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74VHCT273ATTR

STMicroelectronics

74VHCT273ATTR by STMicroelectronics

74VHCT273ATTR by STMicroelectronics is an 8-bit latch with a 5V supply, featuring a fast propagation delay of just 11 ns. It operates in extreme temperatures from -55 °C to 125°C and supports frequencies up to 45 MHz. Ideal for military applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,508 parts In-Stock

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6,508

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Anansix

USA . 2,617 parts In-Stock

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2,617

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Digiode

USA . 1,898 parts In-Stock

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1,898

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North Shore Components

USA . 1,874 parts In-Stock

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1,874

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Distributors (Availability)

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Microchip USA

USA . 350 parts In-Stock

1+ parts

$0.890

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350

$0.890

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Native Components

USA . 786 parts In-Stock

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$1.470

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786

$1.470

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Northwest PG Solutions

USA . 1,864 parts In-Stock

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$1.617

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1,864

$1.617

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IDEA Electronic Components Group

UK . 344 parts In-Stock

1+ parts

$14.374

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$12.937

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344

$14.374

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$12.937

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AZTECH Wire

Italy . 366 parts In-Stock

1+ parts

$21.550

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366

$21.550

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MKK Technologies

India . 120 parts In-Stock

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$27.030

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120

$27.030

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DigiPath Technology Company

USA . 120 parts In-Stock

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$27.030

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120

$27.030

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Component Stockers USA

USA . 757 parts In-Stock

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$99.990

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757

$99.990

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Corphita

USA . 1,010 parts In-Stock

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1,010

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Parana Technologies

USA . 862 parts In-Stock

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$17.186

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$17.186

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock unparalleled versatility with the 74VHCT273ATTR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This 8-bit latch delivers outstanding performance for your digital designs, featuring a robust operating temperature range and superior signal integrity. Ideal for consumer electronics, automotive systems, and industrial controls, it ensures reliable operation while saving space in compact applications. Elevate your projects with unmatched efficiency and reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface-mount technology enables a compact design and efficient layout, facilitating easier integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, providing better flexibility in layout design.

No. of Bits: 8

An 8-bit capability enables the processing of a wider range of data, enhancing overall performance in applications requiring multi-bit operations.

Nominal Supply Voltage / Vsup: 5V

A standard supply voltage of 5V makes this product compatible with a wide range of devices and systems, ensuring ease of use.

Load Capacitance (CL): 50 pF

A moderate load capacitance provides flexibility in driving and controlling external components, essential for high-speed operations.

Power Supplies (V): 5

Operates on a common power supply, ensuring compatibility with various electronic devices, reducing the need for additional power regulation.

No. of Terminals: 20

With 20 terminals, it offers multiple connection possibilities, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate space-saving in compact electronic designs, ideal for modern applications.

Maximum I(ol): 8 Amp

The ability to handle up to 8 Amps of output current allows it to drive larger loads without requiring additional external components.

Propagation Delay (tpd): 11 ns

A low propagation delay enhances performance in high-speed applications, critical for devices requiring rapid response.

Maximum Operating Temperature: 125 °C

The ability to operate at higher temperatures ensures reliability in demanding environments, suitable for military and industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger is commonly used in digital circuits, ensuring reliable synchronization in communication and processing.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product is suitable for use in extreme conditions, expanding its application range.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The quality terminal finish enhances conductivity and prevents corrosion, ensuring reliable long-term performance.

Terminal Position: DUAL

The dual terminal position aids in effective layout design, making the device easy to mount on printed circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with space-constrained designs while simplifying integration into various applications.

Width: 4.4 mm

A compact width allows for denser circuit designs, promoting miniaturization in electronics.

Output Polarity: TRUE

True output polarity simplifies integration with other components, ensuring predictable performance in digital circuits.

Minimum Supply Voltage (Vsup): 4.5V

A low minimum supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

A well-defined reflow profile ensures reliable soldering processes, crucial for high-quality assembly.

Peak Reflow Temperature: 260 °C

Capabilities to withstand high peak reflow temperatures increase durability during manufacturing processes.

Length: 6.5 mm

The compact length further facilitates space-efficient designs, ideal for modern electronics.

Temperature Grade: MILITARY

Rated for military-grade use, ensuring robustness and reliability in critical applications where performance is paramount.

Maximum Frequency At Nominal Supply: 45000000 Hz

A high maximum frequency enables fast data processing and communication, ideal for demanding digital applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull-wing terminals ensure secure surface-mount placement while simplifying assembly and rework processes.

Terminal Pitch: 0.65 mm

An optimized terminal pitch allows for compact design layouts while ensuring manufacturability and soldering ease.

Minimum fmax: 65 MHz

A minimum frequency of 65 MHz enhances processing capability, suitable for applications demanding rapid data manipulation.

Maximum Supply Voltage (Vsup): 5.5V

A slightly higher maximum supply voltage offers flexibility in power supply options while ensuring compatibility.

Technical Specifications

Latches & Flip-Flops 74VHCT273ATTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

65 MHz

Trade Compliance

74VHCT273ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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