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L6925D

STMicroelectronics

L6925D by STMicroelectronics

L6925D by STMicroelectronics is a compact buck switching regulator with a max output current of 1.2 A and operates at a frequency of up to 600 kHz. It supports input voltages from 2.7 V to 5.5 V, making it ideal for efficient power management in portable devices. Its small outline package ensures easy surface mounting in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,611 parts In-Stock

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10,611

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Digiode

USA . 4,007 parts In-Stock

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4,007

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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Anansix

USA . 943 parts In-Stock

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943

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Distributors (Availability)

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Microchip USA

USA . 148 parts In-Stock

1+ parts

$2.296

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-

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148

$2.296

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IDEA Electronic Components Group

UK . 1,548 parts In-Stock

1+ parts

$11.367

100+ parts

-

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$10.230

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1,548

$11.367

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$10.230

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AZTECH Wire

Italy . 990 parts In-Stock

1+ parts

$15.750

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990

$15.750

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MKK Technologies

India . 111 parts In-Stock

1+ parts

$21.374

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111

$21.374

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DigiPath Technology Company

USA . 111 parts In-Stock

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$21.374

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111

$21.374

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A-Z Elektronik GmbH

Germany . 7,262 parts In-Stock

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7,262

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Alle Elektronik GmbH

Germany . 4,841 parts In-Stock

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4,841

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Corphita

USA . 2,698 parts In-Stock

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2,698

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Vigor

Singapore . 1,996 parts In-Stock

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1,996

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Parana Technologies

USA . 338 parts In-Stock

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$13.590

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338

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$13.590

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Overview

Unlock exceptional power efficiency with the L6925D from STMicroelectronics, a leader in innovative semiconductor solutions. This compact switching regulator delivers reliable performance for a wide range of applications, from consumer electronics to industrial systems. With its advanced current-mode control and sleek design, it ensures optimal energy conversion while saving space and enhancing device longevity. Choose the L6925D for quality you can trust and benefits that elevate your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit boards, making it ideal for compact designs.

Package Shape: SQUARE

The square shape facilitates better space utilization on PCB layouts.

No. of Terminals: 8

With 8 terminals, this product provides ample connectivity options for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is well-suited for applications with stringent space constraints.

Control Mode: CURRENT-MODE

Current-mode control enhances stability and transient response, making it suitable for dynamic load applications.

Terminal Finish: MATTE TIN

A matte tin finish improves solderability and reliability of the connections.

Terminal Position: DUAL

Dual terminal position allows for flexible layout configurations on the PCB.

Maximum Seated Height: 1.1 mm

The low seated height enables better thermal management and space-saving designs.

Width: 3 mm

A narrow width makes this regulator suitable for miniature applications.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it offers high efficiency, reducing power loss during operation.

Nominal Input Voltage: 3.6 V

The nominal input voltage aligns well with common battery voltages, enhancing compatibility.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time of 30 seconds at peak temperature ensures that solder joints are properly established.

Peak Reflow Temperature: 260 °C

Withstands high peak reflow temperatures, making it suitable for lead-free soldering processes.

Length: 3 mm

The 3 mm length contributes to the compact form factor, ideal for space-constrained applications.

Maximum Switching Frequency: 600 kHz

A high switching frequency allows for smaller passive components, optimizing overall circuit performance.

Maximum Output Current: 1.2 A

The ability to output 1.2 A makes this regulator suitable for powering a variety of devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical and electrical performance, ensuring durability.

Switcher Config: BUCK

As a buck switcher, it efficiently steps down voltage, making it effective for low-voltage applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is conducive for high-density PCB layouts.

Minimum Input Voltage: 2.7 V

A minimum input voltage of 2.7 V allows this regulator to be used with a wider range of power sources.

Maximum Input Voltage: 5.5 V

Supports a maximum input voltage of 5.5 V, providing flexibility in design for various applications.

Technical Specifications

Switching Regulators & Controllers L6925D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

L6925D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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