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L6924D

STMicroelectronics

L6924D by STMicroelectronics

STMicroelectronics L6924D is a Power Management IC with 5V nominal voltage and 16 terminals in a square package. It supports power supplies up to 5V, has a max seated height of 1mm, and is suitable for applications requiring adjustable threshold power supply support circuits.

Median Price

$1.118

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$1.118

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650

$1.118

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Vyrian

USA . 8,428 parts In-Stock

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8,428

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Anansix

USA . 2,501 parts In-Stock

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2,501

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Digiode

USA . 2,287 parts In-Stock

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2,287

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Euro-Tech

UK . 922 parts In-Stock

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922

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J2 Sourcing AB

Sweden . 230 parts In-Stock

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230

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Ashlea Components Ltd

UK . 152 parts In-Stock

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152

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Speed Components Ltd

Israel . 100 parts In-Stock

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100

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Prism Electronics

USA . 45 parts In-Stock

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45

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Distributors (Availability)

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Ampacity Inc.

Singapore . 143 parts In-Stock

1+ parts

$0.500

100+ parts

-

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143

$0.500

-

-

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Bastille Electronics

Australia . 750 parts In-Stock

1+ parts

$1.118

100+ parts

$1.062

1k+ parts

$1.009

10k+ parts

$0.995

750

$1.118

$1.062

$1.009

$0.995

Continental Prestige Electronics

USA . 4,092 parts In-Stock

1+ parts

$1.118

100+ parts

-

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$1.096

4,092

$1.118

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-

$1.096

Argo Parts USA

USA . 952 parts In-Stock

1+ parts

$1.118

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952

$1.118

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Semicontronic

India . 390 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

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390

$1.500

$1.462

$1.455

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IDEA Electronic Components Group

UK . 1,251 parts In-Stock

1+ parts

$4.640

100+ parts

-

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$4.176

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1,251

$4.640

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$4.176

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Aztec Data Supply Inc.

USA . 3,000 parts In-Stock

1+ parts

$5.900

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3,000

$5.900

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MKK Technologies

India . 2,367 parts In-Stock

1+ parts

$8.726

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2,367

$8.726

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DigiPath Technology Company

USA . 2,367 parts In-Stock

1+ parts

$8.726

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2,367

$8.726

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AZTECH Wire

Italy . 511 parts In-Stock

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$15.946

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511

$15.946

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Corohmni

South Africa . 280 parts In-Stock

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$24.181

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280

$24.181

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Microchip USA

USA . 2,778 parts In-Stock

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$48.497

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2,778

$48.497

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Kepictronics

USA . 21,734 parts In-Stock

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Metaverse IC Inc.

Canada . 21,734 parts In-Stock

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21,734

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QUARKTWIN TECHNOLOGY LTD

USA . 19,575 parts In-Stock

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19,575

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 10,331 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,747 parts In-Stock

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Corphita

USA . 4,984 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,831 parts In-Stock

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3,831

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Vigor

Singapore . 1,875 parts In-Stock

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1,875

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Parana Technologies

USA . 1,461 parts In-Stock

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$5.548

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1,461

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Perfect Parts

USA . 50 parts In-Stock

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50

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Overview

Elevate your power management solutions with the L6924D by STMicroelectronics. Known for their superior quality and innovative technology, STMicroelectronics delivers cutting-edge power management ICs that are essential for a wide range of applications. This surface mount square package chip carrier offers a nominal supply voltage of 5V and features adjustable threshold capabilities, making it versatile and efficient for various power supply support circuits. Experience reliable performance, optimal efficiency, and unmatched value with the L6924D - the perfect choice for your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape helps in efficient placement on the board and allows for better heat dissipation.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of applications and power sources.

Power Supplies (V): 5

Having multiple power supply options ensures flexibility in designing and adapting to various power input situations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal management, compactness, and ease of integration.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and conductivity, ensuring reliable connections and performance.

Terminal Position: QUAD

Quad terminal position allows for secure mounting on the PCB and efficient routing of connections.

Maximum Seated Height: 1 mm

Low seated height helps in compact design and minimizes the overall profile of the device.

Width (mm): 3 mm

Having a small width of 3mm enables space-saving design and integration into tight layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product enhances the stability and efficiency of the power management system.

Minimum Supply Voltage (Vsup): 2.5 V

Support for a minimum supply voltage of 2.5V ensures operation in low-power scenarios and compatibility with a range of devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product offers ease of assembly and rework during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and reliability under high-temperature conditions.

Length: 3 mm

Compact length of 3mm contributes to the overall small form factor and space-saving design of the product.

Maximum Supply Current (Isup): 2.5 mA

Being able to handle a maximum supply current of 2.5mA makes this product suitable for low-power applications and energy-efficient designs.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and provides environmental benefits.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for high-density mounting and space-efficient PCB layouts.

Maximum Supply Voltage (Vsup): 12 V

Support for a maximum supply voltage of 12V enables compatibility with a wide range of power sources and applications.

Adjustable Threshold: YES

The feature of adjustable threshold allows for customization and fine-tuning of the power management system according to specific requirements.

Technical Specifications

Power Management ICs L6924D attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

L6924D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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