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LDP01-26AY

STMicroelectronics

LDP01-26AY by STMicroelectronics

LDP01-26AY by STMicroelectronics is a unidirectional avalanche diode with a max breakdown voltage of 27V. It is designed for transient suppression applications in automotive electronics, meeting AEC-Q101 and IEC-61000-4-2 standards. With a small outline package and matte tin terminal finish, it operates b/w -55°C to 175°C efficiently.

Median Price

$3.023

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$1.270

100+ parts

-

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-

10k+ parts

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1,000

$1.270

-

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Arrow

USA . 1,000 parts In-Stock

1+ parts

$3.206

100+ parts

$1.724

1k+ parts

$1.175

10k+ parts

-

1,000

$3.206

$1.724

$1.175

-

Mouser Electronics

USA . 13,800 parts In-Stock

1+ parts

$3.500

100+ parts

$1.770

1k+ parts

$1.290

10k+ parts

$1.190

13,800

$3.500

$1.770

$1.290

$1.190

DigiKey

USA . 3,173 parts In-Stock

1+ parts

$3.860

100+ parts

$1.761

1k+ parts

$1.436

10k+ parts

-

3,173

$3.860

$1.761

$1.436

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.724

1k+ parts

$1.175

10k+ parts

-

1,000

-

$1.724

$1.175

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EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

-

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Element14

Singapore . 358 parts In-Stock

1+ parts

-

100+ parts

$2.840

1k+ parts

$1.780

10k+ parts

-

358

-

$2.840

$1.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,468 parts In-Stock

1+ parts

$1.313

100+ parts

-

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3,468

$1.313

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Digiode

USA . 1,105 parts In-Stock

1+ parts

$1.469

100+ parts

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1,105

$1.469

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Anansix

USA . 1,562 parts In-Stock

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1,562

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 63 parts In-Stock

1+ parts

$0.153

100+ parts

-

1k+ parts

$0.137

10k+ parts

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63

$0.153

-

$0.137

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MKK Technologies

India . 1,847 parts In-Stock

1+ parts

$0.287

100+ parts

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1k+ parts

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1,847

$0.287

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DigiPath Technology Company

USA . 1,847 parts In-Stock

1+ parts

$0.287

100+ parts

-

1k+ parts

-

10k+ parts

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1,847

$0.287

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Component Stockers USA

USA . 3,228 parts In-Stock

1+ parts

$1.360

100+ parts

$1.250

1k+ parts

$1.140

10k+ parts

-

3,228

$1.360

$1.250

$1.140

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Corphita

USA . 360 parts In-Stock

1+ parts

$1.391

100+ parts

-

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360

$1.391

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Infinite Electronics LLP (Excess)

. 366,011 parts In-Stock

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366,011

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RC Electronics

USA . 7,200 parts In-Stock

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7,200

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Kepictronics

USA . 5,294 parts In-Stock

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5,294

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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A-Z Elektronik GmbH

Germany . 1,589 parts In-Stock

1+ parts

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1,589

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Alle Elektronik GmbH

Germany . 1,059 parts In-Stock

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1,059

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 768 parts In-Stock

1+ parts

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100+ parts

$0.183

1k+ parts

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768

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$0.183

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Discover the reliability and performance of the LDP01-26AY from STMicroelectronics, a leading manufacturer in transient suppression devices. This compact single-configured diode offers protection against voltage spikes and surges, making it ideal for a wide range of applications. With a high breakdown voltage and avalanche technology, this diode ensures the safety of your electronics. Trust in the quality of STMicroelectronics and equip your devices with the LDP01-26AY for unparalleled protection and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the device, making it suitable for various environments.

Configuration: SINGLE

The single configuration simplifies the design and installation process, minimizing complexity and potential points of failure.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures a compact and efficient use of space on the circuit board.

Number of Terminals: 2

Having 2 terminals simplifies the connection process and reduces the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the device suitable for applications where space is limited, without compromising performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures the device can function reliably in challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the device to withstand extreme cold conditions without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, ensuring a reliable electrical connection.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and reduces the chances of errors during assembly.

Case Connection: CATHODE

The cathode case connection simplifies the polarity identification and ensures correct orientation during installation.

Minimum Breakdown Voltage: 24.4 V

The minimum breakdown voltage specification indicates the device's ability to protect against voltage spikes and transients effectively.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for reliable soldering during assembly, ensuring long-term performance.

Maximum Breakdown Voltage: 27 V

The maximum breakdown voltage specification defines the device's upper limit for transient suppression, ensuring protection for sensitive components.

Reference Standard: AEC-Q101; IEC-61000-4-2

Compliance with AEC-Q101 and IEC-61000-4-2 standards ensures the device meets industry requirements for reliability and performance.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diode technology offers effective transient voltage protection, safeguarding connected equipment.

Technology: AVALANCHE

The avalanche technology enhances the device's ability to handle transient events by rapidly clamping voltage spikes for protection.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process during assembly, ensuring a secure and reliable connection.

Maximum Repetitive Peak Reverse Voltage: 22 V

The maximum repetitive peak reverse voltage specification indicates the device's ability to withstand reverse voltage stress without damage.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the device's tolerance to moisture exposure during storage and assembly, ensuring long-term reliability.

Polarity: UNIDIRECTIONAL

Being unidirectional ensures that the device only conducts transient voltages in one direction, providing effective protection for connected circuits.

Diode Element Material: SILICON

The use of silicon as the diode element material offers optimal electrical properties for transient suppression and long-term reliability.

Technical Specifications

Transient Suppression Devices LDP01-26AY attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

27 V

Minimum Breakdown Voltage:

24.4 V

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity:

UNIDIRECTIONAL

Reference Standard:

AEC-Q101; IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

22 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

LDP01-26AY Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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