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74VHC16240TTR

STMicroelectronics

74VHC16240TTR by STMicroelectronics

74VHC16240TTR by STMicroelectronics is a CMOS bus driver with a 9 ns propagation delay and operates at 3.3 V nominal supply. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in compact applications. Its robust design withstands temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,694 parts In-Stock

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6,694

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Digiode

USA . 3,056 parts In-Stock

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3,056

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Anansix

USA . 2,838 parts In-Stock

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2,838

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Distributors (Availability)

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Andel Nordic

Denmark . 3,522 parts In-Stock

1+ parts

$8.652

100+ parts

-

1k+ parts

$8.306

10k+ parts

$8.306

3,522

$8.652

-

$8.306

$8.306

AZTECH Wire

Italy . 1,169 parts In-Stock

1+ parts

$19.220

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-

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1,169

$19.220

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

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$30.128

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$27.115

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1,556

$30.128

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$27.115

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Microchip USA

USA . 495 parts In-Stock

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$35.793

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495

$35.793

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MKK Technologies

India . 2,314 parts In-Stock

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$56.654

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2,314

$56.654

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DigiPath Technology Company

USA . 2,314 parts In-Stock

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$56.654

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2,314

$56.654

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Corphita

USA . 3,867 parts In-Stock

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3,867

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Parana Technologies

USA . 1,749 parts In-Stock

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$36.023

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1,749

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$36.023

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Perfect Parts

USA . 857 parts In-Stock

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857

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Native Components

USA . 425 parts In-Stock

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$4.219

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425

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$4.219

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Northwest PG Solutions

USA . 127 parts In-Stock

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$4.263

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127

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$4.263

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Overview

Unlock the power of seamless communication with the 74VHC16240TTR from STMicroelectronics. This high-performance bus driver and transceiver delivers exceptional speed and reliability, making it perfect for a wide range of applications, from industrial automation to consumer electronics. With ST's commitment to quality and innovation, you can trust this robust device to enhance efficiency and connectivity in your designs. Experience superior performance and gain a competitive edge today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures robust protection and durability required in various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay enhances data transmission speed, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of assembly in modern electronics.

No. of Functions: 4

Having multiple functions provides flexibility and versatility for various circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, allowing for high-density layouts.

No. of Bits: 4

A 4-bit bus driver enables efficient communication across multiple channels, ideal for complex data handling.

Nominal Supply Voltage / Vsup (V): 3.3

This nominal voltage supports low-power applications, helping to improve overall energy efficiency.

Power Supplies (V): 2/5.5

Flexible power supply options cater to a range of application requirements, enhancing compatibility.

No. of Terminals: 48

A higher number of terminals allows for more connections and expands design possibilities in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This packing style is ideal for space-constrained applications, making it suitable for portable devices.

Maximum I (ol): 8 Amp

The high output current capability supports robust performance in power-intensive applications.

Propagation Delay (tpd): 13.5 ns

The low propagation delay ensures minimal signal degradation, providing reliable and quick data transfer.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes this product suitable for demanding environments and applications.

Output Characteristics: 3-STATE

3-state output allows devices to communicate effectively on shared data buses without conflict.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and increases product reliability over time.

Terminal Position: DUAL

Dual terminal positioning optimizes layout flexibility and eases integration into various designs.

No. of Ports: 2

Two ports allow for simultaneous connections and enhance functionality in multi-channel applications.

Maximum Seated Height: 1.2 mm

The low height helps maintain a slim profile in compact assemblies, ideal for space-sensitive designs.

Width: 6.1 mm

This width offers a great balance between performance and ease of integration into compact circuits.

Output Polarity: INVERTED

Inverted output polarity can simplify design requirements in certain applications, providing design flexibility.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate at low supply voltages enhances energy efficiency in battery-powered devices.

Length: 12.5 mm

The compact length contributes to the overall space-saving design, making it suitable for tight configurations.

Temperature Grade: MILITARY

This military-grade component meets stringent reliability standards, making it suitable for critical applications.

Technology: CMOS

Using CMOS technology allows for lower power consumption and increased performance efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering, enhancing assembly reliability.

Packing Method: TR

Tape and reel packaging supports automated assembly processes, facilitating high-volume production.

Terminal Pitch: 0.5 mm

A smaller terminal pitch enables more compact PCB designs, allowing more features in a smaller footprint.

Control Type: ENABLE LOW

Low enable control simplifies activation and can help minimize power consumption when not in use.

Maximum Supply Voltage (Vsup): 5.5 V

This maximum supply voltage allows for compatibility with various power sources in diverse applications.

Technical Specifications

Bus Driver & Transceivers 74VHC16240TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VHC16240TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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