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F272-BAGE-T-TR

STMicroelectronics

F272-BAGE-T-TR by STMicroelectronics

F272-BAGE-T-TR microcontroller by STMicroelectronics features a 16-bit CPU with a max clock frequency of 40 MHz, supporting up to 144 terminals. It operates within -40 °C to 125 °C and offers extensive connectivity options like CAN and I2C. Ideal for automotive applications, it includes ADC channels and PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,483 parts In-Stock

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4,483

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Digiode

USA . 2,923 parts In-Stock

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2,923

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Anansix

USA . 715 parts In-Stock

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715

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$51.279

100+ parts

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$46.151

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2,252

$51.279

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$46.151

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Microchip USA

USA . 435 parts In-Stock

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$58.732

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435

$58.732

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Corohmni

South Africa . 481 parts In-Stock

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$78.044

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481

$78.044

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MKK Technologies

India . 1,730 parts In-Stock

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$96.427

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1,730

$96.427

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$96.427

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1,730

$96.427

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Component Stockers USA

USA . 670 parts In-Stock

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$99.990

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670

$99.990

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Corphita

USA . 3,354 parts In-Stock

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3,354

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Parana Technologies

USA . 1,587 parts In-Stock

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$61.312

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1,587

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$61.312

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Northwest PG Solutions

USA . 232 parts In-Stock

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$3.719

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232

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$3.719

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Native Components

USA . 112 parts In-Stock

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$3.681

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112

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$3.681

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Overview

Unlock the power of innovation with the F272-BAGE-T-TR microcontroller from STMicroelectronics. Renowned for their unmatched quality and cutting-edge technology, STMicroelectronics delivers robust solutions ideal for automotive applications. This versatile microcontroller enhances performance and reliability, boasting features like extensive connectivity and efficient power management. Elevate your projects with a trusted partner that ensures exceptional value and endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and effectiveness in diverse environments.

Surface Mount: YES

Surface mount technology allows for compact designs and high-density circuit layouts.

Maximum Supply Voltage: 5.5 V

This voltage range allows compatibility with various power supplies, making it flexible for multiple applications.

Address Bus Width: 24

A wider address bus enhances memory capabilities, enabling larger and more complex data processing.

Package Shape: SQUARE

Square package shape facilitates easier integration into printed circuit boards.

Bit Size: 16

16-bit architecture supports a broader range of operations and improved processing power for various tasks.

Power Supplies (V): 5

Standard 5V power supply ensures compatibility with commonly used components in microcontroller applications.

No. of Terminals: 144

A higher number of terminals provides extensive connectivity options for peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design enables efficient thermal management and eases soldering during assembly.

Minimum Supply Voltage: 4.5 V

Low minimum voltage allows operation in a wider range of power environments.

Maximum Operating Temperature: 125 °C

Ability to function at high temperatures makes this microcontroller suitable for automotive and industrial applications.

CPU Family: ST10

The ST10 family is well-supported with a robust ecosystem and resources, enhancing developer productivity.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables use in harsh environments.

Terminal Finish: Matte Tin (Sn) - Annealed

High-quality terminal finishes ensure reliable solder connections and improved longevity.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors, increasing the range of application.

Terminal Position: QUAD

Quad terminal positioning improves signal integrity and facilitates efficient PCB layout.

ROM Words: 65536

A significant ROM capacity enables complex applications and extensive firmware storage.

Maximum Seated Height: 1.6 mm

Low profile design is advantageous for compact electronic assemblies.

Width: 20 mm

Compact width aids in space-constrained applications without sacrificing functionality.

External Data Bus Width: 16

A 16-bit data bus allows for efficient handling of larger data sizes, enhancing processing performance.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Rich peripheral set offers versatility for varied application needs, from control to timing.

Maximum Clock Frequency: 40 MHz

Higher clock frequency enables faster processing speeds, essential for performance-critical applications.

Maximum Time At Peak Reflow Temperature: 40 s

This specification guarantees reliability during the soldering process, ensuring quality manufacturing.

Peak Reflow Temperature: 260 °C

High thermal tolerance helps withstand modern soldering processes, enhancing production yield.

Length: 20 mm

Compact length fosters ease of integration into space-restricted designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this microcontroller is ideal for safety-critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this device integrates computing and control, simplifying designs and improving reliability.

RAM Bytes: 2048

Adequate RAM memory allows for efficient data processing and handling in various applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of reflow soldering.

Analog To Digital Converters: 24-Ch 10-Bit

Multiple ADC channels and resolution make it suitable for precise analog signal processing.

Nominal Supply Voltage: 5 V

Operating nominally at 5V ensures compatibility with other devices in the system.

PWM Channels: YES

Integrated PWM channels enable efficient control of motors and other devices, enhancing performance in actuators.

Connectivity: ASC(2), CAN(2), I2C, SPI(2), SSC(2)

Versatile connectivity options allow integration into various communication protocols, enhancing interoperability.

ROM Programmability: FLASH

Flash programmability enables easy upgrades and modifications, increasing the lifespan of the application.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density PCB designs, improving packing efficiency.

Moisture Sensitivity Level (MSL): 3

Maintaining an MSL of 3 indicates robust solderability and suitability for standard manufacturing conditions.

Speed: 40 rpm

Speed specification enables performance optimizations in applications requiring precise timings.

On Chip Program ROM Width: 32

A wide ROM allows for more extensive programming capabilities, supporting complex applications.

No. of I/O Lines: 111

High I/O line count provides extensive interfacing possibilities, critical for multifaceted applications.

Technical Specifications

Microcontrollers F272-BAGE-T-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SPI(2), SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F272-BAGE-T-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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