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74VHCT541AMTR

STMicroelectronics

74VHCT541AMTR by STMicroelectronics

74VHCT541AMTR by STMicroelectronics is an 8-bit bus driver with a fast propagation delay of 9.5 ns, operating at a nominal voltage of 5V. It features a compact SO package and supports dual ports with true output polarity. Ideal for military applications, it operates in extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,710 parts In-Stock

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4,710

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Digiode

USA . 2,372 parts In-Stock

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2,372

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Anansix

USA . 993 parts In-Stock

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993

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Chip Stock

USA . 990 parts In-Stock

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990

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PC Components Company LLC

USA . 500 parts In-Stock

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500

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,001 parts In-Stock

1+ parts

$6.369

100+ parts

-

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$6.115

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$6.115

2,001

$6.369

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$6.115

$6.115

IDEA Electronic Components Group

UK . 2,217 parts In-Stock

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$13.633

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$12.269

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2,217

$13.633

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$12.269

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AZTECH Wire

Italy . 1,060 parts In-Stock

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$19.710

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$19.710

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MKK Technologies

India . 2,180 parts In-Stock

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$25.635

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2,180

$25.635

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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$25.635

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2,180

$25.635

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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$28.248

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10

$28.248

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Microchip USA

USA . 340 parts In-Stock

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$45.398

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340

$45.398

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Component Stockers USA

USA . 611 parts In-Stock

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$99.990

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611

$99.990

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Northwest PG Solutions

USA . 557 parts In-Stock

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557

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Parana Technologies

USA . 511 parts In-Stock

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$16.300

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511

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$16.300

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Native Components

USA . 223 parts In-Stock

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223

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Corphita

USA . 164 parts In-Stock

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164

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Overview

Unlock seamless data communication with the 74VHCT541AMTR from STMicroelectronics, a leading name in innovation and reliability. This high-performance bus driver and transceiver elevates your designs with rapid propagation delay and robust output characteristics, making it ideal for various applications, from industrial automation to automotive systems. Enjoy enhanced efficiency, reduced power consumption, and the peace of mind that comes with unmatched quality, ensuring your projects stand out.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 9.5 ns

A low propagation delay ensures faster signal transmission, enhancing overall performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient routing on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for more efficient designs.

No. of Bits: 8

Supports 8 data lines, providing flexibility for data transfer in a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage simplifies integration with common digital logic systems.

Load Capacitance (CL): 55 pF

The low load capacitance allows for faster switching speeds, making it ideal for high-frequency applications.

Power Supplies (V): 5

Single supply voltage design (5V) simplifies design and reduces the need for complex power management.

No. of Terminals: 20

Adequate number of terminals supports versatility and enables various I/O configurations.

Package Style (Meter): SMALL OUTLINE

Small outline packaging is suitable for space-constrained applications while offering good thermal performance.

Maximum I (ol): 8 Amp

High output current capability of 8A allows it to drive heavy loads effectively.

Propagation Delay (tpd): 9.5 ns

Reiterates the speed of operation, making it suitable for systems requiring quick response times.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes it suitable for harsh environments and industrial applications.

Output Characteristics: 3-STATE

3-state output enables multiple devices to share the same data bus, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

Allows operation in extremely low temperatures, making it ideal for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances solderability and reliability over time.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility for multiple layout configurations.

No. of Ports: 2

Having 2 ports allows for a simple and efficient data management in multi-user environments.

Maximum Seated Height: 2.65 mm

Low profile design allows for compact system designs and efficient use of space.

Width: 7.5 mm

Narrow width design supports high density layouts on the PCB.

Output Polarity: TRUE

True output polarity simplifies design for systems requiring straightforward logic.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage allows for flexibility in various power supply configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Supports standard reflow soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust solder joint formation.

Length: 12.8 mm

Compact length facilitates easy integration into space-constrained designs.

Temperature Grade: MILITARY

Military grade specification ensures reliability and performance in demanding applications.

Technology: CMOS

CMOS technology provides low power consumption, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide favorable soldering characteristics for secure connections.

Packing Method: TR

Tape and reel packing allows for easy automated assembly in manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch enhances compatibility with existing PCB designs.

Control Type: ENABLE LOW

Low enable control reduces power consumption by quickly disabling unused sections.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, guiding proper storage and handling practices.

Maximum Supply Voltage (Vsup): 5.5 V

Max supply voltage provides design versatility, accommodating various operational environments.

Technical Specifications

Bus Driver & Transceivers 74VHCT541AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

55 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHCT541AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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