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F273-CEG-P-TR

STMicroelectronics

F273-CEG-P-TR by STMicroelectronics

STMicroelectronics F273-CEG-P-TR is a 16-bit microcontroller with 24-bit address bus width, operating at up to 64 MHz. Ideal for automotive applications, it features 24 ADC channels, 8 PWM peripherals, and connectivity options like CAN and I2C. With a wide temperature range (-40 to 125 °C), this CMOS technology-based MCU offers versatile performance in compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,966 parts In-Stock

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7,966

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Anansix

USA . 2,187 parts In-Stock

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2,187

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Digiode

USA . 1,529 parts In-Stock

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1,529

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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Ampacity Inc.

Singapore . 793 parts In-Stock

1+ parts

$7.000

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793

$7.000

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AZTECH Wire

Italy . 580 parts In-Stock

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$15.674

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580

$15.674

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Aztec Data Supply Inc.

USA . 657 parts In-Stock

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$18.090

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657

$18.090

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IDEA Electronic Components Group

UK . 2,345 parts In-Stock

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$61.883

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$55.695

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2,345

$61.883

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$55.695

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Corohmni

South Africa . 166 parts In-Stock

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$63.063

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166

$63.063

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MKK Technologies

India . 1,881 parts In-Stock

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$116.367

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1,881

$116.367

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DigiPath Technology Company

USA . 1,881 parts In-Stock

1+ parts

$116.367

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1,881

$116.367

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Microchip USA

USA . 4,384 parts In-Stock

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4,384

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Corphita

USA . 2,634 parts In-Stock

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Argo Parts USA

USA . 1,786 parts In-Stock

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Continental Prestige Electronics

USA . 1,684 parts In-Stock

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Parana Technologies

USA . 1,454 parts In-Stock

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$73.990

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1,454

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$73.990

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Bastille Electronics

Australia . 650 parts In-Stock

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650

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Overview

Discover the cutting-edge F273-CEG-P-TR microcontroller by STMicroelectronics, a superior choice for your electronic projects. With a wide range of applications, this high-quality product offers unmatched value and benefits to customers. Trust in the reliability and innovation of STMicroelectronics as you explore the endless possibilities that this microcontroller brings to your designs. Upgrade your projects with the F273-CEG-P-TR and experience the advantages of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can handle higher voltage input requirements, providing flexibility in power supply options.

Address Bus Width: 24

The 24-bit address bus width allows for access to a large memory range, enabling efficient data processing and storage capabilities.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for easy integration into electronic systems.

Bit Size: 16

With a 16-bit architecture, this microcontroller offers improved processing capabilities and performance for handling complex tasks.

Power Supplies (V): 5

The 5 V power supply ensures compatibility with standard voltage levels, making it easy to integrate into existing systems.

No. of Terminals: 144

With 144 terminals, this microcontroller offers a wide range of connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient thermal dissipation, making it ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures stable operation even under varying voltage conditions, enhancing reliability.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microcontroller can withstand high temperature environments, ensuring reliability in harsh conditions.

CPU Family: ST10

The ST10 CPU family offers high performance and efficiency, making this microcontroller suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows for reliable operation in cold environments, ensuring versatility in temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and solderability, making it ideal for long-term use and reliability.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position offers a secure and stable connection for interfacing with external components, ensuring reliable performance.

ROM Words: 131072

With a ROM size of 131072 words, this microcontroller provides ample memory for storing program instructions and data.

Maximum Seated Height: 4.07 mm

The maximum seated height of 4.07 mm allows for a compact design, making it suitable for applications with height restrictions.

Width: 28 mm

The 28 mm width offers a balance between compactness and connectivity options, making it versatile for various design requirements.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer and processing, enhancing overall performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

The inclusion of various peripherals such as PWM, RTC, and timers enhances the functionality and versatility of the microcontroller for different applications.

Maximum Clock Frequency: 64 MHz

With a maximum clock frequency of 64 MHz, this microcontroller offers high-speed operation for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for robust solder connections, ensuring durability and performance under thermal stress.

Length: 28 mm

The 28 mm length provides a compact form factor, making it suitable for space-constrained applications without compromising connectivity options.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in challenging automotive environments, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller design offer efficient processing and control capabilities, making it ideal for embedded systems and IoT applications.

RAM Bytes: 36864

With a RAM size of 36864 bytes, this microcontroller provides sufficient memory for data storage and processing, enhancing overall performance.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and stable connection during soldering, ensuring reliable performance and durability in various applications.

Analog To Digital Convertors: 24-Ch 10-Bit

The 24-channel 10-bit ADC feature enables accurate analog-to-digital conversion, making the microcontroller suitable for precision measurement and sensor interfacing.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making it easy to integrate into a wide range of electronic systems.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse-width modulation signals, making the microcontroller suitable for motor control and power management applications.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

The connectivity options including ASC, CAN, I2C, and SSC interfaces offer versatile communication capabilities for connecting to various devices and systems.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible updating of firmware and program code, enabling customization and adaptability to changing requirements.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm provides a fine-pitch design for high-density mounting, maximizing board space utilization in compact electronic designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this microcontroller has moderate sensitivity to moisture during soldering and storage, requiring appropriate handling and storage precautions.

Speed: 64 rpm

The operating speed of 64 rpm enables efficient processing and execution of instructions, ensuring fast and responsive performance in real-time applications.

On Chip Program ROM Width: 32

The on-chip program ROM width of 32 bits allows for storing and executing program instructions with high efficiency and speed, enhancing overall performance.

No. of I/O Lines: 111

With 111 I/O lines, this microcontroller offers flexibility for connecting to external devices and peripherals, enabling versatile input/output functionality for various applications.

Technical Specifications

Microcontrollers F273-CEG-P-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F273-CEG-P-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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