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LDP01-28AY

STMicroelectronics

LDP01-28AY by STMicroelectronics

LDP01-28AY by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust protection in electronic circuits. It operates b/w -55 °C and 175 °C, with a breakdown voltage range of 26.7V to 29.5V. Ideal for automotive applications, it meets AEC-Q101 standards.

Median Price

$2.515

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 268 parts In-Stock

1+ parts

$1.370

100+ parts

$1.300

1k+ parts

$1.250

10k+ parts

-

268

$1.370

$1.300

$1.250

-

DigiKey

USA . 5,287 parts In-Stock

1+ parts

$3.660

100+ parts

$1.729

1k+ parts

$1.260

10k+ parts

$1.250

5,287

$3.660

$1.729

$1.260

$1.250

Mouser Electronics

USA . 799 parts In-Stock

1+ parts

$3.660

100+ parts

$1.740

1k+ parts

$1.260

10k+ parts

$1.240

799

$3.660

$1.740

$1.260

$1.240

Newark

USA . 72 parts In-Stock

1+ parts

$4.260

100+ parts

$2.330

1k+ parts

$2.130

10k+ parts

-

72

$4.260

$2.330

$2.130

-

Element14

Singapore . 1,041 parts In-Stock

1+ parts

$232.050

100+ parts

$158.180

1k+ parts

$118.300

10k+ parts

-

1,041

$232.050

$158.180

$118.300

-

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.297

10k+ parts

$1.209

2,000

-

-

$1.297

$1.209

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.192

10k+ parts

-

2,000

-

-

$1.192

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.192

10k+ parts

-

2,000

-

-

$1.192

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 734 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$1.264

-

-

-

Vyrian

USA . 3,907 parts In-Stock

1+ parts

$1.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,907

$1.360

-

-

-

Anansix

USA . 2,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,739

-

-

-

-

ComSIT Distribution GmbH

Germany . 995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

995

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 985 parts In-Stock

1+ parts

$0.030

100+ parts

-

1k+ parts

$0.027

10k+ parts

-

985

$0.030

-

$0.027

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.054

100+ parts

$0.049

1k+ parts

$0.044

10k+ parts

-

270

$0.054

$0.049

$0.044

-

MKK Technologies

India . 923 parts In-Stock

1+ parts

$0.057

100+ parts

-

1k+ parts

-

10k+ parts

-

923

$0.057

-

-

-

DigiPath Technology Company

USA . 923 parts In-Stock

1+ parts

$0.057

100+ parts

-

1k+ parts

-

10k+ parts

-

923

$0.057

-

-

-

Corphita

USA . 78 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$1.197

-

-

-

Component Stockers USA

USA . 14,446 parts In-Stock

1+ parts

$1.780

100+ parts

$1.620

1k+ parts

$1.410

10k+ parts

$1.270

14,446

$1.780

$1.620

$1.410

$1.270

Continental Prestige Electronics

USA . 1,241 parts In-Stock

1+ parts

$1.930

100+ parts

$1.420

1k+ parts

$1.030

10k+ parts

-

1,241

$1.930

$1.420

$1.030

-

Parana Technologies

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

$0.036

1k+ parts

-

10k+ parts

-

2,016

-

$0.036

-

-

Overview

Elevate your designs with the LDP01-28AY from STMicroelectronics, a trusted leader in semiconductor innovation. This robust transient suppression device ensures superior protection against voltage spikes, enhancing reliability across automotive and industrial applications. Crafted with precision and quality, it operates flawlessly in extreme temperatures, adding enduring value to your projects while ensuring compliance with rigorous standards. Choose LDP01-28AY for peace of mind and performance you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, making it suitable for various applications.

Config: SINGLE

A single configuration allows for easier integration in circuits where space is a constraint.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCB, leading to more compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides a larger surface area for better soldering and thermal management.

No. of Terminals: 2

Having two terminals simplifies the connection process, enhancing usability and versatility in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for high-density circuits, making the device suitable for compact applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures reliability in demanding environments without performance degradation.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature allows the device to function in extreme cold conditions, enhancing its application range.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and prevents oxidation, ensuring reliable electrical connections.

Terminal Position: SINGLE

A single terminal position simplifies design and manufacturing processes, making assembly more efficient.

Case Connection: CATHODE

A cathode connection facilitates easy integration into DC circuits, providing clear polarity for design engineers.

Minimum Breakdown Voltage: 26.7 V

A minimum breakdown voltage of 26.7 V ensures effective voltage clamping to protect sensitive components.

Peak Reflow Temperature °C: 245 °C

This peak reflow temperature maintains compatibility with standard soldering processes, ensuring versatility in manufacturing.

Maximum Breakdown Voltage: 29.5 V

With a maximum breakdown voltage of 29.5 V, the device offers robust protection against voltage spikes.

Reference Standard: AEC-Q101; IEC-61000-4-2

Compliance with these reference standards guarantees high reliability and performance in automotive and industrial applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor diode, it effectively protects circuits from voltage transients, prolonging their lifespan.

Technology: AVALANCHE

Avalanche technology enhances the device's ability to handle high-energy transients, making it suitable for harsh environments.

Terminal Form: GULL WING

Gull wing terminals ensure strong solder joints and improved mechanical stability during and after assembly.

Maximum Repetitive Peak Reverse Voltage: 24 V

This specification provides insight into the device's capability to manage voltage stress, safeguarding against overload.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a balanced moisture resistance, suitable for standard production environments.

Polarity: UNIDIRECTIONAL

Unidirectional polarity makes it straightforward to use in specific circuit applications requiring one-way current flow.

Diode Element Material: SILICON

Silicon as the semiconductor material ensures effective operation at various temperatures and conditions.

Technical Specifications

Transient Suppression Devices LDP01-28AY attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

29.5 V

Minimum Breakdown Voltage:

26.7 V

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity:

UNIDIRECTIONAL

Reference Standard:

AEC-Q101; IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

24 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

LDP01-28AY Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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