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F272-BAG-P-TR

STMicroelectronics

F272-BAG-P-TR by STMicroelectronics

F272-BAG-P-TR by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 125 °C. It features 144 terminals, supports various connectivity options, and includes ADC channels for versatile applications. Ideal for automotive use, it combines robust performance with advanced peripherals like PWM and timers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,076 parts In-Stock

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Anansix

USA . 2,896 parts In-Stock

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2,896

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Digiode

USA . 2,175 parts In-Stock

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2,175

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Distributors (Availability)

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AZTECH Wire

Italy . 1,021 parts In-Stock

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$16.800

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1,021

$16.800

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Microchip USA

USA . 378 parts In-Stock

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$24.067

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378

$24.067

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IDEA Electronic Components Group

UK . 1,979 parts In-Stock

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$64.434

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$57.991

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1,979

$64.434

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$57.991

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Component Stockers USA

USA . 330 parts In-Stock

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$99.990

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330

$99.990

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MKK Technologies

India . 186 parts In-Stock

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$121.164

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186

$121.164

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DigiPath Technology Company

USA . 186 parts In-Stock

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$121.164

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QUARKTWIN TECHNOLOGY LTD

USA . 28,581 parts In-Stock

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Northwest PG Solutions

USA . 2,295 parts In-Stock

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2,295

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Parana Technologies

USA . 1,779 parts In-Stock

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$77.041

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Native Components

USA . 915 parts In-Stock

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Corphita

USA . 338 parts In-Stock

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Overview

Unlock the potential of your projects with the F272-BAG-P-TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this compact powerhouse excels in automotive applications, ensuring optimal performance even in extreme temperatures. With rich connectivity options and versatile peripherals, it paves the way for seamless integration and enhanced functionality. Experience unmatched quality and innovation—choose STMicroelectronics for enduring excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides good insulation properties, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient production, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Address Bus Width: 24

A 24-bit address bus allows for addressing a larger memory space, providing flexibility for complex applications.

Package Shape: SQUARE

The square package shape contributes to ease of layout in PCB design and optimal space utilization.

Bit Size: 16

The 16-bit architecture balances performance with resource efficiency, suitable for a wide array of control tasks.

Power Supplies (V): 5

A nominal supply voltage of 5 V is common, simplifying integration into existing systems.

No. of Terminals: 144

144 terminals provide ample connectivity options for various peripherals, enhancing the device's versatility.

Package Style (Meter): FLATPACK

The flatpack style is advantageous for heat dissipation and low-profile demands in electronic designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V contributes to stable operation in automotive and industrial applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments, appealing for automotive applications.

CPU Family: ST10

The ST10 family indicates a robust architecture known for efficient processing in control applications.

Minimum Operating Temperature: -40 °C

Operating at extreme low temperatures makes this microcontroller ideal for outdoor and industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and reduces oxidation, enhancing long-term reliability.

ADC Channels: YES

Integrated ADC channels facilitate analog signal processing, making it suitable for sensor applications.

Terminal Position: QUAD

Quad terminal positioning aids in efficient PCB layout and reduces potential signal integrity issues.

ROM Words: 65536

65536 ROM words provide sufficient program memory for complex applications, promoting flexibility in programming.

Maximum Seated Height: 4.07 mm

The low seated height benefits compact device design, enabling slimmer end products.

Width: 28 mm

A width of 28 mm offers a good balance between size and ease of handling during assembly.

External Data Bus Width: 16

Supports a 16-bit external data bus, allowing for efficient data transfer rates and system performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Diverse peripherals enhance functionality, making it suitable for both consumer and industrial applications.

Maximum Clock Frequency: 64 MHz

A maximum clock frequency of 64 MHz enables high-speed processing, critical for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for peak reflow temperatures enhances solder joint quality for reliability in production.

Peak Reflow Temperature °C: 245

A peak reflow temperature of 245 °C ensures compatibility with lead-free solder processes.

Length: 28 mm

The compact length aids in integration into various device footprints and enhances flexibility for design.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring robustness and reliability in critical environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is well-suited for a wide range of control and automation tasks.

RAM Bytes: 20480

20KB of RAM allows for efficient data handling and processing for more complex applications.

Technology: CMOS

CMOS technology offers low power consumption and fast switching capabilities, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide robustness in connections, suited for automated assembly.

Analog To Digital Converters: 24-Ch 10-Bit

The presence of 24-channel, 10-bit ADC enables detailed analog signal assessment for precise control systems.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V is widely supported, increasing compatibility with existing systems.

PWM Channels: YES

Support for PWM channels allows for effective control of motors and actuators, essential for automation.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple connectivity options offer flexibility and support for a variety of communication protocols in complex applications.

ROM Programmability: FLASH

Flash ROM provides the ability to update and reprogram applications easily, enhancing the device lifespan.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tighter packing of components on PCBs, optimizing space use.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, handling precautions ensure reliability during assembly, suitable for automated processes.

Speed: 64 rpm

Operates at 64 rpm, ensuring adequate performance for timing-critical applications.

On Chip Program ROM Width: 32

32-bit width allows for handling larger instructions and data, beneficial for complex program execution.

No. of I/O Lines: 111

111 I/O lines provide extensive interfacing capabilities for a wide range of external devices.

Technical Specifications

Microcontrollers F272-BAG-P-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F272-BAG-P-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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