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L6382D5TR

STMicroelectronics

L6382D5TR by STMicroelectronics

L6382D5TR by STMicroelectronics is a robust power management IC designed for automotive applications, featuring a nominal voltage of 13V and operating temperatures from -40 °C to 125 °C. It comes in a compact 20-terminal SO package with BCDMOS technology. Ideal for efficient power supply support, it ensures reliability in demanding environments.

Median Price

$4.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 982 parts In-Stock

1+ parts

$4.480

100+ parts

$2.300

1k+ parts

$1.650

10k+ parts

$1.560

982

$4.480

$2.300

$1.650

$1.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,854 parts In-Stock

1+ parts

$3.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,854

$3.572

-

-

-

Vyrian

USA . 4,389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,389

-

-

-

-

Pegasus Components GmbH

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Anansix

USA . 1,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,765

-

-

-

-

ComSIT Distribution GmbH

Germany . 701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

701

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 435 parts In-Stock

1+ parts

$1.602

100+ parts

-

1k+ parts

$1.442

10k+ parts

-

435

$1.602

-

$1.442

-

Vigor

Singapore . 2,374 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,374

$1.940

-

-

-

MKK Technologies

India . 1,077 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

-

1,077

$3.012

-

-

-

DigiPath Technology Company

USA . 1,077 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

-

1,077

$3.012

-

-

-

Corphita

USA . 4,361 parts In-Stock

1+ parts

$3.384

100+ parts

-

1k+ parts

-

10k+ parts

-

4,361

$3.384

-

-

-

Component Stockers USA

USA . 700 parts In-Stock

1+ parts

$3.890

100+ parts

$2.860

1k+ parts

-

10k+ parts

-

700

$3.890

$2.860

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$7.901

100+ parts

$7.190

1k+ parts

$6.479

10k+ parts

-

3,000

$7.901

$7.190

$6.479

-

Microchip USA

USA . 3,158 parts In-Stock

1+ parts

$14.417

100+ parts

-

1k+ parts

-

10k+ parts

-

3,158

$14.417

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,826 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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24,826

-

-

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,000

-

-

-

-

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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8,000

-

-

-

-

Metaverse IC Inc.

Canada . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Parana Technologies

USA . 795 parts In-Stock

1+ parts

-

100+ parts

$1.915

1k+ parts

-

10k+ parts

-

795

-

$1.915

-

-

Overview

Unlock the potential of your designs with the L6382D5TR from STMicroelectronics, a leader in innovative power management solutions. This robust IC delivers exceptional performance across automotive applications, ensuring reliability even in extreme conditions. With its compact package and advanced technology, it simplifies integration while enhancing efficiency. Trust STMicroelectronics to elevate your projects, providing unmatched quality and support for a brighter, more powerful future.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount component allows for easier integration onto PCBs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and space usage on the printed circuit board.

Nominal Supply Voltage (Vsup): 13 V

With a nominal supply voltage of 13V, this component is perfect for typical automotive and industrial applications requiring stable voltage.

Power Supplies (V): 12

Support for 12V power supplies makes this IC compatible with commonly used power systems, enhancing its versatility.

No. of Terminals: 20

Having 20 terminals allows for more complex functionality and interconnections needed in power management applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, essential for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in demanding environments, typical in automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for use in harsh climatic conditions, enhancing its reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish offers excellent protection against corrosion and ensures good electrical conductivity and reliability.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and improves accessibility for connections, facilitating easier integration.

Maximum Seated Height: 2.65 mm

A low maximum seated height promotes better thermal management and integration into low-profile electronic designs.

Width: 7.5 mm

A width of 7.5 mm balances size with functionality, making it compatible with a wide range of PCB layouts.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit means this IC can effectively manage voltage regulation and supply stability.

Minimum Supply Voltage (Vsup): 9 V

A minimum supply voltage of 9V ensures flexibility and compatibility with a broad range of applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum peak reflow temperature time of 30 seconds ensures reliable soldering processes during assembly.

Peak Reflow Temperature: 260 °C

The ability to withstand peak reflow temperatures of 260 °C supports compatibility with modern soldering techniques.

Length: 12.8 mm

At 12.8 mm in length, this IC offers a good balance of performance and compactness for diverse design approaches.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies that this IC is designed for reliability and performance in automotive applications, even in extreme conditions.

Technology: BCDMOS

The BCDMOS technology allows for high efficiency and integration of analog and digital functions, optimizing performance.

Terminal Form: GULL WING

Gull wing terminal form provides ease of soldering and reliable connections on PCBs, enhancing assembly efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layout while ensuring reliability and ease of assembly.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates good robustness, allowing for reasonable handling before assembly.

Maximum Supply Voltage (Vsup): 15 V

With a maximum supply voltage of 15V, this IC is versatile and can accommodate various power supply configurations.

Technical Specifications

Power Management ICs L6382D5TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L6382D5TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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