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F273-CEG-T

STMicroelectronics

F273-CEG-T by STMicroelectronics

F273-CEG-T by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 125 °C. It features 144 terminals, supports various connectivity options, and includes ADC channels for versatile applications. Ideal for automotive use, it combines performance with reliability in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,892 parts In-Stock

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1,892

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Digiode

USA . 1,158 parts In-Stock

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1,158

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Anansix

USA . 1,125 parts In-Stock

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1,125

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Distributors (Availability)

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Native Components

USA . 176 parts In-Stock

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$1.597

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176

$1.597

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Northwest PG Solutions

USA . 1,517 parts In-Stock

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$1.756

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1,517

$1.756

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AZTECH Wire

Italy . 475 parts In-Stock

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$11.360

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475

$11.360

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Microchip USA

USA . 427 parts In-Stock

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$31.476

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427

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IDEA Electronic Components Group

UK . 573 parts In-Stock

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$54.953

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$49.458

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573

$54.953

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$49.458

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MKK Technologies

India . 388 parts In-Stock

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$103.336

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388

$103.336

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DigiPath Technology Company

USA . 388 parts In-Stock

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$103.336

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388

$103.336

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Corphita

USA . 3,682 parts In-Stock

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3,682

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Parana Technologies

USA . 1,801 parts In-Stock

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$65.705

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$65.705

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Overview

Elevate your designs with the F273-CEG-T microcontroller from STMicroelectronics, a trusted leader in innovative technology. Engineered for reliability and performance, this high-quality component is perfect for automotive applications, offering exceptional temperature tolerance and robust connectivity options. Benefit from its powerful capabilities while ensuring longevity and efficiency in your projects—transforming ideas into reality with unmatched precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensures reliability and resilience in various environments.

Surface Mount: YES

Allows for compact design and ease of integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options while ensuring stable performance.

Address Bus Width: 24

Enhances the ability to access larger memory spaces effectively.

Package Shape: SQUARE

Efficient layout for PCB design, minimizing space usage.

Bit Size: 16

Strikes a balance between performance and resource usage, suitable for many applications.

Power Supplies (V): 5

Common supply voltage facilitates easy integration with existing systems.

No. of Terminals: 144

Provides numerous connection options for diverse peripherals and applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained designs, promoting efficient use of PCB real estate.

Minimum Supply Voltage: 4.5 V

Operational range ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, making it ideal for automotive applications.

CPU Family: ST10

Proven architecture provides robust performance for a wide range of applications.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme environments, suitable for automotive and industrial applications.

Terminal Finish: MATTE TIN

Enhances solderability and provides corrosion resistance for improved longevity.

ADC Channels: YES

Enables analog input processing, essential for sensor applications.

Terminal Position: QUAD

Facilitates efficient space use and connections in complex designs.

ROM Words: 131072

Provides ample program storage capacity for complex applications.

Maximum Seated Height: 1.6 mm

Low profile allows for integration into slim devices and ease of cooling.

Width: 20 mm

Standard width accommodates a wide range of PCB layouts.

External Data Bus Width: 16

Facilitates efficient data transfer rates, enhancing system performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Rich set of peripherals supports diverse functionalities required in modern applications.

Maximum Clock Frequency: 64 MHz

High operating frequency ensures quick processing and responsiveness.

Maximum Time At Peak Reflow Temperature: 40 s

Optimized for soldering processes, ensuring reliable assembly without damage.

Peak Reflow Temperature: 260 °C

Compatible with high-temperature soldering processes, facilitating robust assembly.

Length: 20 mm

Standard length promotes compatibility with various board layouts.

Temperature Grade: AUTOMOTIVE

Designed to withstand the temperature extremes encountered in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers efficient instruction sets for high-performance applications.

RAM Bytes: 36864

Sufficient RAM for handling complex operations and data processing.

Technology: CMOS

Low power consumption allows for energy-efficient designs, crucial for battery-operated devices.

Terminal Form: GULL WING

Common form factor provides ease of assembly and robustness.

Analog To Digital Converters: 24-Ch 10-Bit

Supports high-resolution inputs, essential for sensor interfacing and data acquisition.

Nominal Supply Voltage: 5 V

A widely used voltage standard facilitates easy integration and availability of components.

PWM Channels: YES

Facilitates control of motors and other devices requiring variable output.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Versatile connectivity options enable integration into diverse communication networks.

ROM Programmability: FLASH

Flash memory allows for reprogramming, offering flexibility for updates and modifications.

Terminal Pitch: 0.5 mm

Fine pitch design accommodates complex circuitry in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

Good handling characteristics provide assurance against moisture-related failures.

Speed: 40 rpm

Indicates a reliable operational speed suitable for many control applications.

On Chip Program ROM Width: 32

Wider ROM enables processing of complex instructions, enhancing overall performance.

No. of I/O Lines: 111

A high number of I/O lines supports a multitude of interfacing options for peripherals.

Technical Specifications

Microcontrollers F273-CEG-T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F273-CEG-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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