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L6926

STMicroelectronics

L6926 by STMicroelectronics

L6926 by STMicroelectronics is a compact switching regulator designed for automotive applications, featuring a max output current of 1.65 A and a wide input voltage range of 2-5.5 V. It operates at up to 800 kHz with current-mode control. Its small outline package ensures efficient space utilization in designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 6,401 parts In-Stock

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Digiode

USA . 3,890 parts In-Stock

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3,890

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Zilex Electronics Inc.

Canada . 350 parts In-Stock

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350

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Anansix

USA . 220 parts In-Stock

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220

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Dan-Mar Components

USA . 100 parts In-Stock

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100

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Atlantic Semiconductor

USA . 15 parts In-Stock

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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Ampacity Inc.

Singapore . 321 parts In-Stock

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$0.500

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321

$0.500

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IDEA Electronic Components Group

UK . 652 parts In-Stock

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$17.046

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$15.341

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652

$17.046

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$15.341

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AZTECH Wire

Italy . 649 parts In-Stock

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$19.570

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649

$19.570

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MKK Technologies

India . 702 parts In-Stock

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$32.053

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DigiPath Technology Company

USA . 702 parts In-Stock

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$32.053

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702

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QUARKTWIN TECHNOLOGY LTD

USA . 10,270 parts In-Stock

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Microchip USA

USA . 4,515 parts In-Stock

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Metaverse IC Inc.

Canada . 2,835 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 1,126 parts In-Stock

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$20.381

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Assy Fe

Spain . 900 parts In-Stock

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Corphita

USA . 366 parts In-Stock

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Overview

Elevate your power management solutions with the L6926 from STMicroelectronics, a leader in innovative semiconductor technologies. Designed for automotive applications, this compact switching regulator delivers exceptional efficiency and reliability, ensuring optimal performance across diverse environments. With its advanced current-mode control and robust thermal capabilities, the L6926 empowers engineers to create high-performance systems that thrive under pressure, enhancing overall design flexibility and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount compatible allows for compact design and eases integration into modern circuit boards.

Package Shape: SQUARE

The square shape is ideal for efficient space utilization on PCB layouts.

No. of Terminals: 8

Having 8 terminals enables versatile connections and simplifies circuit design, enhancing usability.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch make it perfect for space-sensitive applications and ensure compatibility with high-density layouts.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it ensures reliability and performance in demanding environments.

Control Mode: CURRENT-MODE

Current-mode operation enhances the stability and transient response of the regulator, providing a better performance profile.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes it suitable for automotive and industrial applications, where extreme conditions are common.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish protects against oxidation and provides good solderability, ensuring dependable connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in design and installation, allowing easier routing on PCBs.

Maximum Seated Height: 1.1 mm

The low maximum seated height facilitates low-profile designs, essential for space-constrained applications.

Width: 3 mm

At just 3 mm wide, it is highly suitable for compact electronic devices, providing ease of integration.

Other IC Type: SWITCHING REGULATOR

As a switching regulator, it provides high efficiency and reduced heat generation, which is critical in power-sensitive applications.

Nominal Input Voltage: 3.6 V

A nominal input voltage that matches common battery outputs ensures compatibility with many power sources.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, making assembly more efficient.

Peak Reflow Temperature °C: 260

A high reflow temperature indicates robustness in soldering processes, which is essential for quality construction.

Length: 3 mm

The compact length supports high-density designs, making it suitable for devices with small footprints.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use signifies reliability and performance under stringent conditions, essential for automotive applications.

Maximum Switching Frequency: 800 kHz

A high switching frequency allows for smaller output capacitors and inductors, which helps reduce overall circuit size and weight.

Maximum Output Current: 1.65 A

The ability to output 1.65 A enables it to power a range of devices effectively, from microcontrollers to RF applications.

Technology: CMOS

CMOS technology facilitates lower power consumption, making it a great choice for battery-operated devices and applications.

Terminal Form: GULL WING

The gull wing terminal form is advantageous for soldering processes, ensuring strong, reliable connections.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation enhances the efficiency and performance of the regulator, crucial for maintaining regulated outputs.

Switcher Config: BUCK

As a buck switching regulator, it efficiently steps down voltage with minimal energy loss, maximizing battery life.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for high-density layout designs without compromising on performance or reliability.

Minimum Input Voltage: 2 V

The ability to operate down to 2 V makes it versatile for various power sources, including low-voltage batteries.

Maximum Input Voltage: 5.5 V

Supporting a maximum input voltage of 5.5 V ensures compatibility with many power supply configurations, enhancing flexibility.

Technical Specifications

Switching Regulators & Controllers L6926 attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

800 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

L6926 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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