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CRX14-MQ/XXX

STMicroelectronics

CRX14-MQ/XXX by STMicroelectronics

CRX14-MQ/XXX by STMicroelectronics is a telecom interface IC designed for surface mount applications. It features a 5V nominal voltage, operates b/w -20 °C to 85°C, and has a compact 16-terminal gull-wing package. Ideal for various telecom circuits, it ensures reliable performance in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,801 parts In-Stock

1+ parts

-

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1k+ parts

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3,801

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-

-

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Digiode

USA . 3,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,189

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Anansix

USA . 2,783 parts In-Stock

1+ parts

-

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10k+ parts

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2,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 256 parts In-Stock

1+ parts

$1.941

100+ parts

-

1k+ parts

-

10k+ parts

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256

$1.941

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-

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Northwest PG Solutions

USA . 2,032 parts In-Stock

1+ parts

$2.135

100+ parts

-

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-

10k+ parts

-

2,032

$2.135

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IDEA Electronic Components Group

UK . 2,064 parts In-Stock

1+ parts

$12.590

100+ parts

-

1k+ parts

$11.331

10k+ parts

-

2,064

$12.590

-

$11.331

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MKK Technologies

India . 2,301 parts In-Stock

1+ parts

$23.675

100+ parts

-

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2,301

$23.675

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-

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$23.675

100+ parts

-

1k+ parts

-

10k+ parts

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2,301

$23.675

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-

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Corphita

USA . 2,952 parts In-Stock

1+ parts

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2,952

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Parana Technologies

USA . 866 parts In-Stock

1+ parts

-

100+ parts

$15.054

1k+ parts

-

10k+ parts

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866

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$15.054

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Overview

Unlock unparalleled performance with the CRX14-MQ/XXX from STMicroelectronics, a leader in innovative semiconductor solutions. This reliable telecom interface IC is expertly designed for seamless integration into your projects, ensuring optimal signal quality and efficiency across a range of applications. Built to withstand diverse environments, its compact, robust design makes it perfect for modern electronics, delivering consistent value and unmatched reliability that enhances your product's performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and makes the product easier to integrate into modern PCB designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and facilitates efficient layout design.

No. of Terminals: 16

With 16 terminals, this IC supports various configurations and connectivity options, enhancing its versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it perfect for compact devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in warmer environments, suitable for industrial applications.

Minimum Operating Temperature: -20 °C

This product’s ability to operate at -20 °C makes it suitable for outdoor or low-temperature applications, increasing its usability range.

Terminal Position: DUAL

Dual terminal positioning aids in flexible layout designs and improves connectivity options on the PCB.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for low-profile designs, enabling thinner product profiles and reduced space usage.

Width: 3.9 mm

The compact width contributes to a smaller overall footprint, allowing for efficient use of space in device layouts.

Length: 9.9 mm

A length of 9.9 mm gives a balanced size that allows compatibility with most PCB layouts while maintaining robustness.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making the IC suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves the reliability of connections in surface mount applications.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC is optimized for communication tasks, ensuring effective signal processing.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many electronic applications, ensuring compatibility with a wide range of devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a balance between compactness and ease of handling during assembly and soldering.

Technical Specifications

Other Function Telecom Interface ICs CRX14-MQ/XXX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

CRX14-MQ/XXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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