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L9857-TR

STMicroelectronics

L9857-TR by STMicroelectronics

L9857-TR by STMicroelectronics is a half-bridge peripheral driver designed for automotive applications, featuring a max supply voltage of 18V and operating temp range from -40 °C to 125°C. It includes built-in under-voltage protection and offers fast turn-on/off times of 0.3µs and 0.2µs, respectively. This compact device comes in an 8-terminal gull-wing package, ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Q Components

USA . 4,910 parts In-Stock

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4,910

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Vyrian

USA . 3,246 parts In-Stock

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3,246

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Digiode

USA . 2,403 parts In-Stock

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Bristol Electronics

USA . 2,364 parts In-Stock

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2,364

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Dan-Mar Components

USA . 2,364 parts In-Stock

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Anansix

USA . 1,800 parts In-Stock

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ComSIT Distribution GmbH

Germany . 510 parts In-Stock

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510

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Distributors (Availability)

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Microchip USA

USA . 2,342 parts In-Stock

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$1.448

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$1.448

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$5.409

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$4.868

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433

$5.409

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$4.868

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AZTECH Wire

Italy . 501 parts In-Stock

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$9.640

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501

$9.640

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MKK Technologies

India . 1,725 parts In-Stock

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$10.171

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$10.171

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DigiPath Technology Company

USA . 1,725 parts In-Stock

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$10.171

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$10.171

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A-Z Elektronik GmbH

Germany . 5,385 parts In-Stock

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Corphita

USA . 3,677 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,590 parts In-Stock

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Vigor

Singapore . 2,351 parts In-Stock

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Parana Technologies

USA . 1,019 parts In-Stock

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$6.467

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Kepictronics

USA . 802 parts In-Stock

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Overview

Elevate your automotive designs with the L9857-TR from STMicroelectronics—a trusted leader in innovation. This advanced peripheral driver combines robust performance with built-in under-voltage protection, ensuring reliability in demanding environments. With a compact design and exceptional thermal range from -40 °C to 125°C, it perfectly fits various applications, delivering value through efficiency and durability. Choose L9857-TR for unmatched quality and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material enhances durability and thermal stability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier installation and improved space efficiency on PCBs.

Maximum Supply Voltage: 18 V

A maximum supply voltage of 18 V provides flexibility for integration into different systems, accommodating a range of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and supports efficient layout designs.

Built-in Protections: UNDER VOLTAGE

Built-in under-voltage protection enhances reliability and protects the device from damage, leading to long-term stability.

Power Supplies (V): 15

A nominal power supply requirement of 15 V facilitates smoother performance and compatibility with standard power sources.

No. of Terminals: 8

With 8 terminals, the device provides ample connectivity options for diverse applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space requirements while maximizing performance.

Minimum Supply Voltage: 10 V

The ability to operate at a minimum supply voltage of 10 V ensures functional performance in low-voltage applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is suitable for high-temperature environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range, with a minimum operating temperature of -40 °C, ensures reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning allows for versatile design layouts and improves connection reliability.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm enables integration into compact designs, making it ideal for space-constrained applications.

Width: 3.9 mm

The compact width of 3.9 mm suits various PCB layouts, particularly in portable devices.

Length: 4.9 mm

At 4.9 mm in length, this product is easy to fit into tight spaces while maintaining effective performance.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means that this product is designed to meet stringent quality and reliability standards, making it suitable for automotive applications.

Technology: BCD

BCD (Bipolar-CMOS-DMOS) technology delivers excellent efficiency and performance in power management applications.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint quality and ease of PCB assembly, ensuring reliable connections.

Nominal Supply Voltage: 15 V

The nominal supply voltage of 15 V optimizes performance, particularly in high-power applications.

Turn-on Time: 0.3 µs

A fast turn-on time of 0.3 µs allows for swift response in dynamic applications, enhancing overall system performance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product supports standard PCB layouts and minimizes the risk of connection issues.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

As a half bridge based peripheral driver, it allows for efficient control of various loads, making it versatile for different applications.

Turn-off Time: 0.2 µs

A quick turn-off time of 0.2 µs ensures that the driver can manage load transitions smoothly, improving operational efficiency.

Output Current Flow Direction: SOURCE

The source current flow direction is well-suited for driving loads efficiently, providing optimal performance in diverse applications.

Technical Specifications

Peripheral Drivers L9857-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.2 us

Turn-on Time:

.3 us

Width:

3.9 mm

Trade Compliance

L9857-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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