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74VCXH162245TTR

STMicroelectronics

74VCXH162245TTR by STMicroelectronics

74VCXH162245TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4 ns, operating b/w 2.3V and 3.6V. It features a compact SO thin profile package and supports bidirectional data flow. Ideal for high-speed communication in military applications, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,752 parts In-Stock

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2,752

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Vyrian

USA . 2,727 parts In-Stock

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2,727

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Digiode

USA . 2,625 parts In-Stock

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2,625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 119 parts In-Stock

1+ parts

$1.000

100+ parts

-

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119

$1.000

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Native Components

USA . 397 parts In-Stock

1+ parts

$1.685

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397

$1.685

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Northwest PG Solutions

USA . 1,668 parts In-Stock

1+ parts

$1.853

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1,668

$1.853

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Andel Nordic

Denmark . 561 parts In-Stock

1+ parts

$5.711

100+ parts

-

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$5.483

10k+ parts

$5.483

561

$5.711

-

$5.483

$5.483

AZTECH Wire

Italy . 167 parts In-Stock

1+ parts

$17.610

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167

$17.610

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IDEA Electronic Components Group

UK . 1,101 parts In-Stock

1+ parts

$17.779

100+ parts

-

1k+ parts

$16.001

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1,101

$17.779

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$16.001

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MKK Technologies

India . 1,033 parts In-Stock

1+ parts

$33.432

100+ parts

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1,033

$33.432

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DigiPath Technology Company

USA . 1,033 parts In-Stock

1+ parts

$33.432

100+ parts

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1,033

$33.432

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Corphita

USA . 4,517 parts In-Stock

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4,517

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Parana Technologies

USA . 2,234 parts In-Stock

1+ parts

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100+ parts

$21.258

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2,234

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$21.258

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Overview

Unlock unparalleled performance with the 74VCXH162245TTR from STMicroelectronics, a trusted leader in high-quality electronic components. Designed for seamless data transmission, this advanced bus driver offers low propagation delay and reliable operation across a broad temperature range, making it perfect for demanding applications. Experience durability and efficiency that enhances your designs—empowering innovation and ensuring optimal performance in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy packaging provides effective protection against environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 4 ns

A low propagation delay ensures faster signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on circuit boards and easier integration in compact designs.

No. of Functions: 2

With two functions, this device can perform multiple tasks, enhancing versatility and reducing component count in designs.

Package Shape: RECTANGULAR

The rectangular shape is standard and promotes ease of layout in PCB designs.

No. of Bits: 8

An 8-bit configuration is suitable for a wide range of data applications, providing a balance between performance and complexity.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V enhances power efficiency, crucial for battery-operated devices.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF allows for effective signal integrity, accommodating a variety of applications.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, this device is well-suited for modern digital circuits.

No. of Terminals: 48

A higher number of terminals provides more connection options, allowing for complex designs and functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space and are ideal for applications where board real estate is limited.

Maximum I (ol): 12 Amp

A high output current capability of 12 Amps makes this product suitable for driving larger loads effortlessly.

Propagation Delay (tpd): 4.9 ns

With a propagation delay of 4.9 ns, the device ensures high-speed performance suitable for fast digital interfaces.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C ensures reliability in demanding environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output characteristics facilitate better signal management in shared bus systems, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

The capability to function at extremely low temperatures makes this product ideal for harsh environments and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, leading to enhanced durability.

Terminal Position: DUAL

Dual terminal positions facilitate easier connectivity and integration into circuit designs.

No. of Ports: 2

Having two ports allows for multi-directional data flow, increasing the utility and flexibility of the device.

Maximum Seated Height: 1.2 mm

A low seated height supports compact PCB designs, making this component suitable for space-constrained applications.

Width: 6.1 mm

A compact width ensures that the product can fit into smaller circuit design layouts smoothly.

Output Polarity: TRUE

True output polarity is standard in many applications, simplifying design and troubleshooting processes.

Minimum Supply Voltage (Vsup): 2.3 V

A low minimum supply voltage of 2.3V ensures compatibility with a range of power supply levels, enhancing flexibility.

Length: 12.5 mm

The compact length aids in optimal space management on PCB designs, particularly in layered assemblies.

Temperature Grade: MILITARY

Rated for military temperature grades, this product guarantees high performance and reliability in extreme environments.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices while maintaining high speeds.

Terminal Form: GULL WING

Gull wing terminals simplify assembly and improve soldering quality, resulting in reliable connections.

Packing Method: TR

Tape and reel packing allows for easier automated assembly and helps in reducing handling damages.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density applications, enhancing connectivity without sacrificing space.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities allow for flexible data processing in dynamic applications.

Control Type: COMMON CONTROL

Common control type simplifies system design and can contribute to reduced complexity in multi-device configurations.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V permits compatibility with various power supply configurations, enhancing flexibility.

Technical Specifications

Bus Driver & Transceivers 74VCXH162245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VCXH162245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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