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74VHCT04ATTR

STMicroelectronics

74VHCT04ATTR by STMicroelectronics

74VHCT04ATTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 8.5 ns, operating at a nominal voltage of 5V. It features six functions in a compact 14-terminal package, ideal for military applications. With a max temp of 125 °C and load capacitance of 50 pF, it ensures reliable performance.

Median Price

$0.130

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,900 parts In-Stock

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$0.130

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4,900

$0.130

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Chip1Stop

Japan . 4,945 parts In-Stock

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4,945

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Verical

USA . 4,900 parts In-Stock

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$0.130

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4,900

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$0.130

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Distributors (In-Stock)

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Digiode

USA . 4,031 parts In-Stock

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$0.122

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4,031

$0.122

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Flip Electronics

USA . 56,400 parts In-Stock

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56,400

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Vyrian

USA . 8,452 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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J2 Sourcing AB

Sweden . 364 parts In-Stock

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364

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Anansix

USA . 283 parts In-Stock

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Corphita

USA . 4,399 parts In-Stock

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$0.115

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4,399

$0.115

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AZTECH Wire

Italy . 350 parts In-Stock

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$14.560

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350

$14.560

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IDEA Electronic Components Group

UK . 1,618 parts In-Stock

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$27.533

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$24.780

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1,618

$27.533

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$24.780

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MKK Technologies

India . 2,035 parts In-Stock

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$51.774

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$51.774

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DigiPath Technology Company

USA . 2,035 parts In-Stock

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$51.774

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$51.774

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Kepictronics

USA . 5,493 parts In-Stock

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Microchip USA

USA . 5,031 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Electronic Sources GmbH

Germany . 1,516 parts In-Stock

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Northwest PG Solutions

USA . 862 parts In-Stock

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Native Components

USA . 851 parts In-Stock

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Parana Technologies

USA . 228 parts In-Stock

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$32.920

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Overview

Unlock exceptional performance with the 74VHCT04ATTR from STMicroelectronics. Renowned for its reliability and precision, this CMOS logic gate is perfect for a range of applications, from consumer electronics to industrial systems. With rapid propagation delays and a compact design, it ensures seamless integration and efficient operation while saving space on your PCB. Trust in ST's commitment to quality and innovation—empower your projects with unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this logic gate enables faster switching speeds, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact board designs, facilitating easier placement and reducing manufacturing costs.

No. of Functions: 6

Offering multiple functions in a single package enhances versatility, allowing for more complex circuits without needing additional components.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs and aligns well with most layout designs.

Nominal Supply Voltage / Vsup (V): 5

Designed for a nominal voltage of 5V, this logic gate is compatible with standard digital circuits, making it widely applicable.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for stable operation without excessive power consumption, making it ideal for various applications.

Power Supplies (V): 5

Operating with a single 5V supply simplifies circuit design and implementation.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for various applications, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design help in space-constrained applications, allowing for high-density board designs.

Maximum I (ol): 8 Amp

An output current capacity of 8 Amps makes this product suitable for driving various loads directly.

Propagation Delay (tpd): 8.5 ns

This spec confirms the fast operational performance, crucial for high-frequency digital applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in extreme conditions, ideal for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The wide temperature range allows for use in harsh environments, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

The dual terminal position facilitates easier soldering and ensures proper alignment on the PCB.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for compact designs and reduces the overall profile of the circuit.

Width: 4.4 mm

The compact width allows the logic gate to fit into smaller spaces, perfect for densely packed designs.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage close to the nominal level, this product ensures reliable performance in various power conditions.

Length: 5 mm

The short length contributes to a compact footprint, which is essential for modern, space-efficient designs.

Temperature Grade: MILITARY

Being rated for military temperature grades confirms its reliability and durability under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form enhances solder joint reliability and is widely accepted in surface mount technology.

Packing Method: TR

Taped and reeled packing method facilitates automated handling and reduces assembly time in production environments.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is standard for many applications, ensuring compatibility with common PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum of 5.5V provides flexibility in power supply choices while ensuring stable operation.

Technical Specifications

Logic Gates 74VHCT04ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCT04ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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