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FDA802-VYT

STMicroelectronics

FDA802-VYT by STMicroelectronics

FDA802-VYT by STMicroelectronics is a Class D audio amplifier with a nominal output power of 360 W and operates b/w 5.5 V to 50 V. It features a low-profile, flatpack design with 64 terminals for efficient surface mounting. Ideal for high-performance audio applications, it meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,960 parts In-Stock

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7,960

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Digiode

USA . 2,419 parts In-Stock

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2,419

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Anansix

USA . 1,524 parts In-Stock

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1,524

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,503 parts In-Stock

1+ parts

$2.607

100+ parts

-

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1,503

$2.607

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IDEA Electronic Components Group

UK . 827 parts In-Stock

1+ parts

$3.012

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-

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$2.711

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827

$3.012

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$2.711

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MKK Technologies

India . 99 parts In-Stock

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$5.664

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99

$5.664

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DigiPath Technology Company

USA . 99 parts In-Stock

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$5.664

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99

$5.664

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AZTECH Wire

Italy . 951 parts In-Stock

1+ parts

$20.360

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951

$20.360

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Microchip USA

USA . 3,480 parts In-Stock

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$28.459

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3,480

$28.459

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Corphita

USA . 4,195 parts In-Stock

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4,195

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RC Electronics

USA . 1,623 parts In-Stock

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1,623

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Parana Technologies

USA . 1,396 parts In-Stock

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$3.601

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1,396

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$3.601

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Vigor

Singapore . 424 parts In-Stock

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424

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Native Components

USA . 143 parts In-Stock

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$2.299

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143

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$2.299

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Overview

Elevate your audio experience with the FDA802-VYT from STMicroelectronics—a powerful Class D audio amplifier designed for exceptional sound quality and reliability. Built with automotive-grade screening, it ensures durability and performance in demanding environments. Its compact design allows for seamless integration into various applications, from home theater systems to professional audio setups, delivering 360W of rich, immersive sound that transforms any project. Choose STMicroelectronics for unmatched quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, ensuring the amplifier's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, making this amplifier suitable for modern electronics.

Screening Level: AEC-Q100

This screening level denotes high reliability, making it ideal for automotive and critical applications.

Package Shape: SQUARE

The square shape aids in uniform heat distribution, enhancing thermal performance during operation.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D technology delivers high efficiency, reducing power waste and allowing for smaller heatsinks.

No. of Terminals: 64

A high number of terminals allows for versatile connections and additional functionalities in the circuit design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

These features support efficient heat dissipation and a low-profile design, making it suitable for compact applications.

Terminal Position: QUAD

Quad terminal positioning enables better electrical performance and reduces inductance in high-frequency applications.

Nominal Output Power: 360 W

High output power ensures robust audio performance, suitable for a wide range of audio applications.

Maximum Seated Height: 1.49 mm

This low profile allows for integration into compact devices where space is a premium.

Width: 10 mm

A compact width enables easy fit within tight spaces in electronic designs.

Minimum Supply Voltage (Vsup): 5.5 V

Allows operation in low-voltage environments, making it versatile for various applications.

Length: 10 mm

Short length contributes to its compactness, ideal for space-constrained applications.

No. of Channels: 2

Dual-channel design is perfect for stereo audio applications, providing an immersive sound experience.

Technology: BCD

BCD technology enhances performance while reducing power consumption, contributing to efficient designs.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and offer ease of handling during assembly.

Terminal Pitch: 0.5 mm

A fine pitch allows for high-density placement, enabling more functionality in a smaller footprint.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, making it suitable for a variety of assembly processes and environments.

Maximum Supply Voltage (Vsup): 50 V

With a high maximum voltage, it provides flexibility for demanding audio applications requiring substantial power.

Technical Specifications

Audio & Video Amplifiers FDA802-VYT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Nominal Output Power:

360 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.49 mm

Maximum Supply Voltage (Vsup):

50 V

Minimum Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

FDA802-VYT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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