memory IC Type: EEPROM

As an EEPROM, this component combines non-volatile storage with electrical erasability, making it suitable for dynamic data storage needs.

Maximum Standby Current: 0.000001 Amp

An ultra-low standby current minimizes power consumption during idle states, contributing to battery life in portable devices.

Technical Specifications

EEPROM M24C02-RDS6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24C02-RDS6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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