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74VHC244MTR

STMicroelectronics

74VHC244MTR by STMicroelectronics

74VHC244MTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, supporting dual 4-bit functions. It operates b/w 2-5.5 V and features a compact SO package, ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,607 parts In-Stock

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6,607

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Pegasus Components GmbH

Germany . 4,000 parts In-Stock

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4,000

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Digiode

USA . 2,298 parts In-Stock

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2,298

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Anansix

USA . 721 parts In-Stock

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721

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Distributors (Availability)

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Native Components

USA . 929 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

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$0.052

929

$0.054

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$0.052

Andel Nordic

Denmark . 3,720 parts In-Stock

1+ parts

$3.478

100+ parts

-

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$3.338

10k+ parts

$3.338

3,720

$3.478

-

$3.338

$3.338

Microchip USA

USA . 440 parts In-Stock

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$9.606

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440

$9.606

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AZTECH Wire

Italy . 1,009 parts In-Stock

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$11.700

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1,009

$11.700

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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$12.789

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500

$12.789

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IDEA Electronic Components Group

UK . 2,120 parts In-Stock

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$30.755

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$27.679

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2,120

$30.755

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$27.679

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MKK Technologies

India . 1,690 parts In-Stock

1+ parts

$57.832

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1,690

$57.832

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DigiPath Technology Company

USA . 1,690 parts In-Stock

1+ parts

$57.832

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1,690

$57.832

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Corphita

USA . 4,364 parts In-Stock

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4,364

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Parana Technologies

USA . 2,149 parts In-Stock

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$36.772

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2,149

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$36.772

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Northwest PG Solutions

USA . 764 parts In-Stock

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764

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Unlock exceptional performance and reliability with the 74VHC244MTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatile applications, this advanced bus driver & transceiver ensures seamless communication and efficient data transfer, making it perfect for both industrial and consumer electronics. With its low power consumption and robust temperature range, you can trust that your designs will thrive in any environment, elevating your projects to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay improves the speed of data transmission, enhancing the overall performance of the system.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards, making PCB assembly easier.

No. of Functions: 2

Having multiple functions in a single package increases versatility and reduces component count in the design.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and can be easily mounted on PCBs, facilitating better layout and design.

No. of Bits: 4

With 4 bits, the product can handle a wider range of data and control signals, enhancing its usability in various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V aligns with modern low-power applications, optimizing energy consumption.

Power Supplies (V): 2/5.5

Supporting a range of supply voltages offers flexibility in design and compatibility with different systems.

No. of Terminals: 20

With 20 terminals, this device provides multiple connection points, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline packages save board space and are increasingly favored in compact electronics.

Maximum I (ol): 8 Amp

The ability to handle up to 8 Amps makes this product suitable for high-current applications, ensuring reliable performance.

Propagation Delay (tpd): 13.5 ns

The low propagation delay allows for quick response times in data transmission, contributing to efficient system operation.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this product can be used in demanding environments without performance degradation.

Output Characteristics: 3-STATE

3-state output functionality provides versatility in signal management, making it ideal for complex digital circuits.

Minimum Operating Temperature: -55 °C

Withstanding low temperatures ensures reliable operation in extreme conditions, making it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and prevents oxidation, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning simplifies layout and provides flexibility in PCB design.

No. of Ports: 2

Having two ports facilitates dual-channel communication, allowing for more complex data transmission setups.

Maximum Seated Height: 2.65 mm

Low seated height helps in maintaining a slim profile for compact designs, fitting into tighter spaces.

Width: 7.5 mm

A compact width makes integration in various PCB layouts easier, ideal for space-constrained applications.

Output Polarity: TRUE

True output polarity is essential for compatibility with a range of digital logic levels in integrated circuits.

Minimum Supply Voltage (Vsup): 2 V

Ability to operate down to 2V allows for greater flexibility in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates compatibility with standard manufacturing processes, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for effective soldering without compromising device integrity.

Length: 12.8 mm

The compact length contributes to efficient use of PCB real estate, making it ideal for smaller electronic devices.

Temperature Grade: MILITARY

Military-grade components ensure reliability and robustness in harsh environments, suitable for critical applications.

Technology: CMOS

CMOS technology provides low static power consumption, making it advantageous for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and testing, ensuring reliable connections in densely populated boards.

Packing Method: TR

Tape and reel packing enables efficient automated assembly processes, speeding up production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between high-density mounting and ease of soldering.

Control Type: ENABLE LOW

Low-enable control type is often preferred for power management in digital circuits, simplifying design.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates suitable handling requirements, ensuring device integrity during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting up to 5.5V supply voltage allows compatibility with a wide range of applications and devices.

Technical Specifications

Bus Driver & Transceivers 74VHC244MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74VHC244MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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