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FDA802B-VYT

STMicroelectronics

FDA802B-VYT by STMicroelectronics

FDA802B-VYT by STMicroelectronics is a Class D audio amplifier with 360 W output power and AEC-Q100 screening, ideal for automotive applications. It features a compact flatpack design (10x10 mm) and operates b/w 5.5 V to 50 V supply voltage. With 2 channels and low profile, it ensures efficient audio performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,372 parts In-Stock

1+ parts

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2,372

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Anansix

USA . 2,265 parts In-Stock

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2,265

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Vyrian

USA . 2,054 parts In-Stock

1+ parts

-

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2,054

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 109 parts In-Stock

1+ parts

$1.100

100+ parts

-

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109

$1.100

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Northwest PG Solutions

USA . 1,883 parts In-Stock

1+ parts

$1.211

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1,883

$1.211

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IDEA Electronic Components Group

UK . 2,356 parts In-Stock

1+ parts

$1.870

100+ parts

-

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$1.683

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2,356

$1.870

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$1.683

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MKK Technologies

India . 1,088 parts In-Stock

1+ parts

$3.517

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1,088

$3.517

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DigiPath Technology Company

USA . 1,088 parts In-Stock

1+ parts

$3.517

100+ parts

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1,088

$3.517

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AZTECH Wire

Italy . 893 parts In-Stock

1+ parts

$10.940

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893

$10.940

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Microchip USA

USA . 2,620 parts In-Stock

1+ parts

$29.198

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2,620

$29.198

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 2,949 parts In-Stock

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2,949

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Parana Technologies

USA . 836 parts In-Stock

1+ parts

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100+ parts

$2.236

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836

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$2.236

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Vigor

Singapore . 163 parts In-Stock

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163

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Overview

Elevate your audio experience with the FDA802B-VYT from STMicroelectronics, a leader in innovative semiconductor solutions. This Class D amplifier delivers stunning sound quality and exceptional power efficiency, making it perfect for automotive and consumer electronics applications. Designed with AEC-Q100 screening, it ensures reliability even in challenging environments. Choose STMicroelectronics for unparalleled performance that transforms ordinary sound into extraordinary experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy in the package body ensures reliability and longevity under various operating conditions.

Surface Mount: YES

Being surface mount compatible allows for efficient space utilization and easier integration into compact electronic designs.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards indicates that this amplifier is designed for automotive applications, ensuring high quality and reliability.

Package Shape: SQUARE

The square package shape offers simplicity in PCB layout and helps optimize the area on the circuit board.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D design is known for high efficiency and low heat generation, making this amplifier ideal for audio applications.

No. of Terminals: 64

A higher number of terminals allows for more versatile connections and features, enabling advanced functionality.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style supports effective heat dissipation and allows for low-profile designs suitable for modern compact devices.

Terminal Position: QUAD

The quad terminal position can facilitate better electrical performance and improved layout flexibility.

Nominal Output Power: 360 W

With a nominal output of 360 W, this amplifier can drive powerful audio systems, making it ideal for high-performance applications.

Maximum Seated Height: 1.49 mm

The low seated height allows for better integration into space-constrained designs, making it suitable for slim products.

Width: 10 mm

A width of 10 mm contributes to a compact design, making it fit well in smaller audio devices.

Minimum Supply Voltage (Vsup): 5.5 V

A low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility.

Length: 10 mm

The 10 mm length complements its width for a compact footprint, ideal for space-efficient applications.

No. of Channels: 2

With two channels, this amplifier is suitable for driving stereo audio systems, providing a richer sound experience.

Technology: BCD

BCD technology enhances efficiency, making this amplifier suitable for battery-powered devices due to lower power consumption.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and ease of assembly in manufacturing.

Terminal Pitch: 0.5 mm

The small 0.5 mm terminal pitch allows for denser layouts on PCBs, which is ideal for advanced electronic designs.

Maximum Supply Voltage (Vsup): 50 V

A high maximum supply voltage gives the amplifier greater versatility and the ability to handle more demanding audio applications.

Technical Specifications

Audio & Video Amplifiers FDA802B-VYT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Nominal Output Power:

360 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.49 mm

Maximum Supply Voltage (Vsup):

50 V

Minimum Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

FDA802B-VYT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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