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74VHC20TTR

STMicroelectronics

74VHC20TTR by STMicroelectronics

74VHC20TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 8 ns and operates at supply voltages b/w 2V and 5.5V. It features two functions with four inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,745 parts In-Stock

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5,745

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Cyclops Electronics Ltd

UK . 1,563 parts In-Stock

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1,563

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Anansix

USA . 1,314 parts In-Stock

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1,314

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Digiode

USA . 210 parts In-Stock

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210

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Microchip USA

USA . 352 parts In-Stock

1+ parts

$0.368

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352

$0.368

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AZTECH Wire

Italy . 672 parts In-Stock

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$18.760

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672

$18.760

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IDEA Electronic Components Group

UK . 2,335 parts In-Stock

1+ parts

$21.271

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$19.144

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2,335

$21.271

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$19.144

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MKK Technologies

India . 1,615 parts In-Stock

1+ parts

$39.999

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1,615

$39.999

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DigiPath Technology Company

USA . 1,615 parts In-Stock

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$39.999

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1,615

$39.999

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Component Stockers USA

USA . 615 parts In-Stock

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$99.990

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615

$99.990

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Parana Technologies

USA . 1,896 parts In-Stock

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$25.433

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$25.433

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Northwest PG Solutions

USA . 1,193 parts In-Stock

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Corphita

USA . 736 parts In-Stock

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Native Components

USA . 431 parts In-Stock

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Overview

Unlock unparalleled performance with the 74VHC20TTR from STMicroelectronics, a trusted leader in innovative solutions. This dual 4-input logic gate excels in speed and reliability, making it perfect for high-speed applications across automotive, telecommunications, and industrial automation. Its compact design and robust temperature range ensure seamless integration in demanding environments, delivering exceptional value and efficiency to empower your projects and elevate your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures reliability and durability, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay of 8 ns allows for faster switching speeds, which is crucial for high-performance electronic circuits.

Surface Mount: YES

Surface mount capability enables easy integration into modern PCB designs, saving space and improving manufacturing efficiency.

No. of Functions: 2

Having two functions provides versatility in design, allowing for more complex circuit configurations within a single package.

No. of Inputs: 4

Four inputs allow for greater flexibility in circuit design, accommodating a variety of logic configurations.

Package Shape: RECTANGULAR

The rectangular shape is optimally designed for space-efficient PCB layouts, facilitating easier component placement.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V is ideal for low-power applications, making it compatible with most modern digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps in maintaining signal integrity and reduces power consumption in high-frequency operations.

Power Supplies (V): 2/5.5

The flexible power supply range from 2V to 5.5V provides compatibility with a wide range of circuits and systems.

No. of Terminals: 14

Having 14 terminals allows for more input and output connections, providing versatility for complex circuit integrations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable space on the PCB, making it ideal for compact designs.

Maximum I (ol): 8 Amp

An output current rating of 8 Amps allows this component to drive significant loads, ideal for power-hungry applications.

Propagation Delay (tpd): 11.5 ns

With a propagation delay of 11.5 ns, it enables quick response times for effective signal processing in digital circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C makes this product suitable for demanding environments and industrial applications.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C expands application possibilities in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and facilitates easier soldering processes.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm promotes compact designs and minimizes component footprint on the PCB.

Width: 4.4 mm

A narrow width of 4.4 mm allows for denser packing of components on PCBs, an important feature for modern electronics.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V makes this logic gate ideal for low-power applications.

Length: 5 mm

The compact length of 5 mm ensures that this component fits into tight spaces on circuit boards.

Temperature Grade: MILITARY

Designed to military specifications, this component is robust and reliable for high-stakes applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are easier to solder and provide better mechanical stability, enhancing overall reliability.

Packing Method: TR

The tape and reel (TR) packaging method simplifies handling and inventory management for manufacturers.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density PCB layouts, maximizing available space for other components.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility for various circuit designs while ensuring safety margins.

Technical Specifications

Logic Gates 74VHC20TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC20TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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