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74VHC126TTR

STMicroelectronics

74VHC126TTR by STMicroelectronics

74VHC126TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, operating b/w 2-5.5 V. It features 4 functions in a compact 14-terminal package, ideal for high-speed data transmission in military applications. Its robust design supports temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,825 parts In-Stock

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8,825

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Anansix

USA . 2,472 parts In-Stock

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2,472

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Digiode

USA . 2,120 parts In-Stock

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2,120

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,291 parts In-Stock

1+ parts

$3.386

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1,291

$3.386

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Andel Nordic

Denmark . 316 parts In-Stock

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$3.525

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-

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$3.384

10k+ parts

$3.384

316

$3.525

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$3.384

$3.384

AZTECH Wire

Italy . 1,196 parts In-Stock

1+ parts

$8.300

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1,196

$8.300

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IDEA Electronic Components Group

UK . 868 parts In-Stock

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$10.425

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$9.383

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868

$10.425

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$9.383

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MKK Technologies

India . 719 parts In-Stock

1+ parts

$19.604

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719

$19.604

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DigiPath Technology Company

USA . 719 parts In-Stock

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$19.604

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719

$19.604

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Kepictronics

USA . 5,500 parts In-Stock

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Microchip USA

USA . 4,523 parts In-Stock

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4,523

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Corphita

USA . 4,293 parts In-Stock

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Parana Technologies

USA . 1,775 parts In-Stock

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$12.465

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$12.465

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Native Components

USA . 519 parts In-Stock

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$2.986

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519

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$2.986

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Overview

Elevate your designs with the 74VHC126TTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance bus driver and transceiver offers unmatched reliability and speed, ensuring seamless communication across your applications. With its compact design and robust temperature range, it’s perfect for automotive, industrial, and consumer electronics. Choose STMicroelectronics for quality that drives success, delivering efficiency and peace of mind to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and reliability, making it suitable for various applications in harsh environments.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this product enables high-speed data transmission, making it ideal for time-sensitive applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and facilitates automated manufacturing processes.

No. of Functions: 4

Having multiple functions in one device increases design flexibility and reduces overall component count in applications.

Package Shape: RECTANGULAR

The rectangular shape offers streamlined layout options, optimizing space on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common nominal supply voltage of 3.3V makes it compatible with a wide range of digital systems.

Power Supplies (V): 2/5.5

The ability to operate with a wide range of power supplies enhances the versatility and applicability of the product.

No. of Terminals: 14

With 14 terminals, it provides ample connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim profile and shrink pitch design enable compact placements on PCBs, ideal for space-constrained applications.

Maximum I (ol): 8 Amp

This high output current rating is perfect for driving larger loads, making it suitable for heavy-duty applications.

Propagation Delay (tpd): 13 ns

With a propagation delay of only 13 ns, it ensures swift signal processing, which is crucial for high-speed communications.

Maximum Operating Temperature: 125 °C

A high operating temperature rating allows the device to function reliably in extreme conditions, suitable for MIL-grade applications.

Output Characteristics: 3-STATE

3-state output enables more efficient communication lines by allowing multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

This low temperature capability ensures performance stability in extremely cold environments, ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances conductivity and solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position increases design flexibility regarding placement and routing on PCBs.

No. of Ports: 2

Two ports allow for simultaneous data handling, enhancing communication capabilities in networked systems.

Maximum Seated Height: 1.2 mm

A low seated height facilitates integration into compact designs, ensuring compatibility with low-profile devices.

Width: 4.4 mm

An optimal width enables flexibility in board layout and component selection during design.

Output Polarity: TRUE

With true output polarity, this device ensures correct logic level representation, enhancing system integrity.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V allows for power efficiency in low-voltage applications.

Length: 5 mm

A compact length supports more efficient layout options on PCBs without compromising performance.

Temperature Grade: MILITARY

Designed to meet military specifications, this product is reliable in critical and demanding applications.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting, ensuring reliable connections in surface mount applications.

Packing Method: TR

Trayed packing enhances ease of handling and provides protection during transportation and storage.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for compact placement on PCBs, maximizing component density.

Control Type: ENABLE HIGH

Enable high control type simplifies the design of enable lines and allows for easy integration in control systems.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for flexibility in power supply options while ensuring operational safety.

Technical Specifications

Bus Driver & Transceivers 74VHC126TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC126TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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