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L6388D

STMicroelectronics

L6388D by STMicroelectronics

L6388D by STMicroelectronics is a high-side MOSFET driver with a max supply voltage of 17V and a nominal output peak current limit of 0.65A. It features fast turn-on (0.3µs) and turn-off (0.22µs) times, making it ideal for efficient power management in compact applications. Its small outline package ensures easy surface mounting in various electronic designs.

Median Price

$1.018

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,496 parts In-Stock

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8,496

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Digiode

USA . 3,042 parts In-Stock

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3,042

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Anansix

USA . 1,048 parts In-Stock

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1,048

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Component Sense

UK . 900 parts In-Stock

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-

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$1.018

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$1.018

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$0.897

900

-

$1.018

$1.018

$0.897

Corel Iberica Componentes, S.L.

Spain . 144 parts In-Stock

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-

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144

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ComSIT Distribution GmbH

Germany . 88 parts In-Stock

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88

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$2.383

100+ parts

-

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$2.145

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-

592

$2.383

-

$2.145

-

Microchip USA

USA . 116 parts In-Stock

1+ parts

$3.794

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-

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116

$3.794

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MKK Technologies

India . 610 parts In-Stock

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$4.481

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610

$4.481

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DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

$4.481

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610

$4.481

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

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$10.500

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1,358

$10.500

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AZTECH Wire

Italy . 660 parts In-Stock

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$13.130

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660

$13.130

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A-Z Elektronik GmbH

Germany . 4,625 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,083 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Parana Technologies

USA . 1,792 parts In-Stock

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$2.849

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1,792

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$2.849

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Corphita

USA . 924 parts In-Stock

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924

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Assy Fe

Spain . 144 parts In-Stock

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Kepictronics

USA . 68 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock the potential of your designs with the L6388D MOSFET Gate Driver from STMicroelectronics, a leader in semiconductor innovation. Offering exceptional reliability and performance, this compact driver excels in high-side applications, ensuring efficient control over power systems. With rapid turn-on and turn-off times, it enhances circuit responsiveness, making it ideal for automotive and industrial automation. Elevate your projects with ST's trusted quality and expertise—experience the advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight characteristics, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into modern circuit board designs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 17 V

With a maximum supply voltage of 17 V, this driver is capable of handling a wide range of applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape can optimize space on PCB layouts, allowing for efficient use in compact designs.

Power Supplies (V): 15

Designed to operate at a standard power supply of 15 V, this driver aligns with common power requirements in the industry.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for various configurations and ease of integration into different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density circuit design, making it a great choice for space-constrained applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and improves reliability, ensuring a robust connection in high-performance environments.

Terminal Position: DUAL

Dual terminal positioning facilitates convenient layout on PCBs, reducing the complexity of routing connections.

Maximum Seated Height: 1.75 mm

The low seated height minimizes the overall profile of the assembly, making this driver ideal for low-profile applications.

Width: 3.9 mm

A compact width of 3.9 mm allows for efficient placement on dense PCBs, optimizing space usage.

High Side Driver: YES

As a high-side driver, it can easily manage load switching in high-side configurations, enhancing the versatility of the product.

Length: 4.9 mm

The compact length of 4.9 mm ensures it can fit into tight spaces, catering to various compact circuit designs.

Technology: BCD

BCD technology offers high voltage and high current handling in a small footprint, making this product efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals improve solderability and offer better stress relief compared to some other terminal forms.

Nominal Supply Voltage: 15 V

The nominal supply voltage of 15 V aligns well with industry standards, providing ease of integration with existing designs.

Turn-on Time: 0.3 us

A fast turn-on time of 0.3 us enables quick switching, which is crucial for high-frequency applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides a balance between compact size and ease of soldering, making it practical for assembly.

Nominal Output Peak Current Limit: 0.65 A

With a nominal output peak current limit of 0.65 A, this driver can effectively handle a good range of load requirements.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

As a half bridge-based driver, it provides efficient control of power MOSFETs, enhancing performance in driving applications.

Turn-off Time: 0.22 us

The quick turn-off time of 0.22 us allows for efficient operation in high-speed applications, where timing is critical.

Technical Specifications

MOSFET Gate Drivers L6388D attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3/e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Nominal Output Peak Current Limit:

.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

17 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.22 us

Turn-on Time:

.3 us

Width:

3.9 mm

Trade Compliance

L6388D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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