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BUX98

STMicroelectronics

BUX98 by STMicroelectronics

NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 250 W; Maximum Collector Current (IC): 30 A; Package Body Material: METAL;

Median Price

$3.000

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 4 parts In-Stock

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$3.000

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$3.000

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DF Sales Co.

USA . 4 parts In-Stock

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$3.000

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$3.000

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Digiode

USA . 6,832 parts In-Stock

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Vyrian

USA . 5,489 parts In-Stock

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Anansix

USA . 2,401 parts In-Stock

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Halfin

Belgium . 850 parts In-Stock

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850

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ComSIT Distribution GmbH

Germany . 65 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 44 parts In-Stock

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ABC Electronics Ltd.

UK . 15 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Sinequanon

UK . 4 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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Inland Empire Components Inc.

USA . 2 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Distributors (Availability)

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ChromeModa Solutions

Germany . 6,304 parts In-Stock

1+ parts

$0.812

100+ parts

$0.666

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$0.812

$0.666

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IDEA Electronic Components Group

UK . 3,243 parts In-Stock

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$1.451

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$1.306

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DigiPath Technology Company

USA . 2,433 parts In-Stock

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$2.728

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$2.728

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MKK Technologies

India . 151 parts In-Stock

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$2.728

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$2.728

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Corohmni

South Africa . 138 parts In-Stock

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$3.000

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138

$3.000

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AZTECH Wire

Italy . 603 parts In-Stock

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$10.421

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$10.421

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One Stop Electronics

USA . 1,541 parts In-Stock

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$62.050

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Corphita

USA . 8,351 parts In-Stock

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Problanco Electronics

Mexico . 8,019 parts In-Stock

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TANS Electronics

Latvia . 6,451 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Northwest PG Solutions

USA . 2,873 parts In-Stock

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Kulean Microsystems

USA . 2,777 parts In-Stock

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Parana Technologies

USA . 1,495 parts In-Stock

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$1.735

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Native Components

USA . 1,354 parts In-Stock

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SupplyDigital Components

Austria . 1,221 parts In-Stock

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Assy Fe

Spain . 838 parts In-Stock

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UHIMA Technologies

Türkiye . 108 parts In-Stock

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Perfect Parts

USA . 16 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 7 parts In-Stock

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Technical Specifications

Power Bipolar Junction Transistors (BJT) BUX98 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Configuration:

JEDEC-95 Code:

TO-3

JESD-30 Code:

O-MBFM-P2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

250 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

3800 ns

Maximum Turn On Time (ton):

1000 ns

Maximum VCEsat:

1.5 V

Trade Compliance

BUX98 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-17-104-1187, 5961171041187

NIIN

171041187

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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