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74VCX16374TTR

STMicroelectronics

74VCX16374TTR by STMicroelectronics

74VCX16374TTR by STMicroelectronics is a high-speed CMOS bus driver with a propagation delay of just 4.1 ns and operates at supply voltages from 1.8V to 3.6V. It features dual ports for efficient data transfer and supports up to 235 MHz frequency, ideal for military applications. Its compact design ensures reliable performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,739 parts In-Stock

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7,739

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Digiode

USA . 1,840 parts In-Stock

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1,840

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Anansix

USA . 799 parts In-Stock

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799

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Prism Electronics

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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AZTECH Wire

Italy . 1,096 parts In-Stock

1+ parts

$8.010

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1,096

$8.010

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Native Components

USA . 156 parts In-Stock

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$11.293

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156

$11.293

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Andel Nordic

Denmark . 1,872 parts In-Stock

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$11.409

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$10.953

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$10.953

1,872

$11.409

-

$10.953

$10.953

Northwest PG Solutions

USA . 1,694 parts In-Stock

1+ parts

$12.423

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$11.181

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1,694

$12.423

$11.181

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IDEA Electronic Components Group

UK . 596 parts In-Stock

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$27.871

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$25.084

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596

$27.871

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$25.084

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MKK Technologies

India . 1,030 parts In-Stock

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$52.410

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1,030

$52.410

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DigiPath Technology Company

USA . 1,030 parts In-Stock

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$52.410

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$52.410

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QUARKTWIN TECHNOLOGY LTD

USA . 28,445 parts In-Stock

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Perfect Parts

USA . 5,844 parts In-Stock

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Corphita

USA . 4,678 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,505 parts In-Stock

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4,505

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Microchip USA

USA . 4,504 parts In-Stock

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4,504

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Metaverse IC Inc.

Canada . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,377 parts In-Stock

1+ parts

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$33.324

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1,377

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$33.324

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Overview

Unlock the potential of your designs with the 74VCX16374TTR from STMicroelectronics. Renowned for its superior quality and reliability, this advanced bus driver & transceiver offers exceptional performance, ensuring rapid data transmission and efficient power management in a compact form. Ideal for high-speed applications like telecommunications and industrial automation, it provides unmatched value to engineers seeking precision and durability. Elevate your projects with STMicroelectronics’ commitment to innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and resistance to environmental factors, ensuring reliable performance in various applications.

Propagation Delay At Nominal Supply: 4.1 ns

With a low propagation delay, this product enables fast data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible facilitates easy integration into modern compact PCB designs, saving space and reducing assembly costs.

No. of Functions: 2

Having multiple functions allows for versatile applications and improved resource efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient use of PCB space, enhancing layout flexibility.

No. of Bits: 8

An 8-bit configuration provides a good balance of data handling capabilities for many electronic applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5 V helps to reduce power consumption, making it energy-efficient in battery-powered devices.

Load Capacitance (CL): 30 pF

A low load capacitance allows for quick response times and better performance in high-speed data applications.

Power Supplies (V): 3.3

Compatibility with a 3.3 V power supply makes this product suitable for a wide range of digital circuits.

No. of Terminals: 48

A high number of terminals allows for greater connectivity and versatility in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design make it ideal for applications where space is at a premium.

Maximum I (ol): 24 Amp

The ability to handle up to 24 Amps is excellent for high-current applications without compromising performance.

Propagation Delay (tpd): 8 ns

A slightly higher propagation delay than nominal still supports sufficient data transmission speeds for most applications.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes this product suitable for applications in harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance functionality by allowing multiple devices to share the same bus without interference.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides precise timing control crucial for synchronous data communication.

Minimum Operating Temperature: -55 °C

Withstanding extremely low temperatures makes this product reliable in freezing conditions and demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes ensure excellent conductivity and resistance to corrosion, extending the life of the product.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout options and provide flexibility in design.

No. of Ports: 2

Having two ports allows for dual data pathways, enhancing data exchange and operational efficiency.

Maximum Seated Height: 1.2 mm

A low profile design minimizes workflow interruptions and optimizes space on dense circuit boards.

Width: 6.1 mm

A compact width ensures compatibility with space-constrained designs without sacrificing performance.

Output Polarity: TRUE

True output polarity simplifies interfacing with various digital circuits that require standard positive logic levels.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage enhances compatibility with modern low-voltage systems and promotes energy efficiency.

Length: 12.5 mm

A manageable length contributes to versatile deployment options in space-limited applications.

Temperature Grade: MILITARY

The military-grade temperature classification ensures superior reliability and performance under extreme environmental conditions.

Maximum Frequency At Nominal Supply: 235000000 Hz

High frequency capability allows for rapid data processing and enhances overall system performance.

Technology: CMOS

CMOS technology ensures low power consumption, high density, and enhanced performance, making this driver efficient and versatile.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve reliability in electrical connections.

Packing Method: TR

The tray packing method allows for safe and easy handling, ensuring optimal protection during storage and transport.

Terminal Pitch: 0.5 mm

The small terminal pitch supports high-density designs, allowing for more components in a given area, which is crucial for modern electronics.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in design, accommodating a wide array of applications.

Technical Specifications

Bus Driver & Transceivers 74VCX16374TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

235000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74VCX16374TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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