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F273-CEG-P

STMicroelectronics

F273-CEG-P by STMicroelectronics

STMicroelectronics F273-CEG-P microcontroller features 16-bit CPU, 24-bit address bus, and 16-bit external data bus. Ideal for automotive applications with peripherals like POR, PWM(8), RTC, TIMER(5), WDT and connectivity options such as ASC(2), CAN(2), I2C, SSC(2). Operating temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,560 parts In-Stock

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3,560

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Digiode

USA . 3,194 parts In-Stock

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3,194

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Anansix

USA . 2,538 parts In-Stock

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2,538

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ComSIT Distribution GmbH

Germany . 240 parts In-Stock

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240

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 722 parts In-Stock

1+ parts

$13.000

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-

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722

$13.000

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$18.254

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723

$18.254

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Aztec Data Supply Inc.

USA . 1,527 parts In-Stock

1+ parts

$61.420

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1,527

$61.420

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IDEA Electronic Components Group

UK . 2,152 parts In-Stock

1+ parts

$64.207

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$57.786

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2,152

$64.207

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$57.786

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MKK Technologies

India . 1,982 parts In-Stock

1+ parts

$120.737

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1,982

$120.737

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DigiPath Technology Company

USA . 1,982 parts In-Stock

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$120.737

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1,982

$120.737

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Continental Prestige Electronics

USA . 4,832 parts In-Stock

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Microchip USA

USA . 4,246 parts In-Stock

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Argo Parts USA

USA . 3,360 parts In-Stock

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Parana Technologies

USA . 2,291 parts In-Stock

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$76.769

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$76.769

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Corphita

USA . 2,191 parts In-Stock

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2,191

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Corohmni

South Africa . 257 parts In-Stock

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257

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Discover the cutting-edge F273-CEG-P microcontroller by STMicroelectronics, a top-tier manufacturer known for quality and innovation. Ideal for automotive applications, this high-performance device offers a wide range of peripherals and features like PWM, RTC, and WDT. With its advanced technology and reliable performance, the F273-CEG-P provides exceptional value to customers seeking efficient solutions in the microcontroller category. Unlock new possibilities with this versatile and powerful product designed to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and provides good protection for the components inside the microcontroller package.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the microcontroller onto a circuit board, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatility in power supply options and compatibility with a wide range of electronic systems.

Address Bus Width: 24

A wider address bus width enables access to a larger memory space, making the microcontroller suitable for handling complex and data-intensive tasks.

Bit Size: 16

A 16-bit architecture provides good balance between performance and cost, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 5

This standard power supply voltage makes it easy to provide the required power to the microcontroller in most electronic systems.

No. of Terminals: 144

With a high number of terminals, this microcontroller offers a variety of input/output options, making it versatile and suitable for complex circuits.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller, it is optimized for high performance and efficient processing of instructions.

Maximum Clock Frequency: 64 MHz

The high clock frequency allows for fast processing speeds, making this microcontroller suitable for applications that require quick response times.

RAM Bytes: 36864

With a large amount of RAM, this microcontroller can handle multiple tasks simultaneously and store a significant amount of data for processing.

Technical Specifications

Microcontrollers F273-CEG-P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F273-CEG-P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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