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F272-BAR-T

STMicroelectronics

F272-BAR-T by STMicroelectronics

F272-BAR-T by STMicroelectronics is a 16-bit microcontroller with 123 I/O lines, ADC channels, and PWM channels. Operating at speeds up to 64 rpm, it features a square package shape measuring 20mm x 20mm. Ideal for applications requiring low-profile, fine-pitch flatpack technology in the CMOS RISC peripheral IC type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,175 parts In-Stock

1+ parts

-

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3,175

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-

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Vyrian

USA . 2,996 parts In-Stock

1+ parts

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-

1k+ parts

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2,996

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Anansix

USA . 2,714 parts In-Stock

1+ parts

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2,714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 383 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

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10k+ parts

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383

$0.694

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Northwest PG Solutions

USA . 1,055 parts In-Stock

1+ parts

$0.763

100+ parts

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1,055

$0.763

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IDEA Electronic Components Group

UK . 1,569 parts In-Stock

1+ parts

$75.719

100+ parts

-

1k+ parts

$68.147

10k+ parts

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1,569

$75.719

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$68.147

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MKK Technologies

India . 2,205 parts In-Stock

1+ parts

$142.384

100+ parts

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2,205

$142.384

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DigiPath Technology Company

USA . 2,205 parts In-Stock

1+ parts

$142.384

100+ parts

-

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2,205

$142.384

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Corphita

USA . 2,274 parts In-Stock

1+ parts

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2,274

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Parana Technologies

USA . 2,068 parts In-Stock

1+ parts

-

100+ parts

$90.533

1k+ parts

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10k+ parts

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2,068

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$90.533

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Overview

Elevate your projects to the next level with the F272-BAR-T microcontroller from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers cutting-edge technology that ensures reliability and performance. Designed for a variety of applications, this microcontroller offers advanced features like ADC channels and PWM channels, making it versatile and adaptable to your specific needs. Experience the value and benefits of the F272-BAR-T, whether you're a hobbyist or a professional looking to push boundaries in your designs. Unlock endless possibilities with STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product suitable for automated assembly processes, reducing production time and cost.

Maximum Supply Voltage: 5.5 V

Allows the product to handle higher voltage inputs, making it versatile for different applications.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the PCB.

Bit Size: 16

16-bit architecture allows for higher precision and performance in processing data.

No. of Terminals: 144

High number of terminals offer ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design makes the product suitable for compact electronic devices with space constraints.

Minimum Supply Voltage: 4.5 V

Provides a lower limit for input voltage, ensuring stable operation even under lower voltage conditions.

ADC Channels: YES

Built-in ADC channels allow for analog-to-digital conversion, enabling the product to measure and process analog signals.

Terminal Position: QUAD

Quad terminal position offers increased stability and improved signal integrity in the connection.

Width: 20 mm

Compact width dimension allows for efficient utilization of PCB space.

Length: 20 mm

Square shape with a 20mm length maintains a balanced form factor, suitable for various mounting configurations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design facilitates faster operation and reduced power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering during PCB assembly.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage compatibility ensures easy integration with existing systems and components.

PWM Channels: YES

Presence of PWM channels enables the product to generate precise analog output signals for motor control and other applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and interconnection on the PCB.

Speed: 64 rpm

Operating speed of 64 rpm ensures efficient performance in data processing and control tasks.

No. of I/O Lines: 123

Abundant I/O lines provide versatility for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers F272-BAR-T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DMA Channels:

NO

External Data Bus Width:

0

Length:

20 mm

No. of I/O Lines:

123

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F272-BAR-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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