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74VCXH16374TTR

STMicroelectronics

74VCXH16374TTR by STMicroelectronics

74VCXH16374TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3.5 ns, supporting up to 8 bits and operating at voltages b/w 2.3V and 3.6V. Its compact design features a thin profile for space-constrained applications. Ideal for high-speed data transmission in military-grade environments, it operates efficiently at temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,716 parts In-Stock

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2,716

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Anansix

USA . 2,041 parts In-Stock

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2,041

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Vyrian

USA . 2,004 parts In-Stock

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2,004

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Distributors (Availability)

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Native Components

USA . 432 parts In-Stock

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$1.260

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432

$1.260

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Northwest PG Solutions

USA . 903 parts In-Stock

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$1.386

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903

$1.386

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Andel Nordic

Denmark . 2,947 parts In-Stock

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$5.528

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$5.307

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$5.307

2,947

$5.528

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$5.307

$5.307

AZTECH Wire

Italy . 66 parts In-Stock

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$11.890

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66

$11.890

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

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$25.679

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$23.111

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$25.679

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$23.111

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MKK Technologies

India . 1,899 parts In-Stock

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$48.288

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1,899

$48.288

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DigiPath Technology Company

USA . 1,899 parts In-Stock

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$48.288

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1,899

$48.288

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Corphita

USA . 3,226 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,104 parts In-Stock

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Microchip USA

USA . 2,967 parts In-Stock

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Parana Technologies

USA . 1,292 parts In-Stock

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$30.703

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$30.703

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Overview

Elevate your designs with the 74VCXH16374TTR from STMicroelectronics, a premier choice for high-speed bus driving and data transceivers. Combining cutting-edge technology with exceptional reliability, this device is perfect for demanding applications in automotive, industrial, and communication systems. Enjoy faster signal integrity, reduced power consumption, and robust performance that empowers your innovations while ensuring long-lasting quality and support from a global leader in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making the product suitable for a range of environmental conditions.

Propagation Delay At Nominal Supply: 3.5 ns

A low propagation delay allows for faster data transmission speeds, enhancing performance in high-speed applications.

Surface Mount: YES

Surface mount technology enables compact designs, saving space on PCBs and facilitating automated assembly.

No. of Functions: 2

Having two functions improves versatility, making it suitable for multiple applications without the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, facilitating efficient circuit design.

No. of Bits: 8

An 8-bit architecture allows for processing of a wide range of data sizes, suitable for various digital applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5 V ensures energy efficiency and compatibility with low-power digital systems.

Load Capacitance (CL): 30 pF

Low load capacitance enhances signal integrity and allows for faster switching speeds, improving overall performance.

Power Supplies (V): 3.3

Supports 3.3V power supply, conforming to common standards for modern digital circuits.

No. of Terminals: 48

A higher number of terminals facilitates multiple connections, increasing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile design saves space while allowing for high-density mounting solutions.

Maximum I (ol): 24 Amp

Capable of supporting high output currents, ideal for driving larger loads without compromising performance.

Propagation Delay (tpd): 4.7 ns

Quick propagation delay helps maintain high data transfer speeds, making this device suitable for fast applications.

Maximum Operating Temperature: 125 °C

High operating temperature threshold ensures reliability in extreme conditions, suitable for military and industrial applications.

Output Characteristics: 3-STATE

3-state output feature provides flexibility in interfacing with multiple devices, allowing for efficient data bus management.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures better timing control, improving synchronizations in digital circuits.

Minimum Operating Temperature: -55 °C

Ability to operate in very low temperatures expands its usability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish improves corrosion resistance and enhances the longevity of connections.

Terminal Position: DUAL

Dual terminal position facilitates flexible layout options on PCBs, enhancing design flexibility.

No. of Ports: 2

Multiple ports offer enhanced connectivity, making it suitable for applications requiring data routing.

Maximum Seated Height: 1.2 mm

Low seated height contributes to a slim design profile, essential for space-constrained applications.

Width: 6.1 mm

Compact width allows for efficient integration into tight spaces on PCBs.

Output Polarity: TRUE

True output polarity improves signal compatibility in digital systems.

Minimum Supply Voltage (Vsup): 2.3 V

Flexible voltage range ensures adaptability in various low-voltage applications.

Length: 12.5 mm

Short length aids in maintaining compact designs, particularly in high-density circuits.

Temperature Grade: MILITARY

Military-grade temperature classification ensures optimal performance in challenging conditions.

Maximum Frequency At Nominal Supply: 235000000 Hz

High maximum frequency empowers the device to operate effectively in high-speed applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, beneficial for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and reliable connections, enhancing manufacturing efficiency.

Terminal Pitch: 0.5 mm

Narrow terminal pitch saves space on PCBs, ideal for high-density component placement.

Maximum Supply Voltage (Vsup): 3.6 V

Higher supply voltage support maximizes performance while remaining compatible with many circuits.

Technical Specifications

Bus Driver & Transceivers 74VCXH16374TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

235000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74VCXH16374TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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