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L9908

STMicroelectronics

L9908 by STMicroelectronics

L9908 by STMicroelectronics is a robust brushless DC motor controller designed for automotive applications, operating b/w -40 °C and 150 °C. It features a compact 48-terminal flatpack design with AEC-Q100 screening. With a supply voltage range of 4.5V to 36V, it ensures reliable performance in demanding environments.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,485 parts In-Stock

1+ parts

$6.720

100+ parts

$4.330

1k+ parts

$3.950

10k+ parts

$3.900

1,485

$6.720

$4.330

$3.950

$3.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,187 parts In-Stock

1+ parts

$6.403

100+ parts

-

1k+ parts

-

10k+ parts

-

3,187

$6.403

-

-

-

Vyrian

USA . 3,883 parts In-Stock

1+ parts

$6.740

100+ parts

-

1k+ parts

-

10k+ parts

-

3,883

$6.740

-

-

-

Anansix

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,667 parts In-Stock

1+ parts

$6.066

100+ parts

-

1k+ parts

-

10k+ parts

-

4,667

$6.066

-

-

-

IDEA Electronic Components Group

UK . 430 parts In-Stock

1+ parts

$21.228

100+ parts

-

1k+ parts

$19.105

10k+ parts

-

430

$21.228

-

$19.105

-

MKK Technologies

India . 1,944 parts In-Stock

1+ parts

$39.918

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$39.918

-

-

-

DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$39.918

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$39.918

-

-

-

Parana Technologies

USA . 295 parts In-Stock

1+ parts

-

100+ parts

$25.381

1k+ parts

-

10k+ parts

-

295

-

$25.381

-

-

Overview

STMicroelectronics L9908 Automotive 3-Phase Motor Gate Driver Units (GDU) are designed for controlling 6 N-channel FETs for brushless motors in automotive applications. The three half-bridge driver channels (HS/LS couples) independently configure different load driving and withstand -14V to +95V excursion on motor pins. The pre-driver stages are controlled through 6 dedicated parallel inputs to support duty cycle operations from 0% to 100%. This feature also allows the implementation of all kinds of electric motor control strategies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization and automated assembly, enhancing production efficiency.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates automotive-grade quality and reliability, ideal for use in automotive environments.

Package Shape: SQUARE

A square package shape provides consistent mechanical and thermal performance, facilitating easier integration into designs.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and functionality, making it suitable for complex applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style supports better thermal management and can cater to tight space requirements in modern designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in demanding environments, especially in automotive applications.

Minimum Operating Temperature: -40 °C

The capability to operate at very low temperatures makes it suitable for applications in harsh climatic conditions.

Terminal Position: QUAD

Quad terminal positioning enhances electrical performance and simplifies PCB layout, contributing to efficient circuit design.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact design in space-constrained applications while maintaining operational efficiency.

Width (mm): 7 mm

A compact width facilitates integration into various applications without compromising on functionality.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Designed specifically for brushless DC motors, it ensures optimal performance and efficiency in motor control applications.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage, it enables operation in a variety of low-power applications.

Length: 7 mm

A small length aids in saving board space, allowing for more compact device layouts.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, ensuring it can withstand the rigorous demands of automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and electrical connection reliability for surface mount applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for denser layouts, enabling the design of smaller and more complex circuits.

Maximum Supply Voltage (Vsup): 36 V

High maximum supply voltage offers flexibility in application design and can accommodate a wide range of motor types.

Technical Specifications

Motion Control ICs L9908 attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

L9908 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

4710-01-156-4912, 4710011564912

NIIN

011564912

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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