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L6382DTR

STMicroelectronics

L6382DTR by STMicroelectronics

L6382DTR by STMicroelectronics is a robust power management IC designed for automotive applications, operating b/w -40 °C and 125 °C. It supports supply voltages from 9V to 15V with a max of 20 terminals in a compact SO package. This BCDMOS technology ensures reliable performance in demanding environments.

Median Price

$2.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$2.930

100+ parts

$1.804

1k+ parts

$1.600

10k+ parts

$1.519

1,000

$2.930

$1.804

$1.600

$1.519

Mouser Electronics

USA . 995 parts In-Stock

1+ parts

$2.930

100+ parts

$1.810

1k+ parts

$1.600

10k+ parts

$1.500

995

$2.930

$1.810

$1.600

$1.500

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.590

10k+ parts

$1.570

1,000

-

-

$1.590

$1.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 529 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

-

10k+ parts

-

529

$2.170

-

-

-

Digiode

USA . 2,025 parts In-Stock

1+ parts

$3.572

100+ parts

-

1k+ parts

-

10k+ parts

-

2,025

$3.572

-

-

-

Anansix

USA . 2,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,542

-

-

-

-

Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.418

10k+ parts

-

1,000

-

-

$2.418

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 519 parts In-Stock

1+ parts

$1.840

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$1.840

-

-

-

Vigor

Singapore . 1,000 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$3.120

-

-

-

Corphita

USA . 3,021 parts In-Stock

1+ parts

$3.384

100+ parts

-

1k+ parts

-

10k+ parts

-

3,021

$3.384

-

-

-

Microchip USA

USA . 2,634 parts In-Stock

1+ parts

$3.657

100+ parts

-

1k+ parts

-

10k+ parts

-

2,634

$3.657

-

-

-

IDEA Electronic Components Group

UK . 511 parts In-Stock

1+ parts

$5.089

100+ parts

-

1k+ parts

$4.580

10k+ parts

-

511

$5.089

-

$4.580

-

MKK Technologies

India . 959 parts In-Stock

1+ parts

$9.570

100+ parts

-

1k+ parts

-

10k+ parts

-

959

$9.570

-

-

-

DigiPath Technology Company

USA . 959 parts In-Stock

1+ parts

$9.570

100+ parts

-

1k+ parts

-

10k+ parts

-

959

$9.570

-

-

-

RC Electronics

USA . 6,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,650

-

-

-

-

Kepictronics

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 1,914 parts In-Stock

1+ parts

-

100+ parts

$6.085

1k+ parts

-

10k+ parts

-

1,914

-

$6.085

-

-

Overview

Elevate your power management solutions with the L6382DTR from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for reliability in demanding environments, this robust IC delivers exceptional performance across various applications, including automotive systems and industrial automation. Its compact design ensures easy integration, while its wide operating temperature range guarantees operation in extreme conditions. Experience unmatched quality and efficiency, empowering your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizes durable and cost-effective plastic/epoxy materials suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB design and automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

Rectangular package shape is optimized for space efficiency and suitable for high-density layouts.

Nominal Supply Voltage (Vsup): 12 V

Nominal 12V operation is ideal for a wide range of applications, ensuring compatibility with common power supply systems.

Power Supplies (V): 12

Flexibility of being powered by a standard 12V supply enhances its usability across various devices.

No. of Terminals: 20

Twenty terminals provide ample connectivity options for integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

Small outline design offers a low-profile option that is optimal for compact electronic configurations.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliable performance in demanding thermal environments.

Minimum Operating Temperature: -40 °C

Effectively operates in extreme cold conditions, making it suitable for automotive and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish enhances solderability and provides excellent protection against corrosion.

Terminal Position: DUAL

Dual terminal positioning simplifies layout and improves accessibility in circuit design.

Maximum Seated Height: 2.65 mm

Low profile design accommodates space-constrained applications, facilitating integration in tight spaces.

Width: 7.5 mm

Compact width allows for higher density of components on a PCB, maximizing design efficiency.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power management IC, it effectively supports power supply design, enhancing system reliability.

Minimum Supply Voltage (Vsup): 9 V

Operational compatibility with a minimum 9V supply ensures wide application in various power scenarios.

Maximum Time At Peak Reflow Temperature: 30 s

Tolerance for extended reflow time promotes ease of manufacturing while maintaining component integrity.

Peak Reflow Temperature: 260 °C

High reflow temperature capability supports soldering processes for modern PCB assembly techniques.

Length: 12.8 mm

Length allows for efficient use of space while providing sufficient footprint for functionality.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures reliability and safety for use in vehicle applications, meeting stringent industry standards.

Technology: BCDMOS

BCD technology enhances efficiency and integration, suitable for high-performance power management applications.

Terminal Form: GULL WING

Gull wing terminals offer reliable mechanical support and ease of soldering, enhancing assembly robustness.

Terminal Pitch: 1.27 mm

Standard 1.27 mm pitch is widely supported and ensures compatibility with various PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates proper handling requirements, contributing to longevity and reliability during storage and use.

Maximum Supply Voltage (Vsup): 15 V

Maximum supply capability of 15V offers versatility for higher voltage applications without compromising performance.

Technical Specifications

Power Management ICs L6382DTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L6382DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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