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IRF250

STMicroelectronics

IRF250 by STMicroelectronics

STMicroelectronics' IRF250 is a N-CHANNEL FET with 200V DS Breakdown Voltage and 120A IDM. Ideal for SWITCHING applications, it features a 0.085 ohm Drain-Source On Resistance and 150W Power Dissipation, making it suitable for high-power circuits.

Median Price

$21.480

Lifecycle Status

Suppliers In-Stock

35

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1k+

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Chip1Stop

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Nova Conductors

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Bristol Electronics

USA . 4,672 parts In-Stock

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American Microsemiconductor Inc.

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Vyrian

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Digiode

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Right Parts Inc.

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Pegasus Components GmbH

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Electro Mavin

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Prism Electronics

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North Shore Components

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Netsource Technology, Inc.

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Electronics Depot

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Mil-Aero Solutions, Inc.

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Fibra_Brandt Electronic GMBH

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Corel Iberica Componentes, S.L.

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4 Star Electronics, Inc.

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First Choice Components Inc.

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Electronic Expediters

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 9,793 parts In-Stock

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$1.655

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$1.589

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$1.523

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IDEA Electronic Components Group

UK . 9 parts In-Stock

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$1.675

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MKK Technologies

India . 1,078 parts In-Stock

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DigiPath Technology Company

USA . 1,078 parts In-Stock

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AZTECH Wire

Italy . 729 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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$13.991

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Continental Prestige Electronics

USA . 6,287 parts In-Stock

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$14.871

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A-Z Elektronik GmbH

Germany . 5,349 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 3,566 parts In-Stock

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Supply Digital

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Parana Technologies

USA . 1,720 parts In-Stock

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Perfect Parts

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Kepictronics

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Eliminating Global Boundries, Inc

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Assy Fe

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Overview

Upgrade your power systems with the IRF250 by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL power FET offers unparalleled performance in switching applications. With a high voltage breakdown and a built-in diode, this transistor guarantees reliability and efficiency. Say goodbye to power limitations and hello to seamless operation with the IRF250. Whether you're looking to enhance your industrial equipment or boost your renewable energy systems, this powerhouse transistor is the perfect solution. Experience the difference that quality and innovation can make in your projects with the IRF250 from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal in the package body provides better heat dissipation, making this product suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current-carrying capability, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against back EMF, making this product reliable for various applications.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can safely handle high voltages, ensuring reliability in demanding conditions.

Package Shape: ROUND

The round package shape provides easy mounting and handling, making this product convenient for assembly and installation.

Terminal Form: PIN/PEG

The pin/peg terminal form allows for easy connection and installation in a variety of circuits, enhancing the product's versatility.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control and higher efficiency, making this product suitable for precise switching applications.

Maximum Pulsed Drain Current (IDM): 120 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without compromising performance, making it reliable in dynamic applications.

Avalanche Energy Rating (EAS): 910 mJ

The high avalanche energy rating allows for reliable operation in high-energy transient conditions, ensuring the product's durability.

No. of Terminals: 2

With two terminals, this FET offers simplicity and ease of use in circuit design and connection, making it a convenient choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) IRF250 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

910 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

300 pF

JEDEC-95 Code:

TO-3

JESD-30 Code:

O-MBFM-P2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

150 W

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF250 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-273-0764, 5961012730764, 5961-01-322-7092, 5961013227092, 5961-99-253-5749, 5961992535749

NIIN

012730764, 013227092, 992535749

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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