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BAL-2690D3U

STMicroelectronics

BAL-2690D3U by STMicroelectronics

STMicroelectronics' BAL-2690D3U RF Transformer has 1.1 dB insertion loss, operates b/w -40 °C to 85°C, with cutoff frequencies of 2402 GHz to 2480 MHz. Ideal for surface mount applications in RF circuits for signal transformation and impedance matching.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

1+ parts

$0.126

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5,000

$0.126

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

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$0.126

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5,000

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$0.126

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Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

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5,000

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DigiKey

USA . 4,770 parts In-Stock

1+ parts

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$0.188

4,770

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$0.188

Distributors (In-Stock)

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Digiode

USA . 3,934 parts In-Stock

1+ parts

$0.120

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3,934

$0.120

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Vyrian

USA . 2,883 parts In-Stock

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$0.126

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2,883

$0.126

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A&K Electronics

USA . 4,900 parts In-Stock

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4,900

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Rotakorn

Sweden . 4,900 parts In-Stock

1+ parts

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4,900

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Bristol Electronics

USA . 4,900 parts In-Stock

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4,900

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Anansix

USA . 1,915 parts In-Stock

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1,915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,535 parts In-Stock

1+ parts

$0.113

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4,535

$0.113

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Native Components

USA . 276 parts In-Stock

1+ parts

$0.773

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276

$0.773

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Northwest PG Solutions

USA . 1,198 parts In-Stock

1+ parts

$0.850

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1,198

$0.850

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IDEA Electronic Components Group

UK . 929 parts In-Stock

1+ parts

$3.951

100+ parts

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1k+ parts

$3.556

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929

$3.951

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$3.556

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MKK Technologies

India . 339 parts In-Stock

1+ parts

$7.430

100+ parts

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339

$7.430

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DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$7.430

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339

$7.430

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 721 parts In-Stock

1+ parts

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100+ parts

$4.724

1k+ parts

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721

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$4.724

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Overview

Elevate your RF transformer performance with the BAL-2690D3U by STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers reliable solutions for a range of applications. This surface-mount transformer offers low insertion loss and high efficiency, making it ideal for various RF applications. Experience seamless connectivity and superior signal transmission with the BAL-2690D3U. Upgrade your systems today and see the difference STMicroelectronics can make for your projects.

Feature Benefit Bullets

Insertion Loss: 1.1 dB

Low insertion loss ensures minimal signal degradation, making this RF transformer suitable for high-performance applications.

Packing Method: TR

TR packaging method provides ease of handling and protection during transportation, ensuring the product reaches the customer in good condition.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this RF transformer can operate reliably in various environmental conditions without the risk of overheating.

Minimum Cutoff Frequency: 2402 GHz

Higher minimum cutoff frequency allows for better performance in high-frequency applications, making this RF transformer suitable for advanced communication systems.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures usability in both extreme cold and hot environments, making this RF transformer versatile and reliable.

Height: 0.695 mm

Compact height makes this RF transformer suitable for applications where space is limited, allowing for more flexibility in design and integration.

Width: 0.96 mm

Slim width enables efficient placement on circuit boards, optimizing layout and reducing overall footprint in electronic devices.

Maximum Cutoff Frequency: 2480 MHz

Higher maximum cutoff frequency ensures compatibility with a wide range of RF signals, providing flexibility in usage for different frequency bands.

Transformer Type: RF TRANSFORMER

Designed specifically for RF applications, this transformer offers high performance and reliability for signal transfer and impedance matching in RF circuits.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure attachment to circuit boards, simplifying the manufacturing process and ensuring stable connections during operation.

Length: 0.96 mm

Compact length contributes to the overall small form factor of the RF transformer, making it ideal for compact electronic devices where space is a premium.

Technical Specifications

RF Transformers BAL-2690D3U attributes and parameters. Explore more RF Transformers devices from STMicroelectronics

Specs

Maximum Cutoff Frequency:

2480 MHz

Minimum Cutoff Frequency:

2402 GHz

Height:

.695 mm

Insertion Loss:

1.1 dB

Length:

.96 mm

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TR

Transformer Type:

Width:

.96 mm

Trade Compliance

BAL-2690D3U Transformers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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