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BAL-2593D5U

STMicroelectronics

BAL-2593D5U by STMicroelectronics

STMicroelectronics' BAL-2593D5U RF Transformer features 1.2 dB insertion loss, 2400 GHz min cutoff frequency, and 2500 MHz max cutoff frequency. Ideal for surface mount applications in RF circuits with operating temperatures ranging from -30 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 29,190 parts In-Stock

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29,190

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Digiode

USA . 4,572 parts In-Stock

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4,572

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Vyrian

USA . 4,168 parts In-Stock

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4,168

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Anansix

USA . 1,952 parts In-Stock

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1,952

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Distributors (Availability)

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Native Components

USA . 904 parts In-Stock

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$0.853

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904

$0.853

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Northwest PG Solutions

USA . 1,553 parts In-Stock

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$0.938

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1,553

$0.938

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IDEA Electronic Components Group

UK . 752 parts In-Stock

1+ parts

$5.051

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-

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$4.546

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752

$5.051

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$4.546

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MKK Technologies

India . 1,495 parts In-Stock

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$9.498

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1,495

$9.498

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DigiPath Technology Company

USA . 1,495 parts In-Stock

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$9.498

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1,495

$9.498

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 1,610 parts In-Stock

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1,610

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Parana Technologies

USA . 1,465 parts In-Stock

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$6.039

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$6.039

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Enhance your RF applications with the BAL-2593D5U from STMicroelectronics, a leading manufacturer known for delivering top-quality components. This RF transformer offers exceptional performance, low insertion loss, and a wide operating temperature range, making it ideal for a variety of applications. With its compact dimensions and surface mount design, this transformer is easy to integrate into your circuit board, providing reliable and efficient signal transformation. Upgrade your devices with the BAL-2593D5U and experience the value and benefits of superior quality components from STMicroelectronics.

Feature Benefit Bullets

Insertion Loss: 1.2 dB

Low insertion loss ensures minimal signal loss during transformation, making this product suitable for high-performance RF applications.

Packing Method: TAPE & REEL

The tape and reel packaging method offers convenient storage and handling, especially in automated assembly processes.

Dimensions: 1.31mm X 1.21mm X 0.74mm

Compact size allows for efficient use of space on PCBs, ideal for applications with limited board real estate.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability even in demanding environmental conditions.

Minimum Cutoff Frequency: 2400 GHz

Low minimum cutoff frequency enables this RF transformer to handle high-frequency signals effectively, suitable for advanced communication systems.

Minimum Operating Temperature: -30 °C

Wide operating temperature range allows for flexibility in various temperature environments, ensuring consistent performance.

Height: 0.74 mm

Low height profile makes this RF transformer suitable for applications where board space is limited and height clearance is critical.

Width: 1.21 mm

Narrow width allows for space-efficient PCB layout design, especially in compact electronic devices.

Maximum Cutoff Frequency: 2500 MHz

High maximum cutoff frequency indicates the broad operating bandwidth of this RF transformer, making it suitable for a wide range of RF applications.

Transformer Type: RF TRANSFORMER

Specifically designed for RF applications, ensuring optimal performance and signal transformation in radio frequency circuits.

Mounting Feature: SURFACE MOUNT

Surface mount installation offers easy and secure mounting on PCBs, suitable for automated assembly processes and compact designs.

Length: 1.31 mm

Compact length contributes to space-saving layout designs on PCBs, ideal for applications with size constraints.

Technical Specifications

RF Transformers BAL-2593D5U attributes and parameters. Explore more RF Transformers devices from STMicroelectronics

Specs

Maximum Cutoff Frequency:

2500 MHz

Minimum Cutoff Frequency:

2400 GHz

Height:

.74 mm

Insertion Loss:

1.2 dB

Length:

1.31 mm

Manufacturer Series:

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Packing Method:

TAPE & REEL

Dimensions:

1.31mm X 1.21mm X 0.74mm

Transformer Type:

Width:

1.21 mm

Trade Compliance

BAL-2593D5U Transformers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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