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74VCXH16373TTR

STMicroelectronics

74VCXH16373TTR by STMicroelectronics

74VCXH16373TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3.5 ns, supporting dual functions and operating b/w -55 °C to 125°C. It features an 8-bit configuration and operates at supply voltages from 2.3V to 3.6V, ideal for high-speed data applications. Its compact design ensures efficient space utilization in advanced electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,052 parts In-Stock

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3,052

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Vyrian

USA . 2,656 parts In-Stock

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2,656

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Anansix

USA . 137 parts In-Stock

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137

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Distributors (Availability)

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Native Components

USA . 16 parts In-Stock

1+ parts

$1.970

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16

$1.970

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Northwest PG Solutions

USA . 2,128 parts In-Stock

1+ parts

$2.167

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-

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2,128

$2.167

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Andel Nordic

Denmark . 3,130 parts In-Stock

1+ parts

$4.652

100+ parts

-

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$4.465

10k+ parts

$4.465

3,130

$4.652

-

$4.465

$4.465

AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$8.840

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389

$8.840

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

1+ parts

$16.271

100+ parts

-

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$14.644

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1,909

$16.271

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$14.644

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MKK Technologies

India . 2,236 parts In-Stock

1+ parts

$30.597

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2,236

$30.597

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DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$30.597

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2,236

$30.597

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Component Stockers USA

USA . 621 parts In-Stock

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$99.990

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621

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,491 parts In-Stock

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27,491

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Microchip USA

USA . 3,791 parts In-Stock

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3,791

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Parana Technologies

USA . 2,301 parts In-Stock

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$19.455

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$19.455

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Corphita

USA . 1,870 parts In-Stock

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1,870

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Overview

Elevate your designs with the 74VCXH16373TTR from STMicroelectronics, a premier choice in bus driver and transceiver technology. Known for their commitment to quality and innovation, STMicroelectronics delivers unparalleled performance with this compact device, ensuring rapid data transfer and robust operation across diverse applications. Experience enhanced efficiency and reliability that empowers your projects—perfect for automotive, industrial, and consumer electronics. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers excellent resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 3.5 ns

A low propagation delay enhances signal integrity and speed, making this bus driver suitable for high-frequency applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing, which is ideal for modern electronic devices.

No. of Functions: 2

Multiple functions in a single package help reduce component count, simplifying design and saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient space utilization on circuit boards.

No. of Bits: 8

An 8-bit architecture allows for quicker data handling and more complex operations, suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with low-power systems, enhancing energy efficiency.

Load Capacitance (CL): 30 pF

A low load capacitance helps in achieving faster switching speeds, ideal for high-speed data communication.

Power Supplies (V): 3.3

The ability to operate at 3.3V makes this product suitable for a wide range of digital circuits and systems.

No. of Terminals: 48

With 48 terminals, this component can support complex connections and multiple input/output configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline allow for efficient use of space in compact electronic devices.

Maximum I (ol): 24 Amp

A high output current capability of 24 Amps supports demanding applications, ensuring reliable power delivery.

Propagation Delay (tpd): 4.5 ns

With a propagation delay of only 4.5 ns, this product is well-suited for fast-paced data applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates robust performance in challenging environments.

Output Characteristics: 3-STATE

3-state output enables flexible communication between multiple bus systems, enhancing overall versatility.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this product suitable for extreme environments and military applications.

Terminal Finish: TIN LEAD

The tin lead finish provides excellent solderability and reliability, essential for long-lasting connections.

Terminal Position: DUAL

Dual terminal positions increase layout flexibility, allowing for easier integration into various circuit designs.

No. of Ports: 2

Having two ports facilitates communication between more than one system, enhancing functionality.

Maximum Seated Height: 1.2 mm

A low seated height allows for a more compact design in PCBs, contributing to thinner devices.

Width: 6.1 mm

The compact width makes this driver suitable for space-constrained applications without sacrificing performance.

Output Polarity: TRUE

True output polarity ensures predictable performance in digital signal processing, enhancing reliability.

Minimum Supply Voltage (Vsup): 2.3 V

A minimum supply voltage of 2.3V provides flexibility for use in a wider range of systems.

Length: 12.5 mm

The short length is advantageous for fitting within tight spaces in modern electronics.

Temperature Grade: MILITARY

MIL-SPEC temperature grade ensures the product meets rigorous performance standards necessary for military and aerospace applications.

Technology: CMOS

CMOS technology provides high-speed operation combined with low static power consumption, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and are ideal for automated assembly processes.

Packing Method: TR

Tape and reel packaging is optimal for automated assembly and high-volume production, streamlining the manufacturing process.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density layouts, vital for next-generation PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures high functional reliability while allowing compatibility with various power systems.

Technical Specifications

Bus Driver & Transceivers 74VCXH16373TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VCXH16373TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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