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L6924U

STMicroelectronics

L6924U by STMicroelectronics

L6924U by STMicroelectronics is a Power Management IC with 16 terminals in a square chip carrier package. It operates at supply voltages of 2.5V to 12V, making it suitable for automotive applications. With a max seated height of 1mm and operating temperatures ranging from -40 °C to 125°C, this IC provides power supply support in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,834 parts In-Stock

1+ parts

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4,834

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Vyrian

USA . 4,797 parts In-Stock

1+ parts

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4,797

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Anansix

USA . 2,384 parts In-Stock

1+ parts

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2,384

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,535 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

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1,535

$5.500

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AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$13.650

100+ parts

-

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767

$13.650

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$18.699

100+ parts

-

1k+ parts

$16.829

10k+ parts

-

1,675

$18.699

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$16.829

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MKK Technologies

India . 645 parts In-Stock

1+ parts

$35.162

100+ parts

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645

$35.162

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DigiPath Technology Company

USA . 645 parts In-Stock

1+ parts

$35.162

100+ parts

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645

$35.162

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Component Stockers USA

USA . 418 parts In-Stock

1+ parts

$99.990

100+ parts

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418

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 10,811 parts In-Stock

1+ parts

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10,811

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Microchip USA

USA . 4,017 parts In-Stock

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4,017

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Vigor

Singapore . 2,075 parts In-Stock

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2,075

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Corphita

USA . 439 parts In-Stock

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439

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Parana Technologies

USA . 435 parts In-Stock

1+ parts

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$22.358

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435

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$22.358

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Overview

Power your devices with the high-quality L6924U from STMicroelectronics, a leading manufacturer known for its innovative power management ICs. Ideal for automotive applications, this chip carrier package offers a wide supply voltage range and low supply current, ensuring efficient power delivery. With its surface mount design and compact square shape, the L6924U is a versatile solution for a variety of power supply support circuits. Experience the value and benefits of reliable performance and superior quality with the L6924U from STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly process.

Package Shape: SQUARE

Square package shape is efficient for space utilization on the PCB.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common supply voltages used in electronic devices.

Power Supplies (V): 2.5/12

Supports multiple power supply options for flexibility in application.

No. of Terminals: 16

Sufficient number of terminals for connecting various components and signals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and durability.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Operates reliably in cold temperatures, making it suitable for a wide range of conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Provides good conductivity and durability for the terminal connections.

Terminal Position: QUAD

Quad terminal position allows for efficient layout and connection of components.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact electronic devices.

Width (mm): 3 mm

Narrow width saves PCB space and allows for compact design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring reliable performance.

Minimum Supply Voltage (Vsup): 2.5 V

Can operate at low supply voltages, suitable for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during manufacturing.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes.

Length: 3 mm

Compact length allows for efficient placement on the PCB and space-saving designs.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments with temperature variations and vibrations.

Maximum Supply Current (Isup): 2.5 mA

Low supply current requirement for efficient power management.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant design.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 12 V

Capable of handling higher supply voltages, suitable for various applications.

Technical Specifications

Power Management ICs L6924U attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

L6924U Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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