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L9857

STMicroelectronics

L9857 by STMicroelectronics

L9857 by STMicroelectronics is a half-bridge peripheral driver designed for automotive applications, operating b/w 10V and 18V. It features built-in under-voltage protection, supports up to 125 °C, and comes in a compact SO package with 8 terminals. Ideal for efficient motor control in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,487 parts In-Stock

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3,487

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Anansix

USA . 1,624 parts In-Stock

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1,624

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Vyrian

USA . 1,327 parts In-Stock

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1,327

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R&J Components

USA . 909 parts In-Stock

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909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 941 parts In-Stock

1+ parts

$6.101

100+ parts

-

1k+ parts

$5.491

10k+ parts

-

941

$6.101

-

$5.491

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MKK Technologies

India . 1,909 parts In-Stock

1+ parts

$11.473

100+ parts

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1,909

$11.473

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DigiPath Technology Company

USA . 1,909 parts In-Stock

1+ parts

$11.473

100+ parts

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1,909

$11.473

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A-Z Elektronik GmbH

Germany . 4,839 parts In-Stock

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4,839

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Alle Elektronik GmbH

Germany . 3,226 parts In-Stock

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3,226

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Corphita

USA . 1,255 parts In-Stock

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1,255

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Parana Technologies

USA . 1,067 parts In-Stock

1+ parts

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$7.295

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1,067

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$7.295

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Overview

Elevate your projects with the L9857 from STMicroelectronics, a trusted name in high-quality semiconductor solutions. Engineered for reliability, this versatile peripheral driver excels in automotive applications and ensures robust performance under diverse conditions. Enjoy seamless integration, built-in under-voltage protection, and an impressive temperature range. With ST's commitment to innovation, the L9857 empowers you to drive efficiency and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting performance and protection against environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount design allows for compact installation and efficient use of space on circuit boards, facilitating easier integration into smaller devices.

Maximum Supply Voltage: 18 V

With a maximum supply voltage of 18 V, this product can handle a range of voltages, making it versatile for different circuit requirements.

Package Shape: RECTANGULAR

The rectangular package shape is standard and widely compatible with various PCB layouts, enhancing design flexibility.

Built-in Protections: UNDER VOLTAGE

Under voltage protection enhances the safety of the device by preventing operation under unsafe voltage levels, prolonging component life.

Power Supplies (V): 15

Operating with a nominal supply voltage of 15 V ensures optimal performance in most driving applications, enhancing energy efficiency.

No. of Terminals: 8

The eight-terminal configuration supports complex circuit designs, allowing for multiple input/output options in peripheral applications.

Package Style (Meter): SMALL OUTLINE

The small outline design reduces footprint on the PCB, which is ideal for space-constrained applications while offering high performance.

Minimum Supply Voltage: 10 V

Flexible voltage working range starting from 10 V ensures compatibility with a variety of power supplies and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this peripheral driver is suitable for use in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this product to function reliably in extreme cold temperatures, making it excellent for outdoor and automotive applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout and connection options, catering to various design requirements.

Maximum Seated Height: 1.75 mm

The low seated height contributes to a compact design, allowing for a more streamlined and efficient overall product design.

Width: 3.9 mm

A narrow width of 3.9 mm enables high-density configurations on PCBs without significantly increasing the footprint.

Length: 4.9 mm

A compact length allows for versatility in design while maintaining performance, making it easy to integrate into various electronic systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets industry-grade requirements for reliability and durability in harsh conditions.

Technology: BCDMOS

BCD process technology offers high efficiency and performance, making this driver suitable for modern, power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly, contributing to streamlined manufacturing processes.

Nominal Supply Voltage: 15 V

The nominal voltage of 15 V is optimal for a wide range of applications, providing consistent performance and power management.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm fits standard PCB layouts and is well-suited for modern surface-mount technology, enhancing manufacturing versatility.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Being a half bridge based driver offers efficient control over motors and actuators, making this product ideal for various peripheral control applications.

Output Current Flow Direction: SOURCE

The source direction of current flow is conducive for driving loads effectively, enhancing overall performance in driving applications.

Technical Specifications

Peripheral Drivers L9857 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

L9857 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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