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L9907N

STMicroelectronics

L9907N by STMicroelectronics

STMicroelectronics L9907N is a Motion Control IC with 16 terminals, operating at power supplies of 7-18V. It features a rectangular package made of plastic/epoxy and uses bipolar technology. Ideal for applications requiring precise motion control in automotive or industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,358 parts In-Stock

1+ parts

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2,358

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Vyrian

USA . 2,225 parts In-Stock

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2,225

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Anansix

USA . 207 parts In-Stock

1+ parts

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207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 22 parts In-Stock

1+ parts

$12.241

100+ parts

-

1k+ parts

$11.017

10k+ parts

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22

$12.241

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$11.017

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MKK Technologies

India . 1,072 parts In-Stock

1+ parts

$23.018

100+ parts

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1,072

$23.018

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DigiPath Technology Company

USA . 1,072 parts In-Stock

1+ parts

$23.018

100+ parts

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1,072

$23.018

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Corphita

USA . 2,933 parts In-Stock

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2,933

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Parana Technologies

USA . 582 parts In-Stock

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100+ parts

$14.636

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582

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$14.636

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Overview

Experience seamless motion control like never before with the L9907N by STMicroelectronics. This top-of-the-line product boasts unparalleled quality and reliability, thanks to its manufacturer's long-standing reputation for excellence. Ideal for a wide range of applications within the Motion Control ICs category, this product offers customers unmatched value, benefits, and advantages. Trust in STMicroelectronics and elevate your projects to new heights with the L9907N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the package, making it suitable for various industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into existing systems or PCB layouts.

Power Supplies (V): 7/18

The wide range of power supply options (7V to 18V) makes this product versatile and compatible with different voltage sources.

No. of Terminals: 16

The high number of terminals allows for more connectivity options and flexibility in design.

Package Style (Meter): IN-LINE

The in-line package style saves space on a PCB and provides a streamlined and organized layout for the components.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish ensures good conductivity and solderability for easy assembly and reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved signal integrity for better performance.

Maximum Supply Current (Isup): 7 mA

The low maximum supply current requirement of 7 mA helps in reducing power consumption and heat dissipation in the system.

Technology: BIPOLAR

The bipolar technology offers high speed and precision control, making it suitable for applications requiring accurate motion control.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and robust connections to the PCB, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm enables easy integration with common components and PCB layouts, simplifying the design process.

Technical Specifications

Motion Control ICs L9907N attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

7/18

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

7 mA

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

L9907N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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