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74VHC14TTR

STMicroelectronics

74VHC14TTR by STMicroelectronics

74VHC14TTR by STMicroelectronics is a CMOS logic gate with 6 functions, featuring a propagation delay of 12 ns at 3.3V supply voltage. It has Schmitt Trigger functionality and operates in temperatures ranging from -55 to 125 °C. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 7,218 parts In-Stock

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R&J Components

USA . 5,000 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Dan-Mar Components

USA . 2,500 parts In-Stock

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EMSNET

USA . 2,009 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,272 parts In-Stock

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Anansix

USA . 1,232 parts In-Stock

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Digiode

USA . 324 parts In-Stock

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PC Components Company LLC

USA . 76 parts In-Stock

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AZTECH Wire

Italy . 705 parts In-Stock

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$9.970

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$9.970

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IDEA Electronic Components Group

UK . 2,181 parts In-Stock

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$21.248

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$19.123

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Native Components

USA . 729 parts In-Stock

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$35.497

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$34.077

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Northwest PG Solutions

USA . 1,093 parts In-Stock

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$39.047

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MKK Technologies

India . 1,016 parts In-Stock

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$39.956

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DigiPath Technology Company

USA . 1,016 parts In-Stock

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Component Stockers USA

USA . 524 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 4,635 parts In-Stock

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Corphita

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Microchip USA

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Assy Fe

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Parana Technologies

USA . 1,382 parts In-Stock

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$25.406

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Overview

Upgrade your electronic designs with the 74VHC14TTR by STMicroelectronics, a high-quality Logic Gate that offers fast propagation delay and low power consumption. Manufactured by STMicroelectronics, a trusted name in the industry, this product is perfect for applications requiring precise signal processing and timing control. With its reliable performance and compact design, the 74VHC14TTR provides exceptional value and benefits to customers looking to optimize their circuits. Experience the advantages of STMicroelectronics technology and enhance your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable, lightweight, and resistant to heat and moisture, making it suitable for a variety of environments.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay ensures fast response times, making this product ideal for time-critical applications.

Surface Mount: YES

Surface mount packaging allows for easy installation on printed circuit boards, saving space and enabling efficient production processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, making it compatible with a wide range of systems and devices.

No. of Terminals: 14

With a sufficient number of terminals, this product offers flexibility in connectivity options and enables complex circuit designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in demanding conditions without risking damage or malfunction.

Schmitt Trigger: YES

Schmitt trigger input ensures a hysteresis effect, making the circuit less susceptible to noise and providing a cleaner output signal.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels, enhancing the overall efficiency of the product.

Technical Specifications

Logic Gates 74VHC14TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC14TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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