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74VHC03MTR

STMicroelectronics

74VHC03MTR by STMicroelectronics

74VHC03MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 8.5 ns and operates at supply voltages from 2 to 5.5 V. It features four functions with open-drain outputs, ideal for high-speed applications in compact designs. Its robust temperature range (-55 °C to 125°C) ensures reliability in military environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,738 parts In-Stock

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5,738

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Digiode

USA . 4,899 parts In-Stock

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4,899

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Anansix

USA . 2,442 parts In-Stock

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2,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,261 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,261

$5.000

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IDEA Electronic Components Group

UK . 1,248 parts In-Stock

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$14.009

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-

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$12.608

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1,248

$14.009

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$12.608

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Microchip USA

USA . 119 parts In-Stock

1+ parts

$14.461

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119

$14.461

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AZTECH Wire

Italy . 652 parts In-Stock

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$17.430

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652

$17.430

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MKK Technologies

India . 271 parts In-Stock

1+ parts

$26.343

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271

$26.343

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DigiPath Technology Company

USA . 271 parts In-Stock

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$26.343

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271

$26.343

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Corphita

USA . 4,439 parts In-Stock

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4,439

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Northwest PG Solutions

USA . 1,293 parts In-Stock

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1,293

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Native Components

USA . 316 parts In-Stock

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316

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Parana Technologies

USA . 81 parts In-Stock

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$16.750

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81

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$16.750

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Overview

Unlock the potential of your designs with the 74VHC03MTR from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile logic gate that enhances performance in various applications. With its rapid response time and robust reliability, this surface-mount device is perfect for both industrial and consumer electronics. Elevate your projects with the precision and durability of ST's cutting-edge technology, ensuring seamless operation and lasting value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it ideal for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay allows for faster switching speeds, enhancing the performance of high-speed digital circuits.

Surface Mount: YES

Surface mount technology enables compact designs and easier PCB assembly, saving space and reducing manufacturing costs.

No. of Functions: 4

Offering multiple functions increases versatility, allowing users to implement more complex logic without additional components.

No. of Inputs: 2

With two inputs, it provides straightforward integration into existing systems while handling basic logical operations efficiently.

Package Shape: RECTANGULAR

The rectangular shape is efficient for PCB layout, optimizing space and design flexibility.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V is highly suitable for modern digital systems, ensuring compatibility with low-power applications.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable operation in various loads, making it reliable for different applications.

Power Supplies (V): 2/5.5

Supporting a range of supply voltages enhances flexibility, allowing this product to be used in various circuits.

No. of Terminals: 14

The 14 terminals provide ample connections for functionalities, ensuring comprehensive integration options.

Package Style (Meter): SMALL OUTLINE

The small outline package means less space on the PCB, promoting compact design solutions.

Maximum I (ol): 8 Amp

Handling up to 8 Amps allows the device to manage substantial loads, ideal for powerful applications.

Propagation Delay (tpd): 13 ns

A propagation delay of 13 ns improves overall circuit response time, enhancing performance in high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it ensures reliable performance even in challenging thermal environments.

Output Characteristics: OPEN-DRAIN

Open-drain output is perfect for wired-OR configurations and interfacing with different voltage levels.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this product suitable for extreme conditions, ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finishes enhance solderability and corrosion resistance, ensuring reliability over time.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility on the PCB, accommodating various designs.

Maximum Seated Height: 1.75 mm

The low seated height ensures a slim profile on PCBs, enabling compact designs.

Width: 3.9 mm

A compact width supports high-density PCB layouts, allowing more components in a limited area.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate down to 2V enhances versatility for low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 40

A reasonable reflow time ensures compatibility with standard soldering processes, promoting reliable manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility means it can withstand soldering processes without damaging the device.

Length: 8.65 mm

A compact length contributes to overall small form-factor designs, making it suitable for space-constrained applications.

Temperature Grade: MILITARY

Designed to military standards, this product guarantees performance in the most demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and enhance surface mounting capabilities.

Packing Method: TR

Tape and reel packing supports automated assembly, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch allows for flexible PCB layout options while ensuring reliable connections.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting up to 5.5V expands its usability across a wide range of digital circuits.

Technical Specifications

Logic Gates 74VHC03MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHC03MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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