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74VHCT273AMTR

STMicroelectronics

74VHCT273AMTR by STMicroelectronics

74VHCT273AMTR by STMicroelectronics is an 8-bit CMOS latch with a 5V supply, featuring a fast propagation delay of just 11 ns. It operates in extreme temperatures from -55 °C to 125°C and supports frequencies up to 45 MHz. Ideal for military applications, it comes in a compact SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,288 parts In-Stock

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Anansix

USA . 2,023 parts In-Stock

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Digiode

USA . 644 parts In-Stock

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Native Components

USA . 815 parts In-Stock

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$0.995

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815

$0.995

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Northwest PG Solutions

USA . 451 parts In-Stock

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$1.095

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451

$1.095

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AZTECH Wire

Italy . 1,067 parts In-Stock

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$18.180

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Microchip USA

USA . 497 parts In-Stock

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$25.257

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IDEA Electronic Components Group

UK . 1,495 parts In-Stock

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$29.478

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$26.530

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MKK Technologies

India . 881 parts In-Stock

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$55.431

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DigiPath Technology Company

USA . 881 parts In-Stock

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$55.431

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881

$55.431

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Ampacity Inc.

Singapore . 1,217 parts In-Stock

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$62.000

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Parana Technologies

USA . 1,888 parts In-Stock

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$35.245

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Corphita

USA . 1,516 parts In-Stock

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Overview

Elevate your designs with the 74VHCT273AMTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance latch delivers exceptional reliability and speed, making it ideal for applications ranging from automotive to industrial control. With its compact, surface-mount design and robust temperature tolerance, you can count on seamless integration and energy efficiency. Choose STMicroelectronics for unparalleled quality and unmatched value in every bit!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good durability and thermal stability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplified manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, facilitating easy integration into designs.

No. of Bits: 8

An 8-bit configuration allows for handling a significant amount of data, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5V makes it compatible with standard digital logic and power supplies.

Load Capacitance (CL): 50 pF

A low load capacitance enhances the speed and efficiency of the device, allowing for rapid signal switching.

Power Supplies (V): 5

Power supply requirements are consistent, which simplifies power management in circuit designs.

No. of Terminals: 20

With 20 terminals, it provides ample connectivity options for complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, ideal for space-constrained applications.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amp allows for powering larger loads directly through the latch/flip-flop.

Propagation Delay (tpd): 11 ns

A propagation delay of just 11 ns contributes to faster signal processing, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in harsh environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering improves signal integrity and timing synchronization in digital circuits.

Minimum Operating Temperature: -55 °C

Extreme low temperature operation ensures functionality in cold environments, making it versatile for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and ensures reliable electrical performance over time.

Terminal Position: DUAL

Dual terminal position design enhances layout flexibility on PCB designs, allowing for varied component placements.

Maximum Seated Height: 2.65 mm

Low seated height offers more flexibility in low-profile applications.

Width: 7.5 mm

A narrow width provides more space for other components on a compact PCB.

Output Polarity: TRUE

True output polarity aligns with typical design requirements for digital logic compatibility.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage increases design flexibility for varied power sources.

Length: 12.8 mm

The length is suitable for compact layouts, providing versatility in design implementations.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure robustness and reliability for critical application areas.

Maximum Frequency At Nominal Supply: 45000000 Hz

A high maximum frequency allows for high-speed applications, making the product suitable for advanced digital circuits.

Technology: CMOS

CMOS technology enables low power consumption, making it energy-efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and improve mechanical strength on PCB surfaces.

Packing Method: TR

Tape and reel packaging streamlines automated assembly processes, enhancing production efficiency.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for denser packing of components on the PCB without compromising ease of solderability.

Minimum fmax: 65 MHz

The ability to operate at a minimum frequency of 65 MHz ensures the product can handle a wide range of signal frequencies.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides safety margins for voltage fluctuations, ensuring device reliability.

Technical Specifications

Latches & Flip-Flops 74VHCT273AMTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

65 MHz

Trade Compliance

74VHCT273AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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