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L6382D

STMicroelectronics

L6382D by STMicroelectronics

L6382D by STMicroelectronics is a robust power management IC designed for automotive applications, operating b/w -40 °C to 125 °C. It supports supply voltages from 9V to 15V and features a compact 20-terminal SO package. Ideal for efficient power supply support, it utilizes BCDMOS technology.

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,216 parts In-Stock

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2,216

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Anansix

USA . 1,106 parts In-Stock

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1,106

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ACDS - Activité Composants Distribution Service

France . 960 parts In-Stock

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960

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Bristol Electronics

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$1.314

1k+ parts

$1.154

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-

960

-

$1.314

$1.154

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Dan-Mar Components

USA . 960 parts In-Stock

1+ parts

-

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960

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ComSIT Distribution GmbH

Germany . 919 parts In-Stock

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919

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Digiode

USA . 192 parts In-Stock

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192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,945 parts In-Stock

1+ parts

$1.940

100+ parts

-

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-

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-

2,945

$1.940

-

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Ampacity Inc.

Singapore . 1,622 parts In-Stock

1+ parts

$2.500

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-

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1,622

$2.500

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Microchip USA

USA . 3,648 parts In-Stock

1+ parts

$14.417

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-

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3,648

$14.417

-

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IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$17.484

100+ parts

-

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$15.735

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113

$17.484

-

$15.735

-

AZTECH Wire

Italy . 148 parts In-Stock

1+ parts

$21.060

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148

$21.060

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MKK Technologies

India . 1,296 parts In-Stock

1+ parts

$32.877

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1,296

$32.877

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DigiPath Technology Company

USA . 1,296 parts In-Stock

1+ parts

$32.877

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1,296

$32.877

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Kepictronics

USA . 6,867 parts In-Stock

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6,867

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A-Z Elektronik GmbH

Germany . 2,697 parts In-Stock

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2,697

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Alle Elektronik GmbH

Germany . 1,798 parts In-Stock

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1,798

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Corphita

USA . 670 parts In-Stock

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670

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Parana Technologies

USA . 9 parts In-Stock

1+ parts

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100+ parts

$20.904

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9

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$20.904

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Overview

Elevate your power management solutions with the L6382D from STMicroelectronics, a trusted leader in innovation. Designed for exceptional performance in automotive applications, this compact Power Management IC ensures reliability even in extreme environments. With its robust construction and advanced technology, you gain enhanced efficiency and longevity, making it the perfect choice for demanding projects. Experience unmatched quality and support from an industry pioneer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials makes the IC lightweight and suitable for a variety of applications while providing good insulation properties.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient use of board space and simplifies layout in compact circuits.

Nominal Supply Voltage (Vsup): 12 V

With a nominal supply voltage of 12V, this IC is compatible with many standard power supply systems.

Power Supplies (V): 12

Supports a stable 12V input, ensuring reliable performance in power management applications.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and enhanced functionality within various circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates higher component density, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit of 125 °C, this IC is designed for reliability in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC ideal for automotive and industrial applications where extreme conditions are common.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent solderability and reliability, minimizing oxidation and corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for simplified routing on PCB layouts and better integration in multi-layer designs.

Maximum Seated Height: 2.65 mm

A low profile of 2.65 mm accommodates slim design requirements prevalent in portable devices.

Width: 7.5 mm

A compact width of 7.5 mm aids in optimizing board space while still providing adequate connectivity.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply applications, this IC enhances overall system efficiency and regulation.

Minimum Supply Voltage (Vsup): 9 V

The lower supply voltage of 9V allows for flexibility in power sources, accommodating varying system designs.

Maximum Time At Peak Reflow Temperature (s): 30

Supports manufacturing processes with a maximum peak reflow time of 30 seconds, ensuring compatibility with common assembly techniques.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability indicates robustness to heat cycles in PCB assembly, ensuring product durability.

Length: 12.8 mm

Measured at 12.8 mm, the length is optimized for a variety of electronic applications while maintaining space efficiency.

Temperature Grade: AUTOMOTIVE

Automotive grade qualification guarantees reliability and performance under challenging automotive standards.

Technology: BCDMOS

BCDMOS technology provides high efficiency and performance, enhancing power management effectiveness.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves the mechanical strength of the connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances space-saving needs and soldering ease, compatible with standard PCB design practices.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate moisture sensitivity, ensuring handling requirements are well defined for reliability.

Maximum Supply Voltage (Vsup): 15 V

With a maximum supply voltage of 15V, the IC provides the flexibility to accommodate varying supply conditions safely.

Technical Specifications

Power Management ICs L6382D attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L6382D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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