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F273-CEG-T-TR

STMicroelectronics

F273-CEG-T-TR by STMicroelectronics

F273-CEG-T-TR by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. It features 144 terminals, supports multiple connectivity options, and includes ADC channels for versatile applications. Ideal for industrial automation, it combines performance with reliability in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,970 parts In-Stock

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4,970

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Anansix

USA . 2,448 parts In-Stock

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2,448

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Vyrian

USA . 2,410 parts In-Stock

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2,410

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Distributors (Availability)

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AZTECH Wire

Italy . 879 parts In-Stock

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$8.670

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879

$8.670

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Microchip USA

USA . 144 parts In-Stock

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$27.233

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144

$27.233

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

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$33.005

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$29.704

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1,418

$33.005

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$29.704

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MKK Technologies

India . 816 parts In-Stock

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$62.064

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816

$62.064

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DigiPath Technology Company

USA . 816 parts In-Stock

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$62.064

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816

$62.064

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Northwest PG Solutions

USA . 1,747 parts In-Stock

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Native Components

USA . 795 parts In-Stock

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795

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Parana Technologies

USA . 659 parts In-Stock

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$39.462

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659

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$39.462

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Corphita

USA . 393 parts In-Stock

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Overview

Unlock unparalleled performance with the F273-CEG-T-TR microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for diverse applications, this robust yet compact device excels in industrial automation, automotive systems, and consumer electronics. Its advanced features ensure high efficiency and seamless connectivity, while ST's commitment to quality guarantees longevity and exceptional support. Elevate your projects with a microcontroller that combines cutting-edge technology and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact designs and enables the creation of smaller electronic circuits.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage supports a wide operating range for various applications while ensuring compatibility with standard power supplies.

Address Bus Width: 24

A 24-bit address bus width allows for more addressable memory space, facilitating complex processing tasks and larger applications.

Package Shape: SQUARE

The square package shape ensures uniformity in mounting and helps in optimizing board space usage.

Bit Size: 16

With a 16-bit architecture, this microcontroller balances performance and power consumption, making it suitable for efficient processing.

Power Supplies (V): 5

Operating at a nominal voltage of 5V aligns with many existing systems, ensuring easy compatibility and integration.

No. of Terminals: 144

A high number of terminals allows for greater connectivity options and enables support for various peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for modern PCB designs that prioritize space efficiency while maintaining performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage enhances reliability in lower voltage scenarios, making it suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

High temperature tolerance ensures functionality in harsh environments, making this microcontroller ideal for industrial applications.

CPU Family: ST10

Utilizing the ST10 family allows for optimized performance with established compatibility across various development tools.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures enhances the microcontroller's usability in outdoor and extreme-condition applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable long-term performance of connections.

ADC Channels: YES

Having ADC channels onboard allows for direct analog input processing, making it suitable for sensor applications.

Terminal Position: QUAD

The quad terminal position facilitates efficient PCB layout and routing, enhancing design flexibility.

ROM Words: 131072

With a substantial number of ROM words, this microcontroller can store significant amounts of firmware/code, allowing for complex applications.

Maximum Seated Height: 1.6 mm

A low profile height minimizes space requirements on the PCB, fitting well into slim designs.

Width: 20 mm

The compact width further aids in space-efficient designs while maintaining robust performance.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer, crucial for high-speed applications.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

A rich set of peripherals enhances functionality and allows for diverse application needs, adding value for developers.

Maximum Clock Frequency: 64 MHz

A high clock frequency ensures fast processing speeds, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

The optimized reflow temperature profile supports modern assembly processes, ensuring reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperatures accommodate the latest soldering technologies, ensuring compatibility with standard manufacturing processes.

Length: 20 mm

The standardized length simplifies PCB design and allows for easier integration into existing layouts.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable operation in challenging environments, making it suitable for long-term applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient execution of instructions, which contributes to low power consumption and high performance.

RAM Bytes: 36864

Sufficient RAM size allows for smooth operations and handling of complex data processing tasks, essential for real-time applications.

Technology: CMOS

CMOS technology provides high-speed operation with lower power consumption, ensuring efficiency in battery-operated designs.

Terminal Form: GULL WING

The gull wing terminal form aids in easier soldering and provides good thermal and electrical performance.

Analog To Digital Converters: 24-Ch 10-Bit

Multiple ADC channels (24-Ch 10-Bit) facilitate real-time analog processing for diverse sensor inputs, enhancing application versatility.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies integration with existing components and better aligns with common power supply units.

PWM Channels: YES

Integrated PWM channels provide capabilities for motor control and other applications requiring precise signal modulation.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Diverse connectivity options enable easy interfacing with other devices and protocols, making it suitable for a variety of communication tasks.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of firmware, enhancing the product's lifecycle and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports closer spacing of connections, benefiting compact circuit designs.

Moisture Sensitivity Level (MSL): 3

With MSL of 3, the microcontroller is suitable for most manufacturing processes, ensuring good handling and reliability.

Speed: 48 rpm

While the speed rating seems more relevant to motor applications, it indicates the microcontroller's capability in handling various speed-sensitive tasks.

On Chip Program ROM Width: 32

A 32-bit program ROM width provides enhanced performance for complex applications requiring large instruction sets.

No. of I/O Lines: 111

A high number of I/O lines allows for extensive interfacing with various peripherals, making it versatile for different circuit designs.

Technical Specifications

Microcontrollers F273-CEG-T-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F273-CEG-T-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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