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74VHC244TTR

STMicroelectronics

74VHC244TTR by STMicroelectronics

74VHC244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, operating b/w 2-5.5 V. It features 3-state outputs and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed data transmission in compact applications.

Median Price

$0.145

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 257 parts In-Stock

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$0.145

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$0.145

Distributors (In-Stock)

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Digiode

USA . 3,677 parts In-Stock

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$0.580

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3,677

$0.580

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Vyrian

USA . 3,122 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,936 parts In-Stock

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Bristol Electronics

USA . 1,936 parts In-Stock

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$0.383

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$0.153

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1,936

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$0.383

$0.153

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Dan-Mar Components

USA . 1,936 parts In-Stock

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Anansix

USA . 1,376 parts In-Stock

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Legend Electronics Inc.

USA . 100 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 140 parts In-Stock

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$0.235

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140

$0.235

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Corphita

USA . 2,567 parts In-Stock

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$0.549

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2,567

$0.549

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Andel Nordic

Denmark . 3,300 parts In-Stock

1+ parts

$2.780

100+ parts

-

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$2.669

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$2.669

3,300

$2.780

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$2.669

$2.669

Native Components

USA . 19 parts In-Stock

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$15.060

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19

$15.060

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$15.676

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$14.265

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$12.854

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$15.676

$14.265

$12.854

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IDEA Electronic Components Group

UK . 2,231 parts In-Stock

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$16.326

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$14.694

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2,231

$16.326

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$14.694

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Northwest PG Solutions

USA . 769 parts In-Stock

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$16.566

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$14.909

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769

$16.566

$14.909

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MKK Technologies

India . 1,736 parts In-Stock

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$30.701

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$30.701

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DigiPath Technology Company

USA . 1,736 parts In-Stock

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$30.701

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1,736

$30.701

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Component Stockers USA

USA . 249 parts In-Stock

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$99.990

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$99.990

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Perfect Parts

USA . 13,552 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,546 parts In-Stock

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Microchip USA

USA . 7,848 parts In-Stock

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Parana Technologies

USA . 993 parts In-Stock

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$19.521

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993

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$19.521

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Speed Components Ltd (Excess)

Israel . 96 parts In-Stock

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GreenTree Electronics

Israel . 93 parts In-Stock

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Kepictronics

USA . 56 parts In-Stock

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Overview

Elevate your design with the 74VHC244TTR from STMicroelectronics, a leader in quality and innovation. This robust bus driver and transceiver offers exceptional performance with ultra-fast propagation delays, ensuring efficient data handling for high-speed applications. Ideal for automotive, industrial, and consumer electronics, it promises reliability even in extreme conditions. Trust ST's commitment to excellence and experience unmatched value that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable package material ensures reliability and longevity in various environments.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay enhances the speed of data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

No. of Functions: 2

Dual functionality reduces component count and saves board space while increasing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization, making it a great fit for various applications.

No. of Bits: 4

The 4-bit configuration allows for efficient data transfer, suitable for a range of communication tasks.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage of 3.3V makes it compatible with a wide range of digital logic systems.

Power Supplies (V): 2/5.5

Versatile power supply range accommodates a variety of operational needs and enhances compatibility.

No. of Terminals: 20

A robust terminal configuration allows for flexible connectivity options and supports diverse circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable high-density applications, ideal for space-constrained designs.

Maximum I (ol): 8 Amp

High output current capability supports demanding power applications, ensuring device robustness.

Propagation Delay (tpd): 13.5 ns

A competitive propagation delay allows for efficient signal switching, critical in fast-paced electronics.

Maximum Operating Temperature: 125 °C

High maximum operating temperature rating ensures reliable performance in extreme environments.

Output Characteristics: 3-STATE

3-state output capability supports versatile bus configurations, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

Excellent low-temperature performance ensures operation in harsh environments, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish ensures superior conductivity and resistance to corrosion, highly beneficial for reliability.

Terminal Position: DUAL

Dual terminal positioning provides options for effective PCB layout and simplifies assembly.

No. of Ports: 2

Two ports allow for simultaneous connections, increasing the product's versatility and efficiency.

Maximum Seated Height: 1.2 mm

A low seated height is ideal for compact designs, ensuring compatibility with space-restricted applications.

Width: 4.4 mm

Slim width facilitates integration into tight layouts, making it a practical choice for small devices.

Output Polarity: TRUE

True output polarity ensures consistent signal integrity in logic applications, supporting reliable operation.

Minimum Supply Voltage (Vsup): 2 V

Versatile voltage range starting at 2V allows for a wider range of operational configurations.

Length: 6.5 mm

A compact length contributes to the product's suitability for modern, space-efficient electronics.

Temperature Grade: MILITARY

Designed to military specifications, this product is built for harsh conditions and high-reliability applications.

Technology: CMOS

CMOS technology ensures low power consumption, making this product efficient and ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering surfaces for enhanced mechanical stability and electrical performance.

Packing Method: TR

Tape and reel packing makes it easy for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A compact terminal pitch supports high-density layouts, crucial in contemporary electronics design.

Control Type: ENABLE LOW

Low enable control type simplifies design logic and enhances protection against accidental activation.

Maximum Supply Voltage (Vsup): 5.5 V

Accommodating up to 5.5V ensures compatibility with various voltage systems, providing operational flexibility.

Technical Specifications

Bus Driver & Transceivers 74VHC244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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