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L6926D

STMicroelectronics

L6926D by STMicroelectronics

L6926D by STMicroelectronics is a compact buck switching regulator with a max output current of 1.4 A and operates at up to 600 kHz. It features an input voltage range of 2-5.5 V, making it ideal for efficient power management in portable devices. Its small outline design ensures easy surface mounting in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,334 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,334

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Digiode

USA . 2,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,805

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Anansix

USA . 403 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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403

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,341 parts In-Stock

1+ parts

$2.482

100+ parts

-

1k+ parts

$2.234

10k+ parts

-

1,341

$2.482

-

$2.234

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MKK Technologies

India . 2,027 parts In-Stock

1+ parts

$4.668

100+ parts

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2,027

$4.668

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DigiPath Technology Company

USA . 2,027 parts In-Stock

1+ parts

$4.668

100+ parts

-

1k+ parts

-

10k+ parts

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2,027

$4.668

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-

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Corphita

USA . 1,063 parts In-Stock

1+ parts

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1,063

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Parana Technologies

USA . 32 parts In-Stock

1+ parts

-

100+ parts

$2.968

1k+ parts

-

10k+ parts

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32

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$2.968

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Overview

Unlock the potential of your designs with the L6926D from STMicroelectronics—a top-tier switching regulator that combines innovation with reliability. Experience superior performance and efficiency in a compact package, perfect for modern applications like consumer electronics, IoT devices, and automotive systems. With STMicroelectronics' renowned quality and support, elevate your projects while reaping the benefits of increased power savings and enhanced functionality. Choose L6926D for unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and thermal stability, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient automated assembly, making it ideal for modern electronic devices.

Package Shape: SQUARE

A square package shape provides efficient space utilization on PCBs, accommodating high-density applications.

No. of Terminals: 8

With 8 terminals, the component allows for a variety of circuit configurations and greater flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This small outline combined with a thin profile makes it perfect for space-constrained applications, enhancing overall design efficiency.

Control Mode: CURRENT-MODE

Current-mode control enhances the response time and stability of the regulator, ensuring efficient operation under varying load conditions.

Terminal Position: DUAL

Dual terminal positioning allows for better layout options and increased design flexibility within PCB layouts.

Maximum Seated Height: 1.1 mm

A low seated height aids in minimizing overall device thickness, which is beneficial for portable electronic designs.

Width: 3 mm

With a compact width of 3 mm, it is suitable for tight spaces in modern electronic assemblies.

Other IC type: SWITCHING REGULATOR

Switching regulators are known for their efficiency in power conversion, reducing heat generation and improving overall system reliability.

Nominal Input Voltage: 3.6 V

A nominal input voltage of 3.6 V makes it compatible with standard battery voltages, enhancing usability in battery-operated devices.

Length: 3 mm

At 3 mm in length, it contributes to the compact form factor required in many electronic applications.

Maximum Switching Frequency: 600 kHz

High switching frequency allows for reduced component size in the power supply circuit, leading to lower overall system size.

Maximum Output Current: 1.4 A

The capability to output 1.4 A ensures it can handle substantial load requirements, making it versatile for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, which is crucial for reliable operation in sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and inspection during PCB assembly, thus improving manufacturability.

Switcher Config: BUCK

The buck configuration offers high efficiency for stepping down voltage, ideal for battery-powered applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is compatible with modern PCB layouts, allowing for precise and reliable connections.

Minimum Input Voltage: 2 V

A minimum input voltage of 2 V increases versatility, allowing the regulator to be used with a wider range of power supplies.

Maximum Input Voltage: 5.5 V

The ability to handle up to 5.5 V input makes it suitable for various power sources, broadening its application range.

Technical Specifications

Switching Regulators & Controllers L6926D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

1.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

L6926D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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