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F272-BAG-T-TR

STMicroelectronics

F272-BAG-T-TR by STMicroelectronics

F272-BAG-T-TR by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 125 °C. It features 144 terminals, supports various connectivity options, and includes ADC channels for versatile applications. Ideal for automotive use, it combines performance with reliability in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,946 parts In-Stock

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Digiode

USA . 2,887 parts In-Stock

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2,887

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Anansix

USA . 2,124 parts In-Stock

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2,124

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Distributors (Availability)

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Native Components

USA . 368 parts In-Stock

1+ parts

$0.901

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368

$0.901

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Northwest PG Solutions

USA . 801 parts In-Stock

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$0.992

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801

$0.992

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AZTECH Wire

Italy . 114 parts In-Stock

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$15.180

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114

$15.180

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Microchip USA

USA . 204 parts In-Stock

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$26.191

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204

$26.191

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

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$31.106

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$27.996

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2,182

$31.106

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$27.996

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MKK Technologies

India . 162 parts In-Stock

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$58.493

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DigiPath Technology Company

USA . 162 parts In-Stock

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$58.493

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QUARKTWIN TECHNOLOGY LTD

USA . 11,478 parts In-Stock

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Corphita

USA . 1,799 parts In-Stock

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1,799

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Parana Technologies

USA . 1,544 parts In-Stock

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$37.192

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1,544

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$37.192

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Overview

Unlock limitless possibilities with the F272-BAG-T-TR microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, STMicroelectronics ensures this high-performance device enhances your projects with seamless connectivity, advanced peripherals, and robust processing capabilities. Ideal for automotive applications, it thrives in extreme conditions, delivering unmatched efficiency and longevity. Experience innovation that drives success today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and provides excellent protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronics, making it a versatile choice for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard microcontroller power supplies, allowing for easier integration into existing designs.

Address Bus Width: 24

A 24-bit address bus width provides ample addressable memory space, enabling more complex applications and sophisticated programming capabilities.

Package Shape: SQUARE

The square package shape facilitates uniform heat distribution and can be efficiently arranged on PCB layouts.

Bit Size: 16

A 16-bit architecture allows for efficient data processing and supports a wide range of applications, from basic tasks to more complex algorithms.

Power Supplies (V): 5

Operating at a nominal 5 V power supply is a common standard, simplifying sourcing and design for developers.

No. of Terminals: 144

With 144 terminals, this microcontroller can support a high number of I/O connections for connectivity with numerous peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is advantageous for minimizing space and ensuring ease of mounting in high-density electronic systems.

Minimum Supply Voltage: 4.5 V

The wide supply voltage range (4.5 V to 5.5 V) ensures flexibility in design and adaptability to various power source conditions.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating makes this microcontroller suitable for automotive and demanding industrial environments.

CPU Family: ST10

The ST10 CPU family is designed for high performance, ensuring robust processing capabilities suitable for various applications.

Minimum Operating Temperature: -40 °C

This device can operate in extreme cold conditions, enhancing its applicability in automotive and outdoor systems.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and resistance to oxidation, ensuring reliable connections over time.

ADC Channels: YES

The inclusion of ADC channels allows for the integration of analog sensors, making it ideal for applications that require real-world signal processing.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility on printed circuit boards, suitable for various design needs.

ROM Words: 65536

With a large amount of ROM, the microcontroller can store extensive programs and data, making it capable of running complex applications.

Maximum Seated Height: 1.6 mm

A low seated height contributes to space-saving designs, critical in compact device manufacturing.

Width: 20 mm

The compact width provides design flexibility and allows for higher density layouts on PCBs.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data handling and enhances the overall performance of peripheral interactions.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Integrated peripherals enhance functionality by supporting a variety of applications, including real-time control and monitoring.

Maximum Clock Frequency: 40 MHz

The ability to operate at 40 MHz ensures fast processing speeds, suitable for time-sensitive tasks and computations in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a reasonable reflow temperature tolerance, it is compatible with modern manufacturing processes, ensuring reliability in production.

Peak Reflow Temperature °C: 260

This high peak reflow temperature indicates compatibility with lead-free soldering processes, aligning with environmental standards.

Length: 20 mm

The length of 20 mm allows for effective spatial arrangements on PCBs, maintaining design efficiency.

Temperature Grade: AUTOMOTIVE

Designed to automotive specifications, this microcontroller can withstand harsher environmental conditions, ensuring reliability in vehicles.

Peripheral IC Type: MICROCONTROLLER

Being categorized as a microcontroller indicates capability in a vast range of embedded applications, enhancing versatility.

RAM Bytes: 20480

With substantial RAM, this microcontroller can handle complex data and multitasking more efficiently, improving overall system performance.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form assists with easy mounting and improves the mechanical strength of solder joints.

Analog To Digital Convertors: 24-Ch 10-Bit

Having 24 channels of 10-bit ADC allows for versatile sensor integration and precise data acquisition in numerous applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures easy compatibility with many common electronic components, simplifying systems integration.

PWM Channels: YES

The presence of PWM channels enables effective control of motors and other devices, making it a valuable choice for automation projects.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Diverse connectivity options make this microcontroller suitable for data communication between various components in complex systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and flexibility in application development, making it adaptable to change.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables higher-pin-count configurations in compact spaces, supporting advanced, high-performance designs.

Moisture Sensitivity Level (MSL): 3

Class 3 MSL indicates moderate sensitivity to moisture, allowing for standard handling and processing while ensuring product longevity.

Speed: 40 rpm

Ideal for low-speed applications, this microcontroller can effectively manage control systems in robotics and other automation technologies.

On Chip Program ROM Width: 32

A program ROM width of 32 bits allows for flexibility in programming, improving the ability to support more advanced features and instructions.

No. of I/O Lines: 111

With 111 I/O lines, this microcontroller offers extensive interfacing capabilities with various peripherals, enhancing its usability in complex systems.

Technical Specifications

Microcontrollers F272-BAG-T-TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F272-BAG-T-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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