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F272-BAG-P

STMicroelectronics

F272-BAG-P by STMicroelectronics

F272-BAG-P by STMicroelectronics is a 16-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 125 °C. It features 144 terminals, supports various connectivity options, and includes ADC channels for versatile applications. Ideal for automotive use, it combines robust performance with advanced peripherals like PWM and timers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,622 parts In-Stock

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8,622

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Digiode

USA . 4,696 parts In-Stock

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4,696

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Anansix

USA . 2,408 parts In-Stock

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2,408

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LIBRA Elektronik GmbH

Germany . 110 parts In-Stock

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110

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Distributors (Availability)

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AZTECH Wire

Italy . 916 parts In-Stock

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$11.250

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916

$11.250

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Native Components

USA . 452 parts In-Stock

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$12.272

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452

$12.272

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Northwest PG Solutions

USA . 2,093 parts In-Stock

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$13.499

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$12.149

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2,093

$13.499

$12.149

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Microchip USA

USA . 329 parts In-Stock

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$24.067

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329

$24.067

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IDEA Electronic Components Group

UK . 628 parts In-Stock

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$77.956

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$70.161

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628

$77.956

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$70.161

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MKK Technologies

India . 1,072 parts In-Stock

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$146.592

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1,072

$146.592

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DigiPath Technology Company

USA . 1,072 parts In-Stock

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$146.592

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1,072

$146.592

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Corphita

USA . 2,805 parts In-Stock

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2,805

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Parana Technologies

USA . 1,459 parts In-Stock

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$93.208

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1,459

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$93.208

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Overview

Unlock the potential of your next project with the F272-BAG-P microcontroller from STMicroelectronics—a leader in innovation and reliability. Engineered for performance across automotive applications, this versatile microcontroller delivers robust functionality with its extensive peripheral support and high-temperature resilience. Experience seamless integration, enhanced efficiency, and unmatched quality that elevate your designs while reducing time to market. Choose F272-BAG-P for a smarter, more reliable solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction enhances reliability in various environments.

Surface Mount: YES

Facilitates compact design and efficient use of board space.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power supply applications.

Address Bus Width: 24

Enables access to larger memory and enhances overall processing capability.

Package Shape: SQUARE

Standard shape allows for easier integration into diverse circuit board layouts.

Bit Size: 16

Offers a balance of performance and resource savings for embedded applications.

Power Supplies (V): 5

Standard operating voltage simplifies design and power management.

No. of Terminals: 144

Provides ample connectivity for a range of peripherals and I/O options.

Package Style (Meter): FLATPACK

Facilitates low-profile mounting, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Lower supply voltage requirement enables flexibility in power source selection.

Maximum Operating Temperature: 125 °C

Suitable for automotive and industrial applications where high temperatures may prevail.

CPU Family: ST10

Proven performance and compatibility with existing ST10 ecosystem components.

Minimum Operating Temperature: -40 °C

Designed to perform reliably in extreme cold conditions.

Terminal Finish: MATTE TIN

Provides excellent solderability and reduces the risk of corrosion.

ADC Channels: YES

Integrated analog-to-digital conversion enhances flexibility for sensor applications.

Terminal Position: QUAD

Supports efficient routing and layout on printed circuit boards.

ROM Words: 65536

Offers substantial program storage, supporting complex applications.

Maximum Seated Height: 4.07 mm

Low profile allows for integration in tighter spaces.

Width: 28 mm

Compact dimension is suitable for various designs, facilitating space-efficient layouts.

External Data Bus Width: 16

Provides high data throughput, making it suitable for high-performance applications.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Rich set of integrated peripherals allows for versatile applications in control systems.

Maximum Clock Frequency: 64 MHz

Enables high-speed processing for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand PCB assembly processes with high thermal profiles.

Peak Reflow Temperature °C: 245

Compatible with modern soldering processes, enhancing manufacturability.

Length: 28 mm

Compact size simplifies the integration into various devices.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, ensuring robustness and reliability.

Peripheral IC Type: MICROCONTROLLER

Specifically designed to control devices, making it ideal for embedded systems.

RAM Bytes: 20480

Sufficient RAM for executing complex algorithms and data processing.

Technology: CMOS

Low power consumption allows for battery-operated applications.

Terminal Form: GULL WING

Ensures easy soldering and reliable connections on circuit boards.

Analog To Digital Convertors: 24-Ch 10-Bit

Supports extensive signal conversion capabilities for various input sources.

Nominal Supply Voltage: 5 V

Common voltage simplifies design considerations across devices.

PWM Channels: YES

Enables precise control of motors and other analog devices.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple communication interfaces provide flexibility for hardware integration.

ROM Programmability: FLASH

Allows for easy updates and modifications to the program memory.

Terminal Pitch: 0.65 mm

Standard pitch for easy placement and soldering in high-density applications.

Moisture Sensitivity Level (MSL): 3

Handles moderate moisture levels, suitable for various manufacturing processes.

Speed: 64 rpm

Offers adequate performance for many control applications.

On Chip Program ROM Width: 32

Supports larger data widths, enhancing processing capabilities.

No. of I/O Lines: 111

Large number of I/O lines provides extensive interfacing capabilities for peripherals.

Technical Specifications

Microcontrollers F272-BAG-P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

F272-BAG-P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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